JPWO2024075343A5 - - Google Patents
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- Publication number
- JPWO2024075343A5 JPWO2024075343A5 JP2024555625A JP2024555625A JPWO2024075343A5 JP WO2024075343 A5 JPWO2024075343 A5 JP WO2024075343A5 JP 2024555625 A JP2024555625 A JP 2024555625A JP 2024555625 A JP2024555625 A JP 2024555625A JP WO2024075343 A5 JPWO2024075343 A5 JP WO2024075343A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- composition according
- filler
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022162717 | 2022-10-07 | ||
| PCT/JP2023/022303 WO2024075343A1 (ja) | 2022-10-07 | 2023-06-15 | エポキシ樹脂組成物、半導体装置、及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024075343A1 JPWO2024075343A1 (https=) | 2024-04-11 |
| JPWO2024075343A5 true JPWO2024075343A5 (https=) | 2025-06-18 |
Family
ID=90608099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024555625A Pending JPWO2024075343A1 (https=) | 2022-10-07 | 2023-06-15 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024075343A1 (https=) |
| KR (1) | KR20250079098A (https=) |
| CN (1) | CN119998396A (https=) |
| TW (1) | TW202415725A (https=) |
| WO (1) | WO2024075343A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026058453A1 (ja) | 2024-09-10 | 2026-03-19 | 積水化成品工業株式会社 | 中空樹脂粒子、その製造方法、およびその用途 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001055488A (ja) * | 1999-06-10 | 2001-02-27 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
| TWI668269B (zh) * | 2014-06-30 | 2019-08-11 | 日商味之素股份有限公司 | Resin composition |
| JP6969729B2 (ja) | 2014-12-12 | 2021-11-24 | ナミックス株式会社 | 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法 |
| JP2018138634A (ja) * | 2017-02-24 | 2018-09-06 | 三菱ケミカル株式会社 | 樹脂組成物および該樹脂組成物を用いた半導体装置 |
| EP3620481B1 (en) * | 2017-05-31 | 2024-03-27 | Resonac Corporation | Liquid resin composition for sealing and electronic component apparatus |
| US12454612B2 (en) * | 2017-05-31 | 2025-10-28 | Resonac Corporation | Liquid resin composition for compression molding and electronic component apparatus |
| JP2019077771A (ja) * | 2017-10-24 | 2019-05-23 | 日立化成株式会社 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 |
| JP7259219B2 (ja) * | 2018-06-12 | 2023-04-18 | 株式会社レゾナック | 樹脂組成物及びその硬化物、並びに半導体装置の製造方法 |
-
2023
- 2023-06-15 CN CN202380054212.5A patent/CN119998396A/zh active Pending
- 2023-06-15 WO PCT/JP2023/022303 patent/WO2024075343A1/ja not_active Ceased
- 2023-06-15 KR KR1020247039153A patent/KR20250079098A/ko active Pending
- 2023-06-15 JP JP2024555625A patent/JPWO2024075343A1/ja active Pending
- 2023-06-28 TW TW112124026A patent/TW202415725A/zh unknown
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