JP2025013531A5 - - Google Patents
Info
- Publication number
- JP2025013531A5 JP2025013531A5 JP2024194411A JP2024194411A JP2025013531A5 JP 2025013531 A5 JP2025013531 A5 JP 2025013531A5 JP 2024194411 A JP2024194411 A JP 2024194411A JP 2024194411 A JP2024194411 A JP 2024194411A JP 2025013531 A5 JP2025013531 A5 JP 2025013531A5
- Authority
- JP
- Japan
- Prior art keywords
- compression molding
- inorganic filler
- coupling agent
- molding encapsulant
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/035934 WO2021048977A1 (ja) | 2019-09-12 | 2019-09-12 | 圧縮成形用封止材及び電子部品装置 |
| JPPCT/JP2019/035934 | 2019-09-12 | ||
| PCT/JP2020/034575 WO2021049645A1 (ja) | 2019-09-12 | 2020-09-11 | 圧縮成形用封止材及び電子部品装置 |
| JP2021545634A JP7805784B2 (ja) | 2019-09-12 | 2020-09-11 | 圧縮成形用封止材及び電子部品装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021545634A Division JP7805784B2 (ja) | 2019-09-12 | 2020-09-11 | 圧縮成形用封止材及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025013531A JP2025013531A (ja) | 2025-01-24 |
| JP2025013531A5 true JP2025013531A5 (https=) | 2026-04-15 |
Family
ID=74866310
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021545634A Active JP7805784B2 (ja) | 2019-09-12 | 2020-09-11 | 圧縮成形用封止材及び電子部品装置 |
| JP2024194411A Pending JP2025013531A (ja) | 2019-09-12 | 2024-11-06 | 圧縮成形用封止材及び電子部品装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021545634A Active JP7805784B2 (ja) | 2019-09-12 | 2020-09-11 | 圧縮成形用封止材及び電子部品装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12404420B2 (https=) |
| EP (1) | EP4030474A4 (https=) |
| JP (2) | JP7805784B2 (https=) |
| KR (1) | KR20220062006A (https=) |
| CN (1) | CN114402029B (https=) |
| TW (1) | TWI868209B (https=) |
| WO (2) | WO2021048977A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021048977A1 (ja) | 2019-09-12 | 2021-03-18 | 昭和電工マテリアルズ株式会社 | 圧縮成形用封止材及び電子部品装置 |
| US20210257335A1 (en) * | 2020-02-19 | 2021-08-19 | Nanya Technology Corporation | Semiconductor package and method of manufacturing the same |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002069157A (ja) * | 2000-08-24 | 2002-03-08 | Nitto Denko Corp | 半導体封止用樹脂組成物、およびそれを用いた半導体装置、半導体ウエハ、ならびに半導体装置の実装構造 |
| WO2002024808A1 (fr) * | 2000-09-25 | 2002-03-28 | Hitachi Chemical Co., Ltd. | Materiau de moulage de resine epoxy utilise a des fins d'etancheite |
| JP2003213095A (ja) * | 2002-01-29 | 2003-07-30 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2004307649A (ja) | 2003-04-07 | 2004-11-04 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び半導体装置 |
| JP4432381B2 (ja) * | 2003-07-09 | 2010-03-17 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP3811154B2 (ja) * | 2003-11-17 | 2006-08-16 | 京セラケミカル株式会社 | 封止用樹脂組成物および樹脂封止型半導体装置 |
| KR101005994B1 (ko) * | 2005-04-15 | 2011-01-05 | 히다치 가세고교 가부시끼가이샤 | 경화 촉진성 화합물-실리카 복합체, 경화 촉진성화합물-실리카 복합체의 제조 방법, 경화 촉진제, 경화성수지 조성물 및 전자 부품 장치 |
| JP4855329B2 (ja) | 2007-05-08 | 2012-01-18 | Towa株式会社 | 電子部品の圧縮成形方法及び装置 |
| JP2008274080A (ja) | 2007-04-27 | 2008-11-13 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| KR101748897B1 (ko) * | 2009-11-24 | 2017-06-19 | 스미토모 베이클리트 컴퍼니 리미티드 | 유동 특성 측정용 금형, 유동 특성 측정 방법, 반도체 봉지용 수지 조성물 및 반도체 장치의 제조 방법 |
| JP2011246522A (ja) * | 2010-05-24 | 2011-12-08 | Hitachi Chem Co Ltd | 圧縮成形用エポキシ樹脂組成物及び、電子部品装置 |
| JP2014141573A (ja) * | 2013-01-23 | 2014-08-07 | Kyocera Chemical Corp | 半導体封止用樹脂組成物および半導体封止装置 |
| WO2014192472A1 (ja) * | 2013-05-30 | 2014-12-04 | 住友ベークライト株式会社 | 疎水性無機粒子、放熱部材用樹脂組成物および電子部品装置 |
| KR20190092589A (ko) * | 2016-12-27 | 2019-08-07 | 히타치가세이가부시끼가이샤 | 수지 조성물 및 전자 부품 장치 |
| JP6815293B2 (ja) * | 2017-08-16 | 2021-01-20 | 信越化学工業株式会社 | 半導体封止用熱硬化性エポキシ樹脂シート、半導体装置、及びその製造方法 |
| JP7410052B2 (ja) * | 2018-12-10 | 2024-01-09 | Eneos株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
| WO2021048977A1 (ja) | 2019-09-12 | 2021-03-18 | 昭和電工マテリアルズ株式会社 | 圧縮成形用封止材及び電子部品装置 |
-
2019
- 2019-09-12 WO PCT/JP2019/035934 patent/WO2021048977A1/ja not_active Ceased
-
2020
- 2020-09-11 EP EP20862814.9A patent/EP4030474A4/en active Pending
- 2020-09-11 WO PCT/JP2020/034575 patent/WO2021049645A1/ja not_active Ceased
- 2020-09-11 US US17/642,229 patent/US12404420B2/en active Active
- 2020-09-11 TW TW109131401A patent/TWI868209B/zh active
- 2020-09-11 KR KR1020227010799A patent/KR20220062006A/ko not_active Ceased
- 2020-09-11 CN CN202080063799.2A patent/CN114402029B/zh active Active
- 2020-09-11 JP JP2021545634A patent/JP7805784B2/ja active Active
-
2024
- 2024-11-06 JP JP2024194411A patent/JP2025013531A/ja active Pending
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