WO2023032971A1 - 圧縮成形用エポキシ樹脂組成物及び電子部品装置 - Google Patents

圧縮成形用エポキシ樹脂組成物及び電子部品装置 Download PDF

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Publication number
WO2023032971A1
WO2023032971A1 PCT/JP2022/032567 JP2022032567W WO2023032971A1 WO 2023032971 A1 WO2023032971 A1 WO 2023032971A1 JP 2022032567 W JP2022032567 W JP 2022032567W WO 2023032971 A1 WO2023032971 A1 WO 2023032971A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
group
resin composition
mass
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/032567
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
友貴 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Priority to JP2023545595A priority Critical patent/JPWO2023032971A1/ja
Publication of WO2023032971A1 publication Critical patent/WO2023032971A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Definitions

  • the melting point or softening point of the curing agent shall be the value measured in the same manner as the melting point or softening point of the epoxy resin.
  • an unsubstituted aryl group having 6 to 12 carbon atoms or 6 to 12 carbon atoms including substituents is preferable, and an unsubstituted aryl group having 6 to 10 carbon atoms or including substituents is preferred.
  • Aryl groups of 6 to 10 are more preferred, and phenyl, p-tolyl and p-methoxyphenyl groups are even more preferred.
  • R 1 to R 6 in general formula (I-2) are the same as specific examples of R 1 to R 6 in general formula (I-1), and preferred ranges are also the same.
  • the particle shape of the inorganic filler is preferably spherical rather than square, and the particle size distribution of the inorganic filler is preferably distributed over a wide range.
  • Mold shrinkage rate (%) ⁇ (length of cured product before post-curing - length of cured product after post-curing) / (length of cured product before post-curing) ⁇ x 100
  • the length of the cured product is the length of any one side of the rectangular cured product.
  • An epoxy resin composition was prepared with the composition of Example 1 shown in Table 1.
  • a particulate epoxy resin composition obtained by pulverizing the prepared epoxy resin composition was used as an epoxy resin composition of Comparative Example 3.
  • the epoxy resin composition of Comparative Example 3 was not sieved, and the maximum particle size of the composition exceeded 2.0 mm.
  • the solubility was evaluated as follows. First, an aluminum cup ( ⁇ 5.5 cm) was placed on a hot plate, and then 5 g of each of the epoxy resin compositions of Examples 1 to 4 and Comparative Example 3 was spread horizontally in the cup.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PCT/JP2022/032567 2021-09-02 2022-08-30 圧縮成形用エポキシ樹脂組成物及び電子部品装置 Ceased WO2023032971A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023545595A JPWO2023032971A1 (https=) 2021-09-02 2022-08-30

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021143465 2021-09-02
JP2021-143465 2021-09-02

Publications (1)

Publication Number Publication Date
WO2023032971A1 true WO2023032971A1 (ja) 2023-03-09

Family

ID=85411257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/032567 Ceased WO2023032971A1 (ja) 2021-09-02 2022-08-30 圧縮成形用エポキシ樹脂組成物及び電子部品装置

Country Status (3)

Country Link
JP (1) JPWO2023032971A1 (https=)
TW (1) TW202313840A (https=)
WO (1) WO2023032971A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841293A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
WO2009142065A1 (ja) * 2008-05-21 2009-11-26 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP2016089096A (ja) * 2014-11-07 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
JP2016108367A (ja) * 2014-12-02 2016-06-20 信越化学工業株式会社 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841293A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
WO2009142065A1 (ja) * 2008-05-21 2009-11-26 ナガセケムテックス株式会社 電子部品封止用エポキシ樹脂組成物
JP2016089096A (ja) * 2014-11-07 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
JP2016108367A (ja) * 2014-12-02 2016-06-20 信越化学工業株式会社 半導体封止用樹脂組成物及び該樹脂組成物を用いた半導体封止方法
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048746A1 (ja) * 2024-08-27 2026-03-05 株式会社レゾナック 封止用樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
JPWO2023032971A1 (https=) 2023-03-09
TW202313840A (zh) 2023-04-01

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