DK3130407T3 - Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer - Google Patents

Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer Download PDF

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Publication number
DK3130407T3
DK3130407T3 DK15180392.1T DK15180392T DK3130407T3 DK 3130407 T3 DK3130407 T3 DK 3130407T3 DK 15180392 T DK15180392 T DK 15180392T DK 3130407 T3 DK3130407 T3 DK 3130407T3
Authority
DK
Denmark
Prior art keywords
binding
procedure
ultrasound transducer
piezoelectric ultrasound
piezoelectric
Prior art date
Application number
DK15180392.1T
Other languages
English (en)
Inventor
Lindballe Thue Bjerring
Original Assignee
Apator Miitors Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apator Miitors Aps filed Critical Apator Miitors Aps
Application granted granted Critical
Publication of DK3130407T3 publication Critical patent/DK3130407T3/da

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • G01F1/662—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • G01F1/667—Arrangements of transducers for ultrasonic flowmeters; Circuits for operating ultrasonic flowmeters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/14—Casings, e.g. of special material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/1051—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/10513—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/10516—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
DK15180392.1T 2015-08-10 2015-08-10 Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer DK3130407T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15180392.1A EP3130407B1 (en) 2015-08-10 2015-08-10 Method of bonding a piezoelectric ultrasonic transducer

Publications (1)

Publication Number Publication Date
DK3130407T3 true DK3130407T3 (da) 2021-02-01

Family

ID=53800872

Family Applications (1)

Application Number Title Priority Date Filing Date
DK15180392.1T DK3130407T3 (da) 2015-08-10 2015-08-10 Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer

Country Status (4)

Country Link
US (1) US10197423B2 (da)
EP (1) EP3130407B1 (da)
DK (1) DK3130407T3 (da)
LT (1) LT3130407T (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123278A1 (de) * 2017-10-06 2019-04-11 Schott Ag Grundkörper mit angelötetem Massestift, Verfahren zu seiner Herstellung und seine Verwendungen
DE102018003802B4 (de) * 2018-05-09 2022-12-01 Diehl Metering Gmbh Messeinrichtung zur Ermittlung einer Fluidgröße
US10900819B2 (en) 2018-08-16 2021-01-26 AXIOMA Metering, UAB Ultrasonic flowmeter
US11004819B2 (en) * 2019-09-27 2021-05-11 International Business Machines Corporation Prevention of bridging between solder joints
US11264314B2 (en) 2019-09-27 2022-03-01 International Business Machines Corporation Interconnection with side connection to substrate
US11735529B2 (en) 2021-05-21 2023-08-22 International Business Machines Corporation Side pad anchored by next adjacent via

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2020593B3 (es) * 1987-08-10 1991-08-16 Siemens Ag Dispositivo ultrasonico aforador de caudales
JP3596364B2 (ja) * 1999-08-05 2004-12-02 松下電器産業株式会社 超音波送受波器および超音波流れ計測装置
US6656124B2 (en) * 2001-10-15 2003-12-02 Vermon Stack based multidimensional ultrasonic transducer array
US6739203B1 (en) * 2002-08-16 2004-05-25 Feldman Marvin J Ultrasonic transducer and flow sensor configuration
EP1561518B1 (en) * 2002-11-12 2011-10-05 Seiko Epson Corporation Piezoelectric vibrator, production method therefor, and equipment provided with this piezoelectric vibrator
US6822376B2 (en) * 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
DE10325281B4 (de) * 2003-06-04 2018-05-17 Snaptrack, Inc. Elektroakustisches Bauelement und Verfahren zur Herstellung
US20050046312A1 (en) * 2003-09-01 2005-03-03 Fuji Photo Film Co., Ltd. Laminated structure, piezoelectric actuator and method of manufacturing the same
US20070257580A1 (en) * 2006-05-05 2007-11-08 Fujifilm Dimatix, Inc. Polishing Piezoelectric Material
JP5086146B2 (ja) * 2007-03-29 2012-11-28 日本特殊陶業株式会社 超音波振動子及びそれを備える超音波機器
CN103811366B (zh) * 2008-09-18 2017-04-12 富士胶卷视声公司 形成超声匹配层的方法及超声换能器
JP2013518530A (ja) * 2010-01-29 2013-05-20 リサーチ・トライアングル・インスティチュート 圧電型超音波変換子を形成するための方法、および関連する装置
WO2012113401A1 (en) * 2011-02-23 2012-08-30 Miitors Aps Ultrasonic flow meter
JP2013077883A (ja) * 2011-09-29 2013-04-25 Ge Medical Systems Global Technology Co Llc 超音波プローブ及び超音波画像表示装置
PL2888561T3 (pl) * 2012-08-22 2021-11-02 Apator Miitors Aps Przepływomierz ultradźwiękowy zawierający układ połączeniowy

Also Published As

Publication number Publication date
EP3130407A1 (en) 2017-02-15
US10197423B2 (en) 2019-02-05
US20170045387A1 (en) 2017-02-16
EP3130407B1 (en) 2020-11-25
LT3130407T (lt) 2020-12-28

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