JP2022003703A5 - - Google Patents
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- Publication number
- JP2022003703A5 JP2022003703A5 JP2021168975A JP2021168975A JP2022003703A5 JP 2022003703 A5 JP2022003703 A5 JP 2022003703A5 JP 2021168975 A JP2021168975 A JP 2021168975A JP 2021168975 A JP2021168975 A JP 2021168975A JP 2022003703 A5 JP2022003703 A5 JP 2022003703A5
- Authority
- JP
- Japan
- Prior art keywords
- component according
- capacitor component
- metal
- internal electrodes
- laminated portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 28
- 239000002184 metal Substances 0.000 claims 28
- 239000003990 capacitor Substances 0.000 claims 25
- 230000003014 reinforcing effect Effects 0.000 claims 10
- 239000000919 ceramic Substances 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- 229910010293 ceramic material Inorganic materials 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190081332A KR102822305B1 (ko) | 2019-07-05 | 2019-07-05 | 커패시터 부품 |
| KR10-2019-0081332 | 2019-07-05 | ||
| JP2020070607A JP7139557B2 (ja) | 2019-07-05 | 2020-04-09 | キャパシタ部品 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020070607A Division JP7139557B2 (ja) | 2019-07-05 | 2020-04-09 | キャパシタ部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022003703A JP2022003703A (ja) | 2022-01-11 |
| JP2022003703A5 true JP2022003703A5 (cg-RX-API-DMAC7.html) | 2022-04-13 |
| JP7547695B2 JP7547695B2 (ja) | 2024-09-10 |
Family
ID=68171772
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020070607A Active JP7139557B2 (ja) | 2019-07-05 | 2020-04-09 | キャパシタ部品 |
| JP2021168975A Active JP7547695B2 (ja) | 2019-07-05 | 2021-10-14 | キャパシタ部品 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020070607A Active JP7139557B2 (ja) | 2019-07-05 | 2020-04-09 | キャパシタ部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US11657976B2 (cg-RX-API-DMAC7.html) |
| JP (2) | JP7139557B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102822305B1 (cg-RX-API-DMAC7.html) |
| CN (5) | CN212625194U (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102150549B1 (ko) * | 2018-11-30 | 2020-09-01 | 삼성전기주식회사 | 커패시터 부품 |
| KR102724906B1 (ko) * | 2019-07-05 | 2024-11-01 | 삼성전기주식회사 | 커패시터 부품 |
| KR102803430B1 (ko) * | 2020-10-29 | 2025-05-07 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| JP2022123936A (ja) * | 2021-02-15 | 2022-08-25 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP2023122670A (ja) * | 2022-02-24 | 2023-09-05 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR20250100982A (ko) * | 2023-12-27 | 2025-07-04 | 삼성전기주식회사 | 적층형 전자 부품 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002015940A (ja) * | 2000-06-28 | 2002-01-18 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
| JP4150246B2 (ja) | 2002-11-28 | 2008-09-17 | 京セラ株式会社 | セラミック積層体の製法 |
| KR100593889B1 (ko) | 2003-12-24 | 2006-06-28 | 삼성전기주식회사 | 보강패턴을 갖는 적층 세라믹 콘덴서 |
| KR20050093879A (ko) * | 2004-03-19 | 2005-09-23 | 삼성전기주식회사 | 보강패턴을 갖는 적층 세라믹 콘덴서 |
| JP4270395B2 (ja) * | 2005-03-28 | 2009-05-27 | Ｔｄｋ株式会社 | 積層セラミック電子部品 |
| US7336475B2 (en) * | 2006-02-22 | 2008-02-26 | Vishay Vitramon, Inc. | High voltage capacitors |
| JP4400583B2 (ja) * | 2006-03-01 | 2010-01-20 | Ｔｄｋ株式会社 | 積層コンデンサ及びその製造方法 |
| JP5736982B2 (ja) * | 2010-07-21 | 2015-06-17 | 株式会社村田製作所 | セラミック電子部品 |
| JP5605053B2 (ja) * | 2010-07-26 | 2014-10-15 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
| JP5751080B2 (ja) * | 2010-09-28 | 2015-07-22 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP2013051392A (ja) * | 2011-08-02 | 2013-03-14 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| KR101309326B1 (ko) * | 2012-05-30 | 2013-09-16 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
