JPWO2022249987A5 - - Google Patents
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- Publication number
- JPWO2022249987A5 JPWO2022249987A5 JP2022566297A JP2022566297A JPWO2022249987A5 JP WO2022249987 A5 JPWO2022249987 A5 JP WO2022249987A5 JP 2022566297 A JP2022566297 A JP 2022566297A JP 2022566297 A JP2022566297 A JP 2022566297A JP WO2022249987 A5 JPWO2022249987 A5 JP WO2022249987A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- encapsulating resin
- composition according
- encapsulating
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 60
- 229920001971 elastomer Polymers 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- 239000011258 core-shell material Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- -1 polysiloxane Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000012792 core layer Substances 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000011164 primary particle Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 235000010215 titanium dioxide Nutrition 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 2
- 229920000800 acrylic rubber Polymers 0.000 claims 2
- 229920003244 diene elastomer Polymers 0.000 claims 2
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021089965 | 2021-05-28 | ||
| JP2021089965 | 2021-05-28 | ||
| PCT/JP2022/020956 WO2022249987A1 (ja) | 2021-05-28 | 2022-05-20 | 封止用樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022249987A1 JPWO2022249987A1 (https=) | 2022-12-01 |
| JP7205680B1 JP7205680B1 (ja) | 2023-01-17 |
| JPWO2022249987A5 true JPWO2022249987A5 (https=) | 2023-05-02 |
Family
ID=84230127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022566297A Active JP7205680B1 (ja) | 2021-05-28 | 2022-05-20 | 封止用樹脂組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12116479B2 (https=) |
| EP (1) | EP4350758B1 (https=) |
| JP (1) | JP7205680B1 (https=) |
| KR (1) | KR102681999B1 (https=) |
| CN (1) | CN117397021B (https=) |
| HU (1) | HUE072619T2 (https=) |
| WO (1) | WO2022249987A1 (https=) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4902732A (en) * | 1985-09-30 | 1990-02-20 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin-based curable compositions |
| DE3689022T2 (de) * | 1985-10-07 | 1994-04-21 | Shinetsu Chemical Co | Epoxyharzzusammensetzung. |
| KR910008562B1 (ko) * | 1988-02-15 | 1991-10-19 | 주식회사 럭키 | 반도체 소자 봉지용 에폭시 수지 조성물 |
| JP2660012B2 (ja) * | 1988-09-13 | 1997-10-08 | 株式会社東芝 | ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置 |
| JP3501905B2 (ja) * | 1996-08-20 | 2004-03-02 | 三菱電機株式会社 | 成形用樹脂組成物並びにそれを用いた高電圧機器用モールド製品およびその製造方法 |
| DE69738783D1 (de) * | 1996-10-08 | 2008-07-31 | Hitachi Chemical Co Ltd | Halbleiteranordnung, halbleiterchipträgersubstrat, herstellungsverfahren für anordnung und substrat, klebstoff und doppelseitiges haftklebeband |
| JPH11343382A (ja) * | 1998-04-01 | 1999-12-14 | Daihachi Chemical Industry Co Ltd | 難燃性樹脂組成物 |
| JP2004018803A (ja) * | 2002-06-20 | 2004-01-22 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2005264037A (ja) | 2004-03-19 | 2005-09-29 | Kyocera Chemical Corp | 封止用エポキシ樹脂組成物と樹脂封止型半導体装置 |
| EP1775631B1 (en) * | 2004-07-22 | 2014-02-12 | Teijin Limited | Screen |
| JP2006243564A (ja) * | 2005-03-04 | 2006-09-14 | Fuji Photo Film Co Ltd | 感光性組成物及び感光性フィルム、並びに、永久パターン及びその形成方法 |
| JP5269728B2 (ja) * | 2009-09-07 | 2013-08-21 | 株式会社日立エレクトリックシステムズ | 高靭性高熱伝導性硬化性樹脂組成物、その硬化物及びモールド電機機器 |
| CN106715580B (zh) * | 2014-09-24 | 2019-11-26 | 住友电木株式会社 | 半导体密封用树脂组合物、半导体装置和结构体 |
| JP2017082027A (ja) * | 2015-10-22 | 2017-05-18 | 信越化学工業株式会社 | フォトカプラー一次封止用熱硬化性エポキシ樹脂組成物 |
| JP2018002923A (ja) * | 2016-07-05 | 2018-01-11 | 京セラ株式会社 | 電子・電気部品の製造方法、射出成形用エポキシ樹脂組成物、および電子・電気部品 |
| JP7009790B2 (ja) * | 2017-06-16 | 2022-01-26 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
| JP7130985B2 (ja) * | 2018-03-01 | 2022-09-06 | 住友ベークライト株式会社 | 封止用樹脂組成物およびパワーモジュール |
| TWI804615B (zh) * | 2018-05-18 | 2023-06-11 | 日商信越化學工業股份有限公司 | 半導體密封用熱固性馬來醯亞胺樹脂組合物及半導體裝置 |
| JP7153413B2 (ja) | 2019-12-04 | 2022-10-14 | 博 小林 | 積層した電磁鋼板の間隙に析出させた酸化マグネシウムないしは酸化アルミニウムからなる微粒子同士の接合を介して電磁鋼板同士を結合させた鉄心を製造する製造方法 |
-
2022
- 2022-05-20 CN CN202280038545.4A patent/CN117397021B/zh active Active
- 2022-05-20 EP EP22811257.9A patent/EP4350758B1/en active Active
- 2022-05-20 US US18/562,020 patent/US12116479B2/en active Active
- 2022-05-20 HU HUE22811257A patent/HUE072619T2/hu unknown
- 2022-05-20 WO PCT/JP2022/020956 patent/WO2022249987A1/ja not_active Ceased
- 2022-05-20 JP JP2022566297A patent/JP7205680B1/ja active Active
- 2022-05-20 KR KR1020237042131A patent/KR102681999B1/ko active Active
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