JPWO2023120738A1 - - Google Patents
Info
- Publication number
- JPWO2023120738A1 JPWO2023120738A1 JP2023569591A JP2023569591A JPWO2023120738A1 JP WO2023120738 A1 JPWO2023120738 A1 JP WO2023120738A1 JP 2023569591 A JP2023569591 A JP 2023569591A JP 2023569591 A JP2023569591 A JP 2023569591A JP WO2023120738 A1 JPWO2023120738 A1 JP WO2023120738A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021210834 | 2021-12-24 | ||
| PCT/JP2022/048050 WO2023120738A1 (ja) | 2021-12-24 | 2022-12-26 | 封止材組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120738A1 true JPWO2023120738A1 (https=) | 2023-06-29 |
| JPWO2023120738A5 JPWO2023120738A5 (https=) | 2024-09-06 |
Family
ID=86902919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569591A Pending JPWO2023120738A1 (https=) | 2021-12-24 | 2022-12-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023120738A1 (https=) |
| CN (1) | CN118525071A (https=) |
| TW (1) | TW202340367A (https=) |
| WO (1) | WO2023120738A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655827B2 (ja) * | 1988-04-18 | 1994-07-27 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂タブレットの製造方法 |
| KR102072060B1 (ko) * | 2013-08-05 | 2020-01-31 | 히타치가세이가부시끼가이샤 | 에폭시 수지 조성물 및 전자 부품 장치 |
| WO2019189142A1 (ja) * | 2018-03-29 | 2019-10-03 | 住友ベークライト株式会社 | 粒子状封止用樹脂組成物、半導体装置およびその製造方法 |
-
2022
- 2022-12-26 TW TW111150029A patent/TW202340367A/zh unknown
- 2022-12-26 CN CN202280084014.9A patent/CN118525071A/zh active Pending
- 2022-12-26 JP JP2023569591A patent/JPWO2023120738A1/ja active Pending
- 2022-12-26 WO PCT/JP2022/048050 patent/WO2023120738A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW202340367A (zh) | 2023-10-16 |
| CN118525071A (zh) | 2024-08-20 |
| WO2023120738A1 (ja) | 2023-06-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240612 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251002 |