TW201029751A - Processing liquid supply system and processing liquid supply method - Google Patents

Processing liquid supply system and processing liquid supply method Download PDF

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Publication number
TW201029751A
TW201029751A TW099103793A TW99103793A TW201029751A TW 201029751 A TW201029751 A TW 201029751A TW 099103793 A TW099103793 A TW 099103793A TW 99103793 A TW99103793 A TW 99103793A TW 201029751 A TW201029751 A TW 201029751A
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Taiwan
Prior art keywords
treatment liquid
pressure
container
processing liquid
liquid
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TW099103793A
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Chinese (zh)
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Toshihiko Ueda
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Tokyo Electron Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Pipeline Systems (AREA)

Abstract

The processing liquid supply system has the processing liquid tank to deliver the processing liquid, the processing liquid refill means that supply the processing liquid to replenish the processing liquid tank with it through the refill line, the valve that opens and shuts the refill line, the first pressure regulation means that adjusts the pressure in the processing liquid tank to the first pressure value and the second pressure regulation means that adjusts the pressure in the processing liquid tank to the second pressure value that adjusts the pressure on the side of the processing solvent refill means to the second pressure value is higher than the first pressure value. The processing liquid is supplied from the processing liquid refill means to the processing liquid tank as the processing liquid tank supplies the processing liquid to the liquid processing device by opening the valve.

Description

201029751 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用來供給例如微影步驟所使用之光阻、溶 劑等處理液的處理液供給系統以及處理液供給方法。 4 【先前技術】 在例如FPD雜造過程中,於玻璃基板等被處理基板上形成 既定薄膜之後,塗佈光抗姓劑(以下稱為光阻)形成光阻膜, 應電路圖案對光阻膜曝光,使其藉由所謂顯影處理,亦即微 φ 驟形成電路圖案。 ’、 在該微影步驟中’需要光阻供給系統,或光阻溶解用溶劑等 處理液的供給系統。因此,專利文獻1揭示設有處理液供給 以及缓衝容器的實施例。 ' 一再者,如圖3所示亦存在使用2個緩衝容器的實施例。圖3 所示的習知處理液供給系統,包含儲存處理液並利用光阻塗佈 置等構件對上位裝置供給處理液的L/e (liquidend)容器50,以 及用來對該L/E谷器50補充處理液的2個緩衝容器51、52。 L/E容H 5G連翻綱53而可在輸人載體氣制容器内盘 釋放(排放)容器内壓力之間作切換。 籲 神’在對上位裝置供、給處理液時,操作切換閥53以將載體[Technical Field] The present invention relates to a processing liquid supply system for supplying a processing liquid such as a photoresist or a solvent used in a lithography step, and a processing liquid supply method. 4 [Prior Art] After forming a predetermined film on a substrate to be processed such as a glass substrate, for example, in a FPD hybrid process, a photo-resistance agent (hereinafter referred to as photoresist) is applied to form a photoresist film, and the circuit pattern is applied to the photoresist. The film is exposed to form a circuit pattern by so-called development processing, that is, micro-φ. In the lithography step, a supply system of a treatment liquid such as a photoresist supply system or a solvent for dissolving a photoresist is required. Therefore, Patent Document 1 discloses an embodiment in which a supply of a treatment liquid and a buffer container are provided. Again, as shown in Figure 3, there are also embodiments in which two buffer containers are used. The conventional processing liquid supply system shown in FIG. 3 includes an L/e (liquidend) container 50 for storing a processing liquid and supplying a processing liquid to the upper device by means of a photoresist coating arrangement, and the like, and for the L/E valley. The device 50 replenishes the two buffer containers 51 and 52 of the treatment liquid. The L/E capacity H 5G can be switched between the pressures in the container of the release (discharge) of the inner carrier gas container. Calling God's operation of the switching valve 53 to supply the carrier liquid to the upper device

