JP2023041461A5 - - Google Patents

Download PDF

Info

Publication number
JP2023041461A5
JP2023041461A5 JP2021148850A JP2021148850A JP2023041461A5 JP 2023041461 A5 JP2023041461 A5 JP 2023041461A5 JP 2021148850 A JP2021148850 A JP 2021148850A JP 2021148850 A JP2021148850 A JP 2021148850A JP 2023041461 A5 JP2023041461 A5 JP 2023041461A5
Authority
JP
Japan
Prior art keywords
processing liquid
region
supply
pipe
partition plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021148850A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023041461A (ja
JP7438172B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2021148850A external-priority patent/JP7438172B2/ja
Priority to JP2021148850A priority Critical patent/JP7438172B2/ja
Priority to KR1020220109877A priority patent/KR102718065B1/ko
Priority to CN202211095050.3A priority patent/CN115810563B/zh
Priority to TW111133987A priority patent/TWI793054B/zh
Priority to TW112100005A priority patent/TWI828504B/zh
Priority to US17/942,786 priority patent/US12318803B2/en
Publication of JP2023041461A publication Critical patent/JP2023041461A/ja
Publication of JP2023041461A5 publication Critical patent/JP2023041461A5/ja
Publication of JP7438172B2 publication Critical patent/JP7438172B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021148850A 2021-09-13 2021-09-13 供給装置、供給システム Active JP7438172B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム
KR1020220109877A KR102718065B1 (ko) 2021-09-13 2022-08-31 공급 장치, 공급 시스템
CN202211095050.3A CN115810563B (zh) 2021-09-13 2022-09-05 供给装置、供给系统
TW112100005A TWI828504B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統
TW111133987A TWI793054B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統
US17/942,786 US12318803B2 (en) 2021-09-13 2022-09-12 Supply device and supply system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Publications (3)

Publication Number Publication Date
JP2023041461A JP2023041461A (ja) 2023-03-24
JP2023041461A5 true JP2023041461A5 (enExample) 2023-06-13
JP7438172B2 JP7438172B2 (ja) 2024-02-26

Family

ID=85478152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021148850A Active JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Country Status (5)

Country Link
US (1) US12318803B2 (enExample)
JP (1) JP7438172B2 (enExample)
KR (1) KR102718065B1 (enExample)
CN (1) CN115810563B (enExample)
TW (2) TWI793054B (enExample)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174420A (ja) * 1994-12-26 1996-07-09 Fuji Oozx Inc 水溶性研削液の自動補充装置
JP2001062669A (ja) * 1999-08-24 2001-03-13 Nikon Corp 加工方法およびその装置
JP3761457B2 (ja) 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
MY166203A (en) * 2009-03-31 2018-06-14 Kurita Water Ind Ltd Apparatus and method for treating etching solution
WO2011155335A1 (ja) * 2010-06-07 2011-12-15 栗田工業株式会社 洗浄システムおよび洗浄方法
CN103094151B (zh) * 2011-10-27 2015-07-22 沈阳芯源微电子设备有限公司 一种化学液回收装置
CN103187341B (zh) * 2011-12-27 2015-11-18 芝浦机械电子株式会社 基板的处理装置及处理方法
JP6010457B2 (ja) 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
JP6502633B2 (ja) 2013-09-30 2019-04-17 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6839990B2 (ja) * 2017-01-31 2021-03-10 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
US20190203342A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Cooling system and evaporation machine
US20200354241A1 (en) * 2019-05-10 2020-11-12 Sugino Machine Limited Liquid treatment apparatus and liquid treatment method
JP6869306B2 (ja) * 2019-09-30 2021-05-12 月島機械株式会社 熱媒体利用機器への熱媒体供給方法及び熱媒体利用設備

Similar Documents

Publication Publication Date Title
EP2387319B1 (en) Oven steam generator system and method for generating steam
KR900000995A (ko) 처리액 공급장치
CN106335278B (zh) 油墨喷射装置及油墨喷射方法
US3147687A (en) Method of and apparatus for the development of light sensitive diazotype materials
MX2021007199A (es) Aparatos y métodos para configuraciones en serie de dispositivos de vaporización con múltiples cámaras.
US9275880B2 (en) Liquid replenishing device
JP2015192148A5 (enExample)
JP2023041461A5 (enExample)
CN107075660B (zh) 具有在多个位置处进料的稀释气体流的经调温的导气管
MX2020011390A (es) Sistemas y metodos de llenado de recipientes.
KR101522492B1 (ko) 아스팔트의 이송 방법
CN113712435A (zh) 控制方法及即热式饮水机
GB2469599A (en) Vapour delivery system
KR102207400B1 (ko) 분말 빌드 재료 취급
KR100864644B1 (ko) 약액 공급 장치 및 약액 공급 방법
JP6534570B2 (ja) 反応装置
JP2009300014A (ja) 気化冷却装置
KR20220068981A (ko) 열 매체 이용 기기에 대한 열 매체 공급 방법 및 열 매체 이용 설비
JP4949965B2 (ja) 気化冷却装置
KR101831092B1 (ko) 주입장치 및 증기터빈설비
JP2006223929A (ja) 蒸気加熱装置
CN213223049U (zh) 点胶设备保持胶水恒温装置
US2804852A (en) Water lock boiler feedwater system
JP2008096058A (ja) 気化冷却装置
JPH01139904A (ja) 蒸気連続発生装置