CN119998396A - 环氧树脂组合物、半导体装置、以及半导体装置的制造方法 - Google Patents

环氧树脂组合物、半导体装置、以及半导体装置的制造方法 Download PDF

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Publication number
CN119998396A
CN119998396A CN202380054212.5A CN202380054212A CN119998396A CN 119998396 A CN119998396 A CN 119998396A CN 202380054212 A CN202380054212 A CN 202380054212A CN 119998396 A CN119998396 A CN 119998396A
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CN
China
Prior art keywords
epoxy resin
resin composition
filler
semiconductor device
examples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380054212.5A
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English (en)
Chinese (zh)
Inventor
梶原雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN119998396A publication Critical patent/CN119998396A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380054212.5A 2022-10-07 2023-06-15 环氧树脂组合物、半导体装置、以及半导体装置的制造方法 Pending CN119998396A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-162717 2022-10-07
JP2022162717 2022-10-07
PCT/JP2023/022303 WO2024075343A1 (ja) 2022-10-07 2023-06-15 エポキシ樹脂組成物、半導体装置、及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN119998396A true CN119998396A (zh) 2025-05-13

Family

ID=90608099

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380054212.5A Pending CN119998396A (zh) 2022-10-07 2023-06-15 环氧树脂组合物、半导体装置、以及半导体装置的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024075343A1 (https=)
KR (1) KR20250079098A (https=)
CN (1) CN119998396A (https=)
TW (1) TW202415725A (https=)
WO (1) WO2024075343A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026058453A1 (ja) 2024-09-10 2026-03-19 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001055488A (ja) * 1999-06-10 2001-02-27 Shin Etsu Chem Co Ltd フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
JP6969729B2 (ja) 2014-12-12 2021-11-24 ナミックス株式会社 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法
JP2018138634A (ja) * 2017-02-24 2018-09-06 三菱ケミカル株式会社 樹脂組成物および該樹脂組成物を用いた半導体装置
PT3620481T (pt) * 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos
TWI898612B (zh) * 2017-05-31 2025-09-21 日商力森諾科股份有限公司 壓縮成形用液狀樹脂組成物及電子零件裝置
JP2019077771A (ja) * 2017-10-24 2019-05-23 日立化成株式会社 アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法
JP7259219B2 (ja) * 2018-06-12 2023-04-18 株式会社レゾナック 樹脂組成物及びその硬化物、並びに半導体装置の製造方法

Also Published As

Publication number Publication date
KR20250079098A (ko) 2025-06-04
TW202415725A (zh) 2024-04-16
JPWO2024075343A1 (https=) 2024-04-11
WO2024075343A1 (ja) 2024-04-11

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