氣體供給到L/E容器50内,對L/E容器5〇内加壓。藉此,L /E谷器50内的處理液L便能夠供給到上位裝置。 另一方面,因為處理液供給到上位裝置,L/E容器5〇内的 處理液L減少’而需要在l/E容1 5G關充纽液L時,利用 切換閥53釋放容器内的壓力,使其處於能夠補充的狀態。 又,L/E容器50設有監視所儲存之處理液的既定液面位置 (充填完畢位置、需要補充位置)並檢測儲存殘量的殘量感應器 70 ° 亦即’L/E容器5〇的處理液L的補充/完成時點,是根據 該殘量感應器70的檢測結果。 201029751 當對L/E容斋50内部補充處理液L時,將控制L/E容器 5〇與緩衝容器51、52之間的連通狀態的閥門54開啟。該闕^ 54 在2個緩衝容器51、52之中利用切換閥55選擇其中一^來供給 處理液L 〇 八口 該緩衝容器51、52連接切換載體氣體的輸入與釋放(排放) 的切換閥56、57,在對L/E容器50作補充時係利用載體顏 緩衝容器51、52内部加壓。又,緩衝容器51、52 由設置壓力調整閥60、61以防止其過度上升。 曰 又,緩衝容器51、52跟L/E容器50同樣設有檢測儲存 的複數殘量感應器71、72。 吾人可開啟设置在處理液L的補充管上的閥門% (59),以 對緩衝容器51 (52)補充處理液’在此同時該切換閥允(57 換到排放側。 [習知技術文獻] [專利文獻] [專利文獻1]日本特開2001-230191號公報 【發明内容】 [發明所欲解決的問題] 曰在圖3所示的習知供給系統中,當L/E容器5〇内的 殘量變少時,會從緩衝容器51、52的其中一個對l/e容\ 補充處理液。 ° ^ 然而,在實行對L/E容器50的補充作業期間, 〇内的壓力被釋放’故無法對上位裝置供給處理液。因此 ^ 不中斷上位步驟,延遲產出間隔時間。 亏 容器 惟 對於該問題,吾人嘗試以複數階段的方式檢測在 中的處理液殘量’藉由增加補充的次數以縮短各補充時間, 仍…、法完全消除不能對上位裝置供給處理液的問題。 有鑑於該等問題’本發明之目的在於提供—種處理液供 、、克以及處魏供給方法,其驗舰定纽㈣裝給 201029751 if内的該處理液,即使在對該裝置供給處理液時,也能夠對該 谷器補充處理液,故能夠防止產出間隔時間的延遲。 [解決問題之技術手段] 翁ίΖΐ賴嶋,本發日狀處理祕m對使瓶定處 給該處理液’包含:處理缝存容11,其儲存該處 兮處理液送到孩裝置;處理液補充機構,其將甩來對 存各器進行補充的處理液,經由補充管路供給到該處 ;剛,其讓該補絲路開通或餘;第一壓力調 ίΐ厭ΐϊ處理液儲存容器内的壓力調整為第—壓力値;以 •該第:厭構’其將該處理液補充機構侧的壓力調整為比 儲存容器供’謂贿雜補錢麵該處理液 存容i連ίί^ίΐΐ機構宜具備透過該補充管路與該處理液儲 器’該第一機構宜 卢裡ϊ由ί等構造’無論魏理液儲存容器是研上位裝置供办 ί的ί力勤經常處於比處理液儲存容ΐ ❹從緩衝容器儲=器====門開啟時便能夠 處理液殘既Jf檢測機構’其檢測該處理液儲存容器的 構的檢漸姑偷構’魏據域量檢測機 變少充=在處理韻存容器的殘量 充管路對儲存既定處理^並將處理液供給方法’係透過補 的處理液儲存容器補充該處=處該處理液的裝置 处里/夜包含.將該處理液儲存容器的 201029751 壓力3周整為弟一麗力値的步驟;將& 游側的塵力調整為比㈣閉該補充管路的閥門更上 及在需要力値更高的第二勤㈣步驟’·以 驟。 Μ 、儲存各為'補充該處理液時開啟該閥門的步 處理處理液铸存容器是否對上位裝置供給 ί ^力的壓力經常處於比處理液儲存容器 從緩衝容^产理ί找ΐϊ,當該補充管路的閥門開啟時便能夠 錢衝今輯處理賴存容器自動供給處職。 位步ί此故ϊίίΐίΐ液儲存容器補充處理液時也無須中斷上 4/驟故此夠防止產出間隔時間的延遲9 閥門ί啟要Ϊ該處理液儲存容器補充該處理液時而將該 既定量,測该處理液儲存容器的處理液殘量是否在 並根據該檢測結果控制糊門的開啟或關閉。 理潘ϊϊΐί容11⑽處理液殘量或__,便能夠在處 的殘量變少時自細充處職,進行充填而自動ϊ [對照先前技術之功效] 佳用提供種處理液供給系統以及處理液供給方法,其對 理液的裝置供給容器内所儲存的處理液,即使在對該 ^時時,也㈣爾峨綱,進而防止產出 【實施方式】 圖1係表示本發明 ,例如微影步驟,所 以下’根據圖示説明本發明之實施態樣。 之處理液供給系統的構造的示意電路圖。 圖示的處理液供給系統100,係上位步驟 使用的處理液供給系統。 圖示的處理液供給系統100,包含:用來對上位步驟(上位裝 时處理液L而將處理液L儲存起來的L/EGiquidend)容 态i〔處理液儲存容器),以及用來將處理液匕補充到該^/E容 201029751 器1内的緩衝容器2 (處理液補充裝置)。 又,緩衝容器2的容積宜比具備既定容積(例如2公升)的l /E容器1更大很多(例如1〇公升)。 一L/E容器1連接著:供給管路3,其用來對上位裝置(未經 圖不)供給處理液L ;補充管路4,其成為緩衝容器2的處理液[ 的供給路徑;以及容器壓控制管路5,其對L/E容器i内加壓 將壓力釋放(排放)。 —。又,在該補充管路4上設有開啟或關閉管路的閥門7,從緩衝The gas is supplied into the L/E container 50, and the inside of the L/E container 5 is pressurized. Thereby, the processing liquid L in the L/E grain 50 can be supplied to the upper device. On the other hand, since the treatment liquid is supplied to the upper device, the treatment liquid L in the L/E container 5 is reduced, and it is necessary to release the pressure in the container by the switching valve 53 when the l/E capacity is 5G to close the liquid L. To make it in a state that can be replenished. Further, the L/E container 50 is provided with a residual sensor 70° which is a predetermined liquid level position (filling completion position, need to be replenished position) of the stored processing liquid and detects the remaining amount of storage, that is, 'L/E container 5〇 The replenishment/completion time of the treatment liquid L is based on the detection result of the residual amount sensor 70. 