JPWO2023203765A5 - - Google Patents
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- Publication number
- JPWO2023203765A5 JPWO2023203765A5 JP2024516045A JP2024516045A JPWO2023203765A5 JP WO2023203765 A5 JPWO2023203765 A5 JP WO2023203765A5 JP 2024516045 A JP2024516045 A JP 2024516045A JP 2024516045 A JP2024516045 A JP 2024516045A JP WO2023203765 A5 JPWO2023203765 A5 JP WO2023203765A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding structure
- hybrid bonding
- insulating film
- semiconductor
- structure component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 41
- 239000011344 liquid material Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/018581 WO2023203765A1 (ja) | 2022-04-22 | 2022-04-22 | 半導体装置の製造方法、及び、半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023203765A1 JPWO2023203765A1 (https=) | 2023-10-26 |
| JPWO2023203765A5 true JPWO2023203765A5 (https=) | 2025-04-22 |
Family
ID=88419622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024516045A Pending JPWO2023203765A1 (https=) | 2022-04-22 | 2022-04-22 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250279392A1 (https=) |
| JP (1) | JPWO2023203765A1 (https=) |
| CN (1) | CN119054059A (https=) |
| WO (1) | WO2023203765A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025145600A (ja) * | 2024-03-22 | 2025-10-03 | Rapidus株式会社 | 半導体システムおよび半導体システムの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015176958A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2020191334A (ja) * | 2019-05-20 | 2020-11-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| JP2021174939A (ja) * | 2020-04-28 | 2021-11-01 | 昭和電工マテリアルズ株式会社 | アンダーフィル用樹脂組成物及びその製造方法、半導体装置の製造方法、並びに半導体装置 |
| JP7543712B2 (ja) * | 2020-06-12 | 2024-09-03 | 株式会社レゾナック | 半導体装置の製造方法 |
-
2022
- 2022-04-22 JP JP2024516045A patent/JPWO2023203765A1/ja active Pending
- 2022-04-22 CN CN202280095052.4A patent/CN119054059A/zh active Pending
- 2022-04-22 WO PCT/JP2022/018581 patent/WO2023203765A1/ja not_active Ceased
- 2022-04-22 US US18/857,185 patent/US20250279392A1/en active Pending
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