JPWO2023032971A1 - - Google Patents

Info

Publication number
JPWO2023032971A1
JPWO2023032971A1 JP2023545595A JP2023545595A JPWO2023032971A1 JP WO2023032971 A1 JPWO2023032971 A1 JP WO2023032971A1 JP 2023545595 A JP2023545595 A JP 2023545595A JP 2023545595 A JP2023545595 A JP 2023545595A JP WO2023032971 A1 JPWO2023032971 A1 JP WO2023032971A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545595A
Other languages
Japanese (ja)
Other versions
JPWO2023032971A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032971A1 publication Critical patent/JPWO2023032971A1/ja
Publication of JPWO2023032971A5 publication Critical patent/JPWO2023032971A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023545595A 2021-09-02 2022-08-30 Pending JPWO2023032971A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021143465 2021-09-02
PCT/JP2022/032567 WO2023032971A1 (ja) 2021-09-02 2022-08-30 圧縮成形用エポキシ樹脂組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2023032971A1 true JPWO2023032971A1 (https=) 2023-03-09
JPWO2023032971A5 JPWO2023032971A5 (https=) 2025-07-18

Family

ID=85411257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545595A Pending JPWO2023032971A1 (https=) 2021-09-02 2022-08-30

Country Status (3)

Country Link
JP (1) JPWO2023032971A1 (https=)
TW (1) TW202313840A (https=)
WO (1) WO2023032971A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841293A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
WO2009142065A1 (ja) * 2008-05-21 2009-11-26 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP2016089096A (ja) * 2014-11-07 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
JP2016108367A (ja) * 2014-12-02 2016-06-20 信越化学工業株式会社 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841293A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
WO2009142065A1 (ja) * 2008-05-21 2009-11-26 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP2016089096A (ja) * 2014-11-07 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
JP2016108367A (ja) * 2014-12-02 2016-06-20 信越化学工業株式会社 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Also Published As

Publication number Publication date
TW202313840A (zh) 2023-04-01
WO2023032971A1 (ja) 2023-03-09

Similar Documents

Publication Publication Date Title
CN305918450S (https=)
CN305922877S (https=)
CN305537306S (https=)
CN305537143S (https=)
CN305535403S (https=)
CN305533827S (https=)
CN305532747S (https=)
CN305531539S (https=)
CN305531389S (https=)
CN305531343S (https=)
CN305530297S (https=)
CN305530059S (https=)
CN305529229S (https=)
CN305529100S (https=)
CN305528784S (https=)
CN305528617S (https=)
CN305527419S (https=)
CN306164637S (https=)
CN306159395S (https=)
CN306144715S (https=)
CN306063080S (https=)
CN306059403S (https=)
CN306054375S (https=)
CN306045063S (https=)
CN306041801S (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250710

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250710

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260331