JP2022549632A5 - - Google Patents

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Publication number
JP2022549632A5
JP2022549632A5 JP2022518632A JP2022518632A JP2022549632A5 JP 2022549632 A5 JP2022549632 A5 JP 2022549632A5 JP 2022518632 A JP2022518632 A JP 2022518632A JP 2022518632 A JP2022518632 A JP 2022518632A JP 2022549632 A5 JP2022549632 A5 JP 2022549632A5
Authority
JP
Japan
Prior art keywords
substrate
pad
pads
connection structure
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022518632A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022549632A (ja
JP7570410B2 (ja
Filing date
Publication date
Priority claimed from US16/585,337 external-priority patent/US11004819B2/en
Application filed filed Critical
Publication of JP2022549632A publication Critical patent/JP2022549632A/ja
Publication of JP2022549632A5 publication Critical patent/JP2022549632A5/ja
Application granted granted Critical
Publication of JP7570410B2 publication Critical patent/JP7570410B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022518632A 2019-09-27 2020-08-19 はんだ接合部間の架橋の防止 Active JP7570410B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/585,337 2019-09-27
US16/585,337 US11004819B2 (en) 2019-09-27 2019-09-27 Prevention of bridging between solder joints
PCT/IB2020/057798 WO2021059047A1 (en) 2019-09-27 2020-08-19 Prevention of bridging between solder joints

Publications (3)

Publication Number Publication Date
JP2022549632A JP2022549632A (ja) 2022-11-28
JP2022549632A5 true JP2022549632A5 (enExample) 2022-12-13
JP7570410B2 JP7570410B2 (ja) 2024-10-21

Family

ID=75163699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022518632A Active JP7570410B2 (ja) 2019-09-27 2020-08-19 はんだ接合部間の架橋の防止

Country Status (6)

Country Link
US (2) US11004819B2 (enExample)
JP (1) JP7570410B2 (enExample)
CN (1) CN114303231B (enExample)
DE (1) DE112020004630T5 (enExample)
GB (1) GB2603403B (enExample)
WO (1) WO2021059047A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
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US20240324109A1 (en) * 2023-03-20 2024-09-26 Western Digital Technologies, Inc. Solder barrier contact for an integrated circuit
WO2025252529A1 (en) * 2024-06-05 2025-12-11 Ams-Osram International Gmbh Method for producing a display, display substrate and display

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