201029751 When the treatment liquid L is internally replenished to the L/E Rongzhai 50, the valve 54 that controls the communication state between the L/E container 5 and the buffer containers 51, 52 is opened. The switch 54 selects one of the two buffer containers 51 and 52 by the switching valve 55 to supply the processing liquid L. The buffer containers 51 and 52 are connected to the switching valve for switching the input and discharge (discharge) of the carrier gas. 56, 57, when the L/E container 50 is replenished, the inside of the carrier buffer tanks 51, 52 is pressurized. Further, the buffer containers 51, 52 are provided with pressure regulating valves 60, 61 to prevent them from rising excessively. Further, the buffer containers 51, 52 are provided with the plurality of residual sensors 71, 72 for detecting and storing, similarly to the L/E container 50. We can open the valve % (59) set on the supplementary pipe of the treatment liquid L to supplement the treatment liquid of the buffer container 51 (52). At the same time, the switching valve is allowed to change to the discharge side. [Technical Literature [Patent Document 1] [Patent Document 1] JP-A-2001-230191 SUMMARY OF INVENTION [Problems to be Solved by the Invention] In the conventional supply system shown in Fig. 3, when the L/E container 5〇 When the residual amount is small, the treatment liquid is supplied to the l/e from one of the buffer containers 51, 52. ° ^ However, during the supplementary operation of the L/E container 50, the pressure in the crucible is released. 'Therefore, it is impossible to supply the processing liquid to the upper device. Therefore, the upper step is not interrupted, and the interval between the productions is delayed. For the problem, for this problem, we try to detect the residual amount of the treatment liquid in the plural stage' by adding The number of times is shortened for each replenishment time, and the method completely eliminates the problem that the treatment liquid cannot be supplied to the upper device. In view of the above problems, the object of the present invention is to provide a treatment liquid supply, a gram, and a supply method. Its ship inspection When the treatment liquid in the 201029751 if is supplied to the apparatus, the treatment liquid can be replenished to the granule, so that the delay in the production interval can be prevented. [Technical means for solving the problem]嶋, the present day processing secret m to make the bottle to the treatment liquid 'contains: the processing seam storage capacity 11, which stores the treatment liquid to the child device; the treatment liquid replenishing mechanism, which will be stored The processing liquid supplemented by each device is supplied to the place through the supplementary line; just, the line is opened or left; the pressure in the first pressure adjustment and the treatment liquid storage container is adjusted to the first pressure 値; In order to adjust the pressure on the side of the replenishing mechanism to be more than the storage container for the treatment liquid storage, the mechanism should be provided through the supplemental line. The treatment liquid reservoir 'the first mechanism is suitable for Luri ϊ by ί et al. 'Whether the Wei Li liquid storage container is a higher-level device for handling ί 力 力 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常 经常==== When the door is open, it can handle the liquid Both the Jf detection mechanism's detection of the structure of the treatment liquid storage container is smashed. The Wei-Zhen-quantity detection machine becomes less and less charge = the remaining amount of the processing container is stored in the pipeline to store the predetermined treatment ^ and the treatment liquid The supply method is supplemented by the