JP2022549632A - はんだ接合部間の架橋の防止 - Google Patents
はんだ接合部間の架橋の防止 Download PDFInfo
- Publication number
- JP2022549632A JP2022549632A JP2022518632A JP2022518632A JP2022549632A JP 2022549632 A JP2022549632 A JP 2022549632A JP 2022518632 A JP2022518632 A JP 2022518632A JP 2022518632 A JP2022518632 A JP 2022518632A JP 2022549632 A JP2022549632 A JP 2022549632A
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- Prior art keywords
- substrate
- pad
- pads
- top surface
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
cosθw=rcosθ
ここで、θwは見掛けの接触角、θはYoungの接触角、rは粗度比(滑らかな表面の場合はr=1、粗い表面の場合はr>1)を表す。
cosθc’=fcosθa+(1-f)cosθb
ここで、fは液相および固相に接触する面積の比、θaは一部の表面積fに関する成分Aの接触角、θbは残りの表面積(1-f)に関する成分Bの接触角を表す。液体が空気に接触する場合(たとえば、θb=180°の場合)、Cassieの式は以下のようになる。
cosθc’=fcosθa+1-f
Claims (22)
- 接続構造を製造する方法であって、
上面を有し、前記上面から露出したパッド面をそれぞれ有する一組のはんだ付け用パッドを含む基板を用意することと、
前記パッドに近い前記基板の前記上面の少なくとも一部および前記一組のパッドのそれぞれのパッドの前記パッド面に表面処理を適用して、前記上面の前記少なくとも一部および前記パッドの前記パッド面を粗くすることと、
を含む、方法。 - 前記基板の前記上面が、溶融はんだに対して低い濡れ性を有し、各パッドの前記パッド面が、高い濡れ性を有する、請求項1に記載の方法。
- 前記表面処理の適用後の前記基板の前記上面の前記少なくとも一部が、0.4μm超2μm未満の粗さパラメータ(Ra)を有する、請求項1に記載の方法。
- 前記パッドが、金属材料を含み、前記パッドに隣り合う前記上面の前記少なくとも一部が、有機材料を含む、請求項1に記載の方法。
- 前記有機材料を含む前記部分が、有機基板、前記基板上に配設された誘電体層、前記基板上に配設されたはんだレジスト層、前記基板上に配設された接着剤、およびこれらの組み合わせから成る群から選択される部材により設けられた、請求項4に記載の方法。
- 前記表面処理が、サンドブラストを含む、請求項1に記載の方法。
- 前記サンドブラストが、湿式ブラストを含む、請求項6に記載の方法。
- 前記表面処理が、プラズマ処理を含む、請求項1に記載の方法。
- 前記プラズマ処理が、アルゴン・プラズマを含む、請求項8に記載の方法。
- 前記パッドのうちの対応する1つの上にそれぞれ配設された一組のはんだ接合部を形成することをさらに含む、請求項1に記載の方法。
- 前記一組のはんだ接合部を形成することが、
前記表面処理が適用された前記一組のパッドの前記パッド面および前記基板の前記上面の前記部分の少なくとも一部にはんだ材料を塗布することと、
前記はんだ材料を加熱して、前記一組のはんだ接合部を形成することと、
を含む、請求項10に記載の方法。 - 前記基板が、前記基板上に配設され、前記一組のパッドの隣に位置する縁部を有するとともに、前記縁部に位置して露出した一組の側面接続パッドを含む相互接続層であり、各側面接続パッドが、前記基板上に配設された前記パッドのうちの対応する1つに対して配置された、前記相互接続層をさらに含む、請求項1に記載の方法。
- 各側面接続パッドが、前記相互接続層の上面で露出した上面および前記相互接続層の前記縁部で露出した縁部面を有し、前記縁部面が、前記一組のパッドのうちの対応する1つの側を向いた、請求項12に記載の方法。
- 一組のはんだ接合部を形成して、前記相互接続層の前記側面接続パッドをそれぞれ、前記基板上に配設された前記パッドと接続することをさらに含む、請求項12に記載の方法。
- 上面を有する基板と、
前記基板の前記上面から露出したパッド面をそれぞれ有する一組のはんだ付け用パッドと、
を備えた接続構造体であって、
前記基板の前記上面が、前記上面の別の部分よりも粗い前記パッドに近い部分を有し、前記一組のパッドのそれぞれのパッドの前記パッド面が、前記基板上に形成された別の導電性材料の露出面よりも粗い、接続構造体。 - 前記基板の前記上面が、溶融はんだに対して低い濡れ性を有し、各パッドの前記パッド面が、高い濡れ性を有する、請求項15に記載の接続構造体。
- 表面処理の適用後の前記基板の前記上面の前記部分が、0.4μm超2μm未満の粗さパラメータ(Ra)を有する、請求項15に記載の接続構造体。
- 前記基板が、表面粗さを増大させる表面処理が適用された前記上面の少なくとも一部を有し、前記一組のパッドのそれぞれのパッドが、前記表面処理が適用された前記パッド面の少なくとも一部を有する、請求項15に記載の接続構造体。
- 前記表面処理が、サンドブラストを含む、請求項18に記載の接続構造体。
- 前記表面処理が、プラズマ処理を含む、請求項18に記載の接続構造体。
- 請求項15ないし20のいずれかに記載の接続構造体を含む電子機器。
- 前記パッドのうちの対応する1つの上にそれぞれ配設された一組のはんだ接合部と、
前記基板に搭載され、前記はんだ接合部のうちの少なくとも1つをそれぞれ使用する1つまたは複数の電子部品と、
をさらに備えた、請求項21に記載の電子機器。
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US16/585,337 US11004819B2 (en) | 2019-09-27 | 2019-09-27 | Prevention of bridging between solder joints |
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PCT/IB2020/057798 WO2021059047A1 (en) | 2019-09-27 | 2020-08-19 | Prevention of bridging between solder joints |
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