JPWO2023238950A5 - - Google Patents

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Publication number
JPWO2023238950A5
JPWO2023238950A5 JP2024508600A JP2024508600A JPWO2023238950A5 JP WO2023238950 A5 JPWO2023238950 A5 JP WO2023238950A5 JP 2024508600 A JP2024508600 A JP 2024508600A JP 2024508600 A JP2024508600 A JP 2024508600A JP WO2023238950 A5 JPWO2023238950 A5 JP WO2023238950A5
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JP
Japan
Prior art keywords
resin composition
molding resin
composition according
electronic component
indene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024508600A
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English (en)
Japanese (ja)
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JPWO2023238950A1 (https=
JP7505661B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021622 external-priority patent/WO2023238950A1/ja
Publication of JPWO2023238950A1 publication Critical patent/JPWO2023238950A1/ja
Publication of JPWO2023238950A5 publication Critical patent/JPWO2023238950A5/ja
Priority to JP2024092500A priority Critical patent/JP2024116267A/ja
Application granted granted Critical
Publication of JP7505661B2 publication Critical patent/JP7505661B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024508600A 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置 Active JP7505661B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024092500A JP2024116267A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022094676 2022-06-10
JP2022094676 2022-06-10
PCT/JP2023/021622 WO2023238950A1 (ja) 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024092500A Division JP2024116267A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2023238950A1 JPWO2023238950A1 (https=) 2023-12-14
JPWO2023238950A5 true JPWO2023238950A5 (https=) 2024-05-21
JP7505661B2 JP7505661B2 (ja) 2024-06-25

Family

ID=89118473

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024508600A Active JP7505661B2 (ja) 2022-06-10 2023-06-09 成形用樹脂組成物及び電子部品装置
JP2024092500A Pending JP2024116267A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024092500A Pending JP2024116267A (ja) 2022-06-10 2024-06-06 成形用樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20250340732A1 (https=)
JP (2) JP7505661B2 (https=)
KR (1) KR20250020461A (https=)
CN (1) CN119256052A (https=)
TW (1) TW202409188A (https=)
WO (1) WO2023238950A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7540554B1 (ja) * 2023-07-19 2024-08-27 株式会社レゾナック 成形用樹脂組成物及び電子部品装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6042054B2 (ja) 2011-05-26 2016-12-14 Dic株式会社 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6070134B2 (ja) 2012-12-07 2017-02-01 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6066865B2 (ja) 2013-08-15 2017-01-25 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP6519424B2 (ja) 2015-09-16 2019-05-29 住友ベークライト株式会社 高誘電樹脂組成物
JP6832193B2 (ja) 2017-02-27 2021-02-24 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置
KR102731475B1 (ko) * 2017-12-28 2024-11-15 가부시끼가이샤 레조낙 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
US11421071B2 (en) * 2018-08-27 2022-08-23 Nippon Steel Chemical & Materials Co., Ltd. Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product
JP7384559B2 (ja) * 2019-01-31 2023-11-21 京セラ株式会社 高周波用封止材樹脂組成物および半導体装置
JP6870778B1 (ja) 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

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