TW202415725A - 環氧樹脂組成物、半導體裝置及半導體裝置之製造方法 - Google Patents

環氧樹脂組成物、半導體裝置及半導體裝置之製造方法 Download PDF

Info

Publication number
TW202415725A
TW202415725A TW112124026A TW112124026A TW202415725A TW 202415725 A TW202415725 A TW 202415725A TW 112124026 A TW112124026 A TW 112124026A TW 112124026 A TW112124026 A TW 112124026A TW 202415725 A TW202415725 A TW 202415725A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
filler
semiconductor device
less
Prior art date
Application number
TW112124026A
Other languages
English (en)
Chinese (zh)
Inventor
梶原雅
Original Assignee
日商納美仕股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202415725A publication Critical patent/TW202415725A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW112124026A 2022-10-07 2023-06-28 環氧樹脂組成物、半導體裝置及半導體裝置之製造方法 TW202415725A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-162717 2022-10-07
JP2022162717 2022-10-07

Publications (1)

Publication Number Publication Date
TW202415725A true TW202415725A (zh) 2024-04-16

Family

ID=90608099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112124026A TW202415725A (zh) 2022-10-07 2023-06-28 環氧樹脂組成物、半導體裝置及半導體裝置之製造方法

Country Status (5)

Country Link
JP (1) JPWO2024075343A1 (https=)
KR (1) KR20250079098A (https=)
CN (1) CN119998396A (https=)
TW (1) TW202415725A (https=)
WO (1) WO2024075343A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026058453A1 (ja) 2024-09-10 2026-03-19 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001055488A (ja) * 1999-06-10 2001-02-27 Shin Etsu Chem Co Ltd フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
JP6969729B2 (ja) 2014-12-12 2021-11-24 ナミックス株式会社 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法
JP2018138634A (ja) * 2017-02-24 2018-09-06 三菱ケミカル株式会社 樹脂組成物および該樹脂組成物を用いた半導体装置
PT3620481T (pt) * 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos
TWI898612B (zh) * 2017-05-31 2025-09-21 日商力森諾科股份有限公司 壓縮成形用液狀樹脂組成物及電子零件裝置
JP2019077771A (ja) * 2017-10-24 2019-05-23 日立化成株式会社 アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法
JP7259219B2 (ja) * 2018-06-12 2023-04-18 株式会社レゾナック 樹脂組成物及びその硬化物、並びに半導体装置の製造方法

Also Published As

Publication number Publication date
KR20250079098A (ko) 2025-06-04
CN119998396A (zh) 2025-05-13
JPWO2024075343A1 (https=) 2024-04-11
WO2024075343A1 (ja) 2024-04-11

Similar Documents

Publication Publication Date Title
JP2012162585A (ja) 半導体樹脂封止材
US20120184646A1 (en) Semiconductor-encapsulating liquid epoxy resin composition and semiconductor device
TWI912528B (zh) 液狀壓縮成型材、電子零件、半導體裝置及半導體裝置之製造方法
JP6829462B2 (ja) 液状エポキシ樹脂封止材
TWI817988B (zh) 環氧樹脂組成物
JP2019083225A (ja) アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP2013199624A (ja) アンダーフィル用エポキシ樹脂液状封止材及び電子部品装置
JP2009167372A (ja) 電気部品用接着剤
JP2016088978A (ja) 導電性樹脂組成物およびそれを用いた電子部品装置
JP2008255178A (ja) 半導体封止用エポキシ樹脂組成物、半導体装置およびその製造方法
TW202415725A (zh) 環氧樹脂組成物、半導體裝置及半導體裝置之製造方法
TWI542628B (zh) 一液型環氧樹脂組成物
JP4176619B2 (ja) フリップチップ実装用サイドフィル材及び半導体装置
JP3925803B2 (ja) フリップチップ実装用サイドフィル材及び半導体装置
JP5593259B2 (ja) 液状エポキシ樹脂組成物
JP2015117361A (ja) 半導体封止用樹脂組成物
JP7786113B2 (ja) アンダーフィル用液状樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2013253195A (ja) エポキシ樹脂組成物
TW202415696A (zh) 環氧樹脂組成物、半導體裝置及半導體裝置之製造方法
JP2014227465A (ja) 射出成形用液状樹脂組成物および半導体装置
JP2019081816A (ja) アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JPWO2005080502A1 (ja) アンダーフィル用液状エポキシ樹脂組成物および同組成物を用いて封止した半導体装置
JP2010053164A (ja) 封止用樹脂組成物および樹脂封止型半導体装置
JP2005350618A (ja) 液状エポキシ樹脂組成物及び半導体装置
US20250084232A1 (en) Liquid encapsulation resin composition and semiconductor device