replenishing treatment liquid storage container. The device at the place where the treatment liquid is contained is included in the night/night. The pressure of the 201029751 pressure of the treatment liquid storage container is 3 weeks. The dust side of the swimming side is adjusted to be higher than (4) closing the valve of the supplementary line and the second step (4) of the need for higher force. · Storing, storing each of the 'refilling the treatment liquid The step of processing the valve to process whether the liquid casting container is supplied to the upper device is often at a higher pressure than the processing liquid storage container, and when the valve of the supplementary pipe is opened, it can be used for money. The series handles the automatic supply of the storage container. Bit step ί ϊ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 储存 储存 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ / / / / / / / / / / / / / / / / / / / / And measuring whether the residual amount of the treatment liquid of the treatment liquid storage container is and controlling the opening or closing of the paste door according to the detection result. Ϊϊΐ潘ϊϊΐ 容容11(10) The amount of liquid residue or __ can be self-sufficient when the residual amount is reduced, and the filling is automatically performed. [Compared with the efficacy of the prior art] The utility model provides a treatment liquid supply system and treatment. In the liquid supply method, the treatment liquid stored in the container is supplied to the treatment liquid in the container, and even when it is used, the product is prevented from being produced. [Embodiment] FIG. 1 shows the present invention, for example, micro. The steps of the present invention will be described below with reference to the drawings. A schematic circuit diagram of the configuration of the processing liquid supply system. The processing liquid supply system 100 shown in the figure is a processing liquid supply system used in the upper step. The processing liquid supply system 100 shown in the drawing includes: a L/EGiquid end for the upper step (the L/EGiquidend for storing the processing liquid L in the upper loading process), and a processing liquid storage container for processing The liquid helium is supplied to the buffer tank 2 (treatment liquid replenishing device) in the apparatus 1 of the ^/E capacity 201029751. Further, the volume of the buffer container 2 is preferably much larger than that of the l/E container 1 having a predetermined volume (for example, 2 liters) (for example, 1 liter liter). An L/E container 1 is connected to a supply line 3 for supplying a treatment liquid L to a host device (not shown), and a supply line 4 which serves as a supply path for the treatment liquid of the buffer container 2; The container pressure control line 5, which pressurizes the inside of the L/E container i, releases (discharges) the pressure. —. Moreover, a valve 7 for opening or closing the pipeline is provided on the supplementary line 4, from the buffer

容器2,L/E容器1補充處理液時將閥門7開啟,除此以外處於 關閉狀態。 .. 又,一端連接L/E容器1的該容器壓控制管路5的另一端, ^置可切換到排放管8或氣體供給f 9 _換閥1G。該氣體供給 & 9供^用來對l/e容器i内部加壓的載體氣體(例如n2氣體)。In the container 2, when the L/E container 1 replenishes the treatment liquid, the valve 7 is opened, and otherwise it is in a closed state. Further, the other end of the container pressure control line 5, which is connected to the L/E container 1 at one end, can be switched to the discharge pipe 8 or the gas supply f 9 _ valve 1G. The gas supply & 9 is used to supply a carrier gas (for example, n2 gas) for pressurizing the inside of the l/e container i.

