JPWO2023238950A5 - - Google Patents
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- Publication number
- JPWO2023238950A5 JPWO2023238950A5 JP2024508600A JP2024508600A JPWO2023238950A5 JP WO2023238950 A5 JPWO2023238950 A5 JP WO2023238950A5 JP 2024508600 A JP2024508600 A JP 2024508600A JP 2024508600 A JP2024508600 A JP 2024508600A JP WO2023238950 A5 JPWO2023238950 A5 JP WO2023238950A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding resin
- composition according
- electronic component
- indene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 15
- 239000011342 resin composition Substances 0.000 claims 15
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 229920001577 copolymer Polymers 0.000 claims 4
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- -1 ester compound Chemical class 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024092500A JP2024116267A (ja) | 2022-06-10 | 2024-06-06 | 成形用樹脂組成物及び電子部品装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022094676 | 2022-06-10 | ||
| JP2022094676 | 2022-06-10 | ||
| PCT/JP2023/021622 WO2023238950A1 (ja) | 2022-06-10 | 2023-06-09 | 成形用樹脂組成物及び電子部品装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024092500A Division JP2024116267A (ja) | 2022-06-10 | 2024-06-06 | 成形用樹脂組成物及び電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023238950A1 JPWO2023238950A1 (https=) | 2023-12-14 |
| JPWO2023238950A5 true JPWO2023238950A5 (https=) | 2024-05-21 |
| JP7505661B2 JP7505661B2 (ja) | 2024-06-25 |
Family
ID=89118473
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024508600A Active JP7505661B2 (ja) | 2022-06-10 | 2023-06-09 | 成形用樹脂組成物及び電子部品装置 |
| JP2024092500A Pending JP2024116267A (ja) | 2022-06-10 | 2024-06-06 | 成形用樹脂組成物及び電子部品装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024092500A Pending JP2024116267A (ja) | 2022-06-10 | 2024-06-06 | 成形用樹脂組成物及び電子部品装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250340732A1 (https=) |
| JP (2) | JP7505661B2 (https=) |
| KR (1) | KR20250020461A (https=) |
| CN (1) | CN119256052A (https=) |
| TW (1) | TW202409188A (https=) |
| WO (1) | WO2023238950A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7540554B1 (ja) * | 2023-07-19 | 2024-08-27 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6042054B2 (ja) | 2011-05-26 | 2016-12-14 | Dic株式会社 | 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム |
| JP6070134B2 (ja) | 2012-12-07 | 2017-02-01 | Dic株式会社 | 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| JP6066865B2 (ja) | 2013-08-15 | 2017-01-25 | 信越化学工業株式会社 | 高誘電率エポキシ樹脂組成物および半導体装置 |
| JP6519424B2 (ja) | 2015-09-16 | 2019-05-29 | 住友ベークライト株式会社 | 高誘電樹脂組成物 |
| JP6832193B2 (ja) | 2017-02-27 | 2021-02-24 | 京セラ株式会社 | 樹脂組成物および樹脂封止型半導体装置 |
| WO2019131095A1 (ja) | 2017-12-28 | 2019-07-04 | 日立化成株式会社 | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 |
| JP7384559B2 (ja) | 2019-01-31 | 2023-11-21 | 京セラ株式会社 | 高周波用封止材樹脂組成物および半導体装置 |
| JP6870778B1 (ja) | 2020-12-11 | 2021-05-12 | 昭和電工マテリアルズ株式会社 | 成形用樹脂組成物及び電子部品装置 |
-
2023
- 2023-06-09 US US18/861,593 patent/US20250340732A1/en active Pending
- 2023-06-09 WO PCT/JP2023/021622 patent/WO2023238950A1/ja not_active Ceased
- 2023-06-09 CN CN202380037643.0A patent/CN119256052A/zh active Pending
- 2023-06-09 KR KR1020247041284A patent/KR20250020461A/ko active Pending
- 2023-06-09 JP JP2024508600A patent/JP7505661B2/ja active Active
- 2023-06-09 TW TW112121699A patent/TW202409188A/zh unknown
-
2024
- 2024-06-06 JP JP2024092500A patent/JP2024116267A/ja active Pending
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