TW202313840A - 壓縮成形用環氧樹脂組成物及電子零件裝置 - Google Patents

壓縮成形用環氧樹脂組成物及電子零件裝置 Download PDF

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Publication number
TW202313840A
TW202313840A TW111133139A TW111133139A TW202313840A TW 202313840 A TW202313840 A TW 202313840A TW 111133139 A TW111133139 A TW 111133139A TW 111133139 A TW111133139 A TW 111133139A TW 202313840 A TW202313840 A TW 202313840A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
mass
compression molding
inorganic filler
Prior art date
Application number
TW111133139A
Other languages
English (en)
Chinese (zh)
Inventor
平井友貴
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202313840A publication Critical patent/TW202313840A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111133139A 2021-09-02 2022-09-01 壓縮成形用環氧樹脂組成物及電子零件裝置 TW202313840A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021143465 2021-09-02
JP2021-143465 2021-09-02

Publications (1)

Publication Number Publication Date
TW202313840A true TW202313840A (zh) 2023-04-01

Family

ID=85411257

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133139A TW202313840A (zh) 2021-09-02 2022-09-01 壓縮成形用環氧樹脂組成物及電子零件裝置

Country Status (3)

Country Link
JP (1) JPWO2023032971A1 (https=)
TW (1) TW202313840A (https=)
WO (1) WO2023032971A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841293A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP5574237B2 (ja) * 2008-05-21 2014-08-20 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP6558671B2 (ja) * 2014-11-07 2019-08-14 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
JP2016108367A (ja) * 2014-12-02 2016-06-20 信越化学工業株式会社 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法
KR102951895B1 (ko) * 2019-10-16 2026-04-10 가부시끼가이샤 레조낙 에폭시 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Also Published As

Publication number Publication date
JPWO2023032971A1 (https=) 2023-03-09
WO2023032971A1 (ja) 2023-03-09

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