,氣體供給管9設有在利用該氣體供給管9的載體氣體對L 容器1内部加壓時,將L/E容器!⑽壓力調整為預設麗力 値(例如0.2MPa)的精密調節器12 (第一壓力調整機構)。 藉由設置該精密調節H Π,即使在從L/E容器i供給處理 液到亡位裝置的過財緩衝容H 2開始供給處理液,L/E容器r 内的壓力也不^生魏,樣鋪定崎上錄置供給處理液。 4 ^,L/E容器1設有監視所儲存之處理液L❾既定液面位置 13 需要補充位置),並檢測儲存殘量的殘量感應器 13、14 (殘量檢測機構)。 ^ β加麼或釋放(排放)麼力的容器壓控制管路16。 ’更連射路17,魏有用來防止緩衝容器2内的嚴力 過度上升的壓力調整閥24。 、雙力 門設有用來開閉該管路15的閥門18,開啟該闕 門18,便可對緩衝容器2内供給新的處理液L。 閹 又,端連接該緩衝容器2的該容器磨控制管路16的另一 201029751 端’ ΪίΓ刀換到排放管19或氣體供、给管20的切換閥2卜 (例:管2°對緩衝容器2内供給用來加壓的載體氣體 緩衝管有在利用該氣體供給管2g的載體氣體對 的調㈣23 (第:壓力調整機構)。該壓力値設 ’ 各器1内的壓力値(例如〇.2MPa)更高。 並檢:處理液L的既定液面位置 _ 祕理液供給系統1〇0中,該殘量感應器13、14、25、26 (控fUt輪出到控繼系統刚的各閥門的動作的控制部40 動作接著’根細2的流程,説明處理液供給系統1〇〇 —連串的 瞎液供給系、统廟+,當需要對上位裝置供給處理液 9侧,將靜) ’控制部*將切綱1G切制氣體供給管 體導入L/E容器1内以對容器1内部加壓。在此, 12的動作,將L/E容器i内 定値(例如0.2MPa)。 J ^ 的步載體氣體的壓力對上位裝置供給處理液L (圖2 旌哭紋1内的處理_量減少岐要槪狀態被殘量感 二鬥檢測到時(圖2的步驟ST3),控制部40開啟該補充管i 4的閥門7,讓L/E容器1與緩衝容器2連通。 丨?ί,於緩衝容器2中,容器壓控制管路16的切換閥21開 體供 =管20侧’利用調節器23的動作,緩衝容器2内开】 成t /E谷器1内更高的既定壓力値(例如〇.3Mpa)。 ^此,在L/E容器i與緩衝容器2之間,產生既定的壓力 (例如O.IMPa) ’若此時開啟補充管路4的閥門7,處理 缓衝容器2向L/E容器丨(亦即從壓力値高 g 201029751 流去,處理液L便補充到L/E容器1内部(圖2的步驟ST4)。The gas supply pipe 9 is provided with an L/E container when the inside of the L container 1 is pressurized by the carrier gas by the gas supply pipe 9! (10) The pressure regulator is a preset precision adjuster 12 (first pressure adjustment mechanism) of Lili (for example, 0.2 MPa). By providing the fine adjustment H Π , even if the treatment liquid is supplied from the L/E container i to supply the treatment liquid to the waste buffer H 2 of the severance device, the pressure in the L/E container r is not generated. The sample shop is ordered to supply the processing liquid. 4 ^, the L/E container 1 is provided with a residual sensor 13 and 14 (residue detecting means) for monitoring the stored processing liquid L, the predetermined liquid level position 13 (required supplementary position), and detecting the remaining amount. ^ β plus or release (discharge) the force of the container pressure control line 16. Further, there is a pressure regulating valve 24 for preventing the excessive force in the buffer container 2 from excessively rising. The double-forced door is provided with a valve 18 for opening and closing the line 15, and when the door 18 is opened, a new processing liquid L can be supplied into the buffer container 2. Further, the other end of the container mill control line 16 of the buffer container 2 is connected to the discharge pipe 19 or the switching valve 2 of the gas supply and supply pipe 20 (for example, the pipe 2° is buffered) The carrier gas buffer tube for supplying pressure in the container 2 has a regulation (four) 23 (first: pressure adjustment mechanism) for the carrier gas pair using the gas supply tube 2g. The pressure is set to 'pressure 値 in each of the devices 1 (for example) 〇.2MPa) is higher. Check: the predetermined liquid level position of the treatment liquid L _ the secret liquid supply system 1〇0, the residual amount sensor 13, 14, 25, 26 (control fUt to the control system) The operation of the control unit 