CN118525071A - 密封材组合物及电子零件装置 - Google Patents

密封材组合物及电子零件装置 Download PDF

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Publication number
CN118525071A
CN118525071A CN202280084014.9A CN202280084014A CN118525071A CN 118525071 A CN118525071 A CN 118525071A CN 202280084014 A CN202280084014 A CN 202280084014A CN 118525071 A CN118525071 A CN 118525071A
Authority
CN
China
Prior art keywords
group
sealing material
mass
material composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280084014.9A
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English (en)
Chinese (zh)
Inventor
内山千嘉
白神真志
襖田光昭
根来周平
田中实佳
助川雄太
姜东哲
大下毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN118525071A publication Critical patent/CN118525071A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280084014.9A 2021-12-24 2022-12-26 密封材组合物及电子零件装置 Pending CN118525071A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021210834 2021-12-24
JP2021-210834 2021-12-24
PCT/JP2022/048050 WO2023120738A1 (ja) 2021-12-24 2022-12-26 封止材組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
CN118525071A true CN118525071A (zh) 2024-08-20

Family

ID=86902919

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280084014.9A Pending CN118525071A (zh) 2021-12-24 2022-12-26 密封材组合物及电子零件装置

Country Status (4)

Country Link
JP (1) JPWO2023120738A1 (https=)
CN (1) CN118525071A (https=)
TW (1) TW202340367A (https=)
WO (1) WO2023120738A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0655827B2 (ja) * 1988-04-18 1994-07-27 信越化学工業株式会社 半導体封止用エポキシ樹脂タブレットの製造方法
KR102072060B1 (ko) * 2013-08-05 2020-01-31 히타치가세이가부시끼가이샤 에폭시 수지 조성물 및 전자 부품 장치
WO2019189142A1 (ja) * 2018-03-29 2019-10-03 住友ベークライト株式会社 粒子状封止用樹脂組成物、半導体装置およびその製造方法

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Publication number Publication date
JPWO2023120738A1 (https=) 2023-06-29
TW202340367A (zh) 2023-10-16
WO2023120738A1 (ja) 2023-06-29

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