TWI828504B - 供給裝置、供給系統 - Google Patents
供給裝置、供給系統 Download PDFInfo
- Publication number
- TWI828504B TWI828504B TW112100005A TW112100005A TWI828504B TW I828504 B TWI828504 B TW I828504B TW 112100005 A TW112100005 A TW 112100005A TW 112100005 A TW112100005 A TW 112100005A TW I828504 B TWI828504 B TW I828504B
- Authority
- TW
- Taiwan
- Prior art keywords
- supply
- liquid
- area
- processing liquid
- pipe
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims abstract description 343
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 238000011084 recovery Methods 0.000 claims abstract description 82
- 238000005192 partition Methods 0.000 claims abstract description 64
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 description 12
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
Landscapes
- Weting (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Telephone Function (AREA)
- Feeding Of Articles To Conveyors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-148850 | 2021-09-13 | ||
| JP2021148850A JP7438172B2 (ja) | 2021-09-13 | 2021-09-13 | 供給装置、供給システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202318481A TW202318481A (zh) | 2023-05-01 |
| TWI828504B true TWI828504B (zh) | 2024-01-01 |
Family
ID=85478152
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112100005A TWI828504B (zh) | 2021-09-13 | 2022-09-08 | 供給裝置、供給系統 |
| TW111133987A TWI793054B (zh) | 2021-09-13 | 2022-09-08 | 供給裝置、供給系統 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111133987A TWI793054B (zh) | 2021-09-13 | 2022-09-08 | 供給裝置、供給系統 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12318803B2 (enExample) |
| JP (1) | JP7438172B2 (enExample) |
| KR (1) | KR102718065B1 (enExample) |
| CN (1) | CN115810563B (enExample) |
| TW (2) | TWI828504B (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201819685A (zh) * | 2016-09-30 | 2018-06-01 | 日商斯庫林集團股份有限公司 | 基板處理裝置 |
| CN111905412A (zh) * | 2019-05-10 | 2020-11-10 | 杉野机械股份有限公司 | 液体处理装置以及液体处理方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08174420A (ja) * | 1994-12-26 | 1996-07-09 | Fuji Oozx Inc | 水溶性研削液の自動補充装置 |
| JP2001062669A (ja) | 1999-08-24 | 2001-03-13 | Nikon Corp | 加工方法およびその装置 |
| JP3761457B2 (ja) | 2001-12-04 | 2006-03-29 | Ｎｅｃエレクトロニクス株式会社 | 半導体基板の薬液処理装置 |
| JP2007258462A (ja) | 2006-03-23 | 2007-10-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| JP5477375B2 (ja) * | 2009-03-31 | 2014-04-23 | 栗田工業株式会社 | エッチング液の処理装置及び処理方法 |
| KR101255018B1 (ko) * | 2010-06-07 | 2013-04-16 | 쿠리타 고교 가부시키가이샤 | 세정 시스템 및 세정 방법 |
| CN103094151B (zh) * | 2011-10-27 | 2015-07-22 | 沈阳芯源微电子设备有限公司 | 一种化学液回收装置 |
| KR101380494B1 (ko) * | 2011-12-27 | 2014-04-01 | 시바우라 메카트로닉스 가부시끼가이샤 | 기판의 처리 장치 및 처리 방법 |
| JP6010457B2 (ja) | 2012-12-28 | 2016-10-19 | 東京エレクトロン株式会社 | 液処理装置および薬液回収方法 |
| US10046371B2 (en) * | 2013-03-29 | 2018-08-14 | Semes Co., Ltd. | Recycling unit, substrate treating apparatus and recycling method using the recycling unit |
| JP6502633B2 (ja) | 2013-09-30 | 2019-04-17 | 芝浦メカトロニクス株式会社 | 基板処理方法及び基板処理装置 |
| JP6022431B2 (ja) * | 2013-10-17 | 2016-11-09 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
| JP6839990B2 (ja) * | 2017-01-31 | 2021-03-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理液供給装置、基板処理装置、および処理液供給方法 |
| US20190203342A1 (en) * | 2017-12-29 | 2019-07-04 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Cooling system and evaporation machine |
| JP6869306B2 (ja) * | 2019-09-30 | 2021-05-12 | 月島機械株式会社 | 熱媒体利用機器への熱媒体供給方法及び熱媒体利用設備 |
-
2021
- 2021-09-13 JP JP2021148850A patent/JP7438172B2/ja active Active
-
2022
- 2022-08-31 KR KR1020220109877A patent/KR102718065B1/ko active Active
- 2022-09-05 CN CN202211095050.3A patent/CN115810563B/zh active Active
- 2022-09-08 TW TW112100005A patent/TWI828504B/zh active
- 2022-09-08 TW TW111133987A patent/TWI793054B/zh active
- 2022-09-12 US US17/942,786 patent/US12318803B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201819685A (zh) * | 2016-09-30 | 2018-06-01 | 日商斯庫林集團股份有限公司 | 基板處理裝置 |
| CN111905412A (zh) * | 2019-05-10 | 2020-11-10 | 杉野机械股份有限公司 | 液体处理装置以及液体处理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115810563A (zh) | 2023-03-17 |
| JP2023041461A (ja) | 2023-03-24 |
| KR20230039533A (ko) | 2023-03-21 |
| US12318803B2 (en) | 2025-06-03 |
| TW202312240A (zh) | 2023-03-16 |
| TWI793054B (zh) | 2023-02-11 |
| CN115810563B (zh) | 2025-07-08 |
| US20230081295A1 (en) | 2023-03-16 |
| JP7438172B2 (ja) | 2024-02-26 |
| KR102718065B1 (ko) | 2024-10-15 |
| TW202318481A (zh) | 2023-05-01 |
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