40 for the operation of each of the valves is followed by the flow of the "root 2", and the series of the sputum supply system and the system + are described in the processing liquid supply system 1 ,, and it is necessary to supply the processing liquid 9 to the upper device. The control unit* introduces the 1G cutting gas supply pipe into the L/E container 1 to pressurize the inside of the container 1. Here, the action of 12 defines the L/E container i (for example) 0.2MPa). The pressure of the step carrier gas of J ^ is supplied to the upper device to the treatment liquid L (Fig. 2 Treatment within the crying 1) When the state of the remaining state is detected by the residual sensor (step ST3 of FIG. 2), the control unit 40 opens the valve 7 of the supplementary pipe i4 to allow the L/E container 1 to communicate with the buffer container 2. 丨? In the buffer container 2, the switching valve 21 of the container pressure control line 16 is opened for the side of the tube 20, and the operation of the regulator 23 is used, and the inside of the buffer container 2 is opened. The higher the predetermined pressure in the t/E grain unit 1 (eg 〇.3Mpa). ^This, between the L/E container i and the buffer container 2, a predetermined pressure (for example, O.IMPa) is generated. 'If the valve 7 of the supplementary line 4 is opened at this time, the buffer container is processed. 2 to the L/E container 丨 (that is, from the pressure 値 high g 201029751, the treatment liquid L is replenished into the inside of the L/E container 1 (step ST4 of Fig. 2).

像這樣對L/E容器1補充處理液與對上位裝置供給處理液同 時進行,當對上位裝置供給處理液先完成時(圖2的步驟ST5), 將L/E容器1的切換閥1〇切換到排放管8侧。藉此釋放L/E 容器1内的壓力’更有效率地讓L/E容器i的補充作業繼續下去 (圖2的步驟ST6)。 之後,當殘量感應器13檢測到L/E容器1的處理液乙已嫉 充填好時,控制部40關閉補充管路4的閥門7,完成充填作g 2的步驟ST7)。 ” ❹从另外^ f步驟ST5中,在對上位裝置供給處理液完成之前, 若L/E容器1的處理液l充填作業完成乂圖2的步驟ST8) 制部40便關閉補充管路4的閥門7。 工 然後’當對上位裝置供給處理液完成之後,便停止供給管路3 的閥門(未經圖示)的動作(圖2的步驟ST9)。When the processing liquid is supplied to the L/E container 1 and the processing liquid is supplied to the upper device in this manner, when the processing liquid is supplied to the upper device first (step ST5 in FIG. 2), the switching valve 1 of the L/E container 1 is turned on. Switch to the side of the discharge pipe 8. Thereby, the pressure in the L/E container 1 is released, and the replenishing operation of the L/E container i is more efficiently continued (step ST6 of Fig. 2). Thereafter, when the residual sensor 13 detects that the processing liquid B of the L/E container 1 has been filled, the control unit 40 closes the valve 7 of the replenishing line 4, and completes the step ST7) of filling g2.另外 From the other step f5, before the completion of the supply of the treatment liquid to the upper device, if the processing liquid 1 of the L/E container 1 is completed, the process unit 40 closes the replenishing line 4. The valve 7. Then, when the supply of the treatment liquid to the upper device is completed, the operation of the valve (not shown) of the supply line 3 is stopped (step ST9 of Fig. 2).