| KR20140014773A (ko) * | 2012-07-26 | 2014-02-06 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이의 제조방법 |
| KR101462761B1 (ko) * | 2013-02-13 | 2014-11-20 | 삼성전기주식회사 | 다층 세라믹 소자 및 그 제조 방법 |
| KR101472659B1 (ko) * | 2013-02-18 | 2014-12-12 | 삼성전기주식회사 | 다층 세라믹 소자 |
| KR102067173B1 (ko) * | 2013-02-25 | 2020-01-15 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
| KR20140120110A (ko) | 2013-04-02 | 2014-10-13 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 전자부품이 실장된 회로기판 |
| KR101525666B1 (ko) * | 2013-07-11 | 2015-06-03 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
| KR102076145B1 (ko) | 2013-08-09 | 2020-02-11 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판과 제조 방법 |
| KR101514559B1 (ko) * | 2013-10-30 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR102089694B1 (ko) * | 2014-04-30 | 2020-03-16 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| JP6665438B2 (ja) | 2015-07-17 | 2020-03-13 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR101731452B1 (ko) * | 2015-08-26 | 2017-04-28 | 삼화콘덴서공업주식회사 | 고전압 적층 세라믹 커패시터 및 그의 제조방법 |
| CN205142497U (zh) | 2015-11-04 | 2016-04-06 | 瑞声光电科技(常州)有限公司 | 振膜 |
| KR101792385B1 (ko) | 2016-01-21 | 2017-11-01 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP6421137B2 (ja) * | 2016-03-25 | 2018-11-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP2017216360A (ja) * | 2016-05-31 | 2017-12-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP7044465B2 (ja) | 2016-12-26 | 2022-03-30 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR102059441B1 (ko) | 2017-01-02 | 2019-12-27 | 삼성전기주식회사 | 커패시터 부품 |
| JP2018139253A (ja) | 2017-02-24 | 2018-09-06 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| KR102029545B1 (ko) * | 2017-12-01 | 2019-10-07 | 삼성전기주식회사 | 적층형 커패시터 |
| JP2019106443A (ja) * | 2017-12-12 | 2019-06-27 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその製造方法 |
| CN108214710A (zh) | 2017-12-29 | 2018-06-29 | 广州珠江恺撒堡钢琴有限公司 | 钢琴键子的夹板中座板 |
| JP2019201106A (ja) * | 2018-05-16 | 2019-11-21 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP7437871B2 (ja) * | 2018-08-23 | 2024-02-26 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP2020035788A (ja) | 2018-08-27 | 2020-03-05 | 株式会社村田製作所 | 電子部品 |
| US11094462B2 (en) * | 2018-10-22 | 2021-08-17 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| JP7180569B2 (ja) * | 2018-10-22 | 2022-11-30 | 株式会社村田製作所 | 積層セラミック電子部品 |
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2019
- 2019-07-05 KR KR1020190081332A patent/KR102822305B1/ko active Active
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2020
- 2020-03-31 US US16/836,333 patent/US11657976B2/en active Active
- 2020-04-09 JP JP2020070607A patent/JP7139557B2/ja active Active
- 2020-07-06 CN CN202021304769.XU patent/CN212625194U/zh active Active
- 2020-07-06 CN CN202120322619.XU patent/CN214336569U/zh active Active
- 2020-07-06 CN CN202311315524.5A patent/CN117153557A/zh active Pending
- 2020-07-06 CN CN202010641165.2A patent/CN112185696A/zh active Pending
- 2020-07-06 CN CN202311316276.6A patent/CN117153558A/zh active Pending
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2021
- 2021-10-14 JP JP2021168975A patent/JP7547695B2/ja active Active
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2022
- 2022-10-14 US US17/966,118 patent/US11784007B2/en active Active
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2023
- 2023-08-30 US US18/239,912 patent/US20230402230A1/en not_active Abandoned