JPWO2023203764A5 - - Google Patents

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Publication number
JPWO2023203764A5
JPWO2023203764A5 JP2024516044A JP2024516044A JPWO2023203764A5 JP WO2023203764 A5 JPWO2023203764 A5 JP WO2023203764A5 JP 2024516044 A JP2024516044 A JP 2024516044A JP 2024516044 A JP2024516044 A JP 2024516044A JP WO2023203764 A5 JPWO2023203764 A5 JP WO2023203764A5
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JP
Japan
Prior art keywords
hybrid bonding
insulating film
semiconductor
component
substrate
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JP2024516044A
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English (en)
Japanese (ja)
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JP7827136B2 (ja
JPWO2023203764A1 (https=
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Priority claimed from PCT/JP2022/018580 external-priority patent/WO2023203764A1/ja
Publication of JPWO2023203764A1 publication Critical patent/JPWO2023203764A1/ja
Publication of JPWO2023203764A5 publication Critical patent/JPWO2023203764A5/ja
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Publication of JP7827136B2 publication Critical patent/JP7827136B2/ja
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JP2024516044A 2022-04-22 2022-04-22 半導体装置、及び、半導体装置の製造方法 Active JP7827136B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018580 WO2023203764A1 (ja) 2022-04-22 2022-04-22 半導体装置、及び、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023203764A1 JPWO2023203764A1 (https=) 2023-10-26
JPWO2023203764A5 true JPWO2023203764A5 (https=) 2025-04-22
JP7827136B2 JP7827136B2 (ja) 2026-03-10

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ID=88419484

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JP2024516044A Active JP7827136B2 (ja) 2022-04-22 2022-04-22 半導体装置、及び、半導体装置の製造方法

Country Status (4)

Country Link
US (1) US20250273610A1 (https=)
JP (1) JP7827136B2 (https=)
CN (1) CN119096341A (https=)
WO (1) WO2023203764A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025145600A (ja) * 2024-03-22 2025-10-03 Ｒａｐｉｄｕｓ株式会社 半導体システムおよび半導体システムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222038A (ja) * 2011-04-05 2012-11-12 Elpida Memory Inc 半導体装置の製造方法
JP2014063974A (ja) * 2012-08-27 2014-04-10 Ps4 Luxco S A R L チップ積層体、該チップ積層体を備えた半導体装置、及び半導体装置の製造方法
JP6496389B2 (ja) * 2017-11-28 2019-04-03 東芝メモリ株式会社 半導体装置及びその製造方法

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