因此’即使在對L/E容器!補 ,力更南的狀態。因此,當補充管路4的閥門7 自動地從缓衝容器2對L/E容器1供給處理液L。 補充處理液時也無須中斷上位步 务遲。 係設置緩衝容器2作為對L/E容器i 驟,故能夠防止產出間隔時間的延遲。 又,在該實施態樣中,儀設晉 11 201029751 供給處理液的處理液補充機構’惟在本發明的卢 中,並非以此為限,不使用緩衝容器2也备=液供給系統100 對補充管路4供給處理液L的機構即可。…明,只要設置能夠 又,在該實施態樣中,係設置精密調節器12將 内的壓力調整為徽壓力値,惟在本發明之處理液供^ = 1 =該態樣為限。例如’也可以利用壓力感應以’ 出壓作回饋控制。藉由該等構造,便能夠以高精確度 & 1内的壓力更穩定。 /谷态 【圖式簡單說明】 圖1係表示本發明之處理液供給系統的構造的示意電路圖。 圖 圖2係表示在圖1的處理液供給系統中的/連串動作的流程 圖3係表示習知處理液供給系統之構造的杀意電路圖 【主要元件符號說明】 L/E谷器(處理液儲存容器) 緩衝容器(處理液補充機構) 1 2 3 4 5 7 8 9 10 12 13 14 15 ❹ 供給管路 補充管路 容器壓控制管路 閥門 排放管 氣體供給管 切換閥 ,,節器(第-壓_整機構) 殘1感應器 殘量感應器 補充管路 12 201029751So 'even in the L/E container! Complement, the state of force is more south. Therefore, when the valve 7 of the replenishing line 4 automatically supplies the treatment liquid L to the L/E container 1 from the buffer container 2. There is no need to interrupt the upper step when replenishing the treatment liquid. Since the buffer container 2 is provided as the pair L/E container, the delay in the production interval can be prevented. Further, in this embodiment, the processing liquid replenishing mechanism for supplying the treatment liquid to the apparatus 11 201029751 is only limited to the present invention, and the buffer tank 2 is not used. The mechanism for supplying the treatment liquid L to the supply line 4 may be sufficient. In the embodiment, the pressure inside the precision adjuster 12 is adjusted to the emblem pressure 値, but the treatment liquid of the present invention is supplied with ^ = 1 = the state is limited. For example, it is also possible to use pressure sensing to pressurize the feedback control. With these configurations, the pressure within the high precision & 1 can be more stabilized. / Valley state [Schematic description of the drawings] Fig. 1 is a schematic circuit diagram showing the configuration of the processing liquid supply system of the present invention. FIG. 2 is a flow chart showing the configuration of the conventional processing liquid supply system in the flow of the processing liquid supply system of FIG. 1 (the main component symbol description) L/E valley device (processing) Liquid storage container) Buffer container (treatment liquid replenishing mechanism) 1 2 3 4 5 7 8 9 10 12 13 14 15 ❹ Supply line replenishing line container pressure control line valve discharge tube gas supply tube switching valve, First-pressure_complete mechanism) Residual 1 sensor residual sensor supplement pipeline 12 201029751

16 容器壓控制管路 17 排放管路 18 閥門 19 排放管 20 氣體供給管 21 切換閥 23 精密調節器(第二壓力調整機構) 24 壓力調整閥 25 殘量感應器 26 殘量感應器 40 控制部(控制機構) 50 L/E容器 51 鍰衝容器 52 緩衝容器 53 切換閥 54 閥門 55 切換閥 56 切換閥 57 切換閥 58 閥門 59 閥門 60 壓力調整閥 61 壓力調整閥 70 殘量感應器 71 殘量感應器 72 殘量感應器 100 處理液供給系統 L 處理液 1316 Container pressure control line 17 Discharge line 18 Valve 19 Discharge tube 20 Gas supply tube 21 Switching valve 23 Precision regulator (second pressure adjustment mechanism) 24 Pressure regulator valve 25 Residual sensor 26 Residual sensor 40 Control unit (Control mechanism) 50 L/E container 51 buffer container 52 Buffer container 53 Switching valve 54 Valve 55 Switching valve 56 Switching valve 57 Switching valve 58 Valve 59 Valve 60 Pressure regulating valve 61 Pressure regulating valve 70 Residual sensor 71 Residual Sensor 72 residual sensor 100 treatment liquid supply system L treatment liquid 13

Claims (1)

