JP7438172B2 - 供給装置、供給システム - Google Patents

供給装置、供給システム Download PDF

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Publication number
JP7438172B2
JP7438172B2 JP2021148850A JP2021148850A JP7438172B2 JP 7438172 B2 JP7438172 B2 JP 7438172B2 JP 2021148850 A JP2021148850 A JP 2021148850A JP 2021148850 A JP2021148850 A JP 2021148850A JP 7438172 B2 JP7438172 B2 JP 7438172B2
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JP
Japan
Prior art keywords
processing liquid
region
supply
pipe
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021148850A
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English (en)
Japanese (ja)
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JP2023041461A (ja
JP2023041461A5 (enExample
Inventor
正明 古矢
浩秋 小林
秀樹 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2021148850A priority Critical patent/JP7438172B2/ja
Priority to KR1020220109877A priority patent/KR102718065B1/ko
Priority to CN202211095050.3A priority patent/CN115810563B/zh
Priority to TW112100005A priority patent/TWI828504B/zh
Priority to TW111133987A priority patent/TWI793054B/zh
Priority to US17/942,786 priority patent/US12318803B2/en
Publication of JP2023041461A publication Critical patent/JP2023041461A/ja
Publication of JP2023041461A5 publication Critical patent/JP2023041461A5/ja
Application granted granted Critical
Publication of JP7438172B2 publication Critical patent/JP7438172B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials

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  • Weting (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Telephone Function (AREA)
  • Feeding Of Articles To Conveyors (AREA)
JP2021148850A 2021-09-13 2021-09-13 供給装置、供給システム Active JP7438172B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム
KR1020220109877A KR102718065B1 (ko) 2021-09-13 2022-08-31 공급 장치, 공급 시스템
CN202211095050.3A CN115810563B (zh) 2021-09-13 2022-09-05 供给装置、供给系统
TW111133987A TWI793054B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統
TW112100005A TWI828504B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統
US17/942,786 US12318803B2 (en) 2021-09-13 2022-09-12 Supply device and supply system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Publications (3)

Publication Number Publication Date
JP2023041461A JP2023041461A (ja) 2023-03-24
JP2023041461A5 JP2023041461A5 (enExample) 2023-06-13
JP7438172B2 true JP7438172B2 (ja) 2024-02-26

Family

ID=85478152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021148850A Active JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Country Status (5)

Country Link
US (1) US12318803B2 (enExample)
JP (1) JP7438172B2 (enExample)
KR (1) KR102718065B1 (enExample)
CN (1) CN115810563B (enExample)
TW (2) TWI828504B (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003174004A (ja) 2001-12-04 2003-06-20 Nec Electronics Corp 半導体基板の薬液処理装置
JP2014130954A (ja) 2012-12-28 2014-07-10 Tokyo Electron Ltd 液処理装置および薬液回収方法
JP2015135943A (ja) 2013-09-30 2015-07-27 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174420A (ja) * 1994-12-26 1996-07-09 Fuji Oozx Inc 水溶性研削液の自動補充装置
JP2001062669A (ja) 1999-08-24 2001-03-13 Nikon Corp 加工方法およびその装置
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5477375B2 (ja) * 2009-03-31 2014-04-23 栗田工業株式会社 エッチング液の処理装置及び処理方法
KR101255018B1 (ko) * 2010-06-07 2013-04-16 쿠리타 고교 가부시키가이샤 세정 시스템 및 세정 방법
CN103094151B (zh) * 2011-10-27 2015-07-22 沈阳芯源微电子设备有限公司 一种化学液回收装置
KR101380494B1 (ko) * 2011-12-27 2014-04-01 시바우라 메카트로닉스 가부시끼가이샤 기판의 처리 장치 및 처리 방법
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6839990B2 (ja) * 2017-01-31 2021-03-10 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
US20190203342A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Cooling system and evaporation machine
US20200354241A1 (en) * 2019-05-10 2020-11-12 Sugino Machine Limited Liquid treatment apparatus and liquid treatment method
JP6869306B2 (ja) * 2019-09-30 2021-05-12 月島機械株式会社 熱媒体利用機器への熱媒体供給方法及び熱媒体利用設備

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003174004A (ja) 2001-12-04 2003-06-20 Nec Electronics Corp 半導体基板の薬液処理装置
JP2014130954A (ja) 2012-12-28 2014-07-10 Tokyo Electron Ltd 液処理装置および薬液回収方法
JP2015135943A (ja) 2013-09-30 2015-07-27 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
CN115810563A (zh) 2023-03-17
JP2023041461A (ja) 2023-03-24
KR20230039533A (ko) 2023-03-21
US12318803B2 (en) 2025-06-03
TW202312240A (zh) 2023-03-16
TWI793054B (zh) 2023-02-11
CN115810563B (zh) 2025-07-08
US20230081295A1 (en) 2023-03-16
KR102718065B1 (ko) 2024-10-15
TW202318481A (zh) 2023-05-01
TWI828504B (zh) 2024-01-01

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