201029751 七、申請專利範圍: 1. 一種處理液供給系統,用以對使用既定處理液的裝置供终診卢 理液,包含♦ 卢,理液儲存容器,用以儲存該處理液,並對該裝置送出誃 處理液補充機構,用以將用來對該處理液儲存容哭一 充的處理液,透過補充管路供應給該處理液儲存容器1行補 閥門,用以令該補充管路開通或閉塞; ° ’ 調整為 调整為 第一壓力調整機構,將該處理液儲存容器内 第一壓力値;以及' 第二壓力調整機構,將該處理液補充機構側 比該第一壓力値更高的第二壓力値; 发刀 藉由將該閥門開啟,而從該處理液儲存容哭# 並從該處理液補充機構對該處理液“; 2. 如申請專利範圍第1項之處理液供給系統,A中, 該處理液補充機構具備緩衝容器,其透^ 處理液儲存容器連通並儲存該處理液; 補充s路與該 力値該第二壓賴整機構將賊衝容_部输域第二壓 3. 如申請專利範圍第i或2項之處理液供給系统, 殘量檢測機構,其檢測該處理潘健六a ,、中更包含: 否為既定_存容11的處理液殘量是 的開Ϊ制機構’其根據該殘量檢測機構的檢測結果控制該闕門 4. 二種處理液供給方法,其透過補充管路 並將該處理液送到使用該處理液的褒=儲存既定處理液 充該處理液,包含·· 置的處理液儲存容器補 第一勤_整步驟,其將該處理液儲存容器的壓力調整 14 .201029751 為第一壓力値 第二壓力値調整步驟,將較開閉該補充 游侧,力,調整為比該第一歷力値更高的二用的^更上 液時將該閥門開啟。 处欣傅存谷态補充該處理 5·如申Ϊ氕f圍第4項之處理液供給方法,其中, 啟步^,檢容雜充贿理㈣,於該閥門開 Φ 里並根據該檢測的結果控制該閥門的開閉。 既疋 八、圖式: ⑩ 15201029751 VII. Patent application scope: 1. A processing liquid supply system for supplying the final treatment solution to the device using the predetermined treatment liquid, including ♦ Lu, a liquid storage container for storing the treatment liquid, and The device sends out a treatment liquid replenishing mechanism for supplying the treatment liquid for storing the treatment liquid to the filling liquid, and supplying the treatment liquid storage container with a supplementary line through the supplementary pipeline to make the supplementary pipeline open. Or occlusion; ° 'adjusted to adjust to a first pressure adjustment mechanism, the first pressure 内 in the treatment liquid storage container; and 'the second pressure adjustment mechanism, the treatment liquid replenishing mechanism side is higher than the first pressure 値The second pressure 値; the knife is opened from the treatment liquid, and the treatment liquid is stored from the treatment liquid and the treatment liquid is supplied from the treatment liquid supply mechanism; 2. The treatment liquid supply according to the first application of the patent scope In the system, A, the treatment liquid replenishing mechanism is provided with a buffer container, and the treatment liquid storage container is connected to and stores the treatment liquid; the s road is supplemented with the force, and the second pressure is applied to the thief. The second pressure in the transfusion field 3. As in the treatment liquid supply system of the i or 2 patent application scope, the residual quantity detecting mechanism detects the processing of Pan Jianliu a, and the middle contains: No is the processing of the predetermined_capacity 11 The liquid residual amount is an opening mechanism that controls the card according to the detection result of the residual amount detecting mechanism. 4. The two processing liquid supply methods pass through the supplementary line and send the processing liquid to the use of the processing liquid.褒=Storing the predetermined treatment liquid to fill the treatment liquid, and the treatment liquid storage container containing the first treatment step is completed, and the pressure of the treatment liquid storage container is adjusted to 14.201029751 as the first pressure 値 second pressure 値In the adjustment step, the supplementary swimming side is opened and closed, and the force is adjusted to be higher than the first calendar force. When the liquid is used, the valve is opened. The Xin Fucun Valley supplements the treatment.氕f, the fourth method of the treatment liquid supply method, wherein, the start step ^, check the tolerance of the bribe (4), in the valve opening Φ and according to the results of the test to control the opening and closing of the valve. : 10 15
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