JP2021183724A - ポリマー材料をコーティング前に媒染するための製剤 - Google Patents
ポリマー材料をコーティング前に媒染するための製剤 Download PDFInfo
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- JP2021183724A JP2021183724A JP2021138693A JP2021138693A JP2021183724A JP 2021183724 A JP2021183724 A JP 2021183724A JP 2021138693 A JP2021138693 A JP 2021138693A JP 2021138693 A JP2021138693 A JP 2021138693A JP 2021183724 A JP2021183724 A JP 2021183724A
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- acid
- bath
- etching
- iii
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/101—Pretreatment of polymeric substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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Abstract
Description
あらかじめ処理される基材の表面は、汚染物質、グリース、腐食性生成物、及び他の材料を含まないものとする。したがって、ベース基材の適切な調製は、加工前の推奨可能な要件であるが、厳密に必要なものではない。基材の用事調製は、先行技術分野において周知である。
浴は、塩又はクロム(III)錯体を添加することによって調製され、配位子の酸素原子、硫黄原子、又は窒素原子を介してクロムに配位する、少なくとも1つ若しくはいくつかの一座配位子、二座配位子、三座配位子、四座配位子、五座配位子、六座配位子、又は架橋配位子の使用に基づく。
25℃で2分間、活性化浴中への浸漬による処理。水浴中でのすすぎ。25℃で2分間、促進剤浴中での処理。水浴中ですすぐ。無電解ニッケルの金属化のための、29℃で8分間の浸漬浴。水浴中に浸漬することによる2回の洗浄。
エッチング加工で得られた結果についての参照として、以下の組成物を含むCr(VI)塩の使用に基づいて、浴中でエッチングを実施する。
エッチング浴は、380gr/Lのクロム酸、及び400gr/Lの濃縮された硫酸を含有する。
クロムと配位する配位子がアセテートであり、62%のH2O;4%のクロムアセテート(III);34%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
ベンゾエートがクロムと配位した配位子であり、40%のH2O;3%のクロムベンゾエート(III);57%のメタンスルホン酸の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がグリシネートであり、21%のH2O;2.5%のクロムギリシネート(III);65.5%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
アミノアルカノエートがクロムと配位した配位子であり、21%のH2O;2.2%のCrCl3・6H2O;1.3%のアミノヘキサン酸;36.5%のH3PO4(水中で75%の);39%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がシトレートであり、17%のH2O;1.2%のCr(NO3)3.9H2O;2.6%のクエン酸;39.7%のH3PO4(水中で75%の);39.5%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がトリエチレンテトラミンであり、19%のH2O;0.8%のCr(NO3)3.9H2O;1.1%のトリエチレンテトラミン;38.4%のH3PO4(水中で75%の);40.7%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がチオジプロピオネートであり、18.5%のH2O;0.7%のCrCl3・6H2O;0.9%のチオジプロピオン酸;38%のH3PO4(水中で75%の);41.9%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がエチレンジアミンテトラアセテート(ethylenediaminetetraacetate、EDTA)であり、18%のH2O;0.6%のCr(NO3)3.9H2O;0.3%のエチレンジアミン四酢酸;39.7%のH3PO4(水中で75%の);41.4%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がエチレンジアミンテトラアセテート(EDTA)であり、18.3%のH2O;0.6%のCr(NO3)3.9H2O;0.5%のエチレンジアミン四酢酸の二ナトリウム塩;39.2%のH3PO4(水中で75%の);41.4%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がエチレンジアミンテトラアセテート(EDTA)であり、18%のH2O;0.6%のCr(NO3)3.9H2O;0.3%のエチレンジアミン四酢酸;39.7%のH3PO4(水中で75%の);41.4%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、40℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がエチレンジアミンテトラアセテート(EDTA)であり、18%のH2O;2%のCr(NO3)3.9H2O;1%のエチレンジアミン四酢酸;35.5%のメタンスルホン酸(水中で75%の);43.5%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がフマレートであり、18%のH2O;0.6%のCr(NO3)3.9H2O;0.3%のフマル酸;39.7%のH3PO4(水中で75%の);41.4%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子が、18%のH2O;0.9%のCr(NO3)3.9H2O;0.6%のシュウ酸H2C2O4.2H2O;39.7%のH3PO4;40.8%のH2SO4の溶液によるオキサレート化合物である、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子が、17.7%のH2O;1.2%のCr(NO3)3.9H2O;0.6%シュウ酸H2C2O4.2H2O;39.7%のH3PO4(75%);40.8%のH2SO4の溶液によるオキサレート化合物である、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で15分間、浴中に留置する。
クロムと配位した配位子がサリチレートであり、18%のH2O;0.6%のCr2O3;0.8%のサリチル酸;39.7%のH3PO4(水中で75%の);40.9%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、25℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がサリチレートであり、18%のH2O;0.6%のCr2O3;0.8%のサリチル酸;39.7%のH3PO4(水中で75%の);40.9%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。エッチングする断片を、60℃の温度で3分間、浴中に留置する。
クロムと配位した配位子がグルコネートであり、18%のH2O;0.6%のCr2(SO4)3・H2O;2%のカルシウムグルコネート;38%のH3PO4(水中で75%の);41.4%のH2SO4の溶液によって調製する、Cr(III)塩に基づくエッチング浴。
エッチングする断片を、25℃の温度で3分間、浴中に留置する。
Claims (9)
- Cr(III)配位錯体の使用に基づく化学的な加工を通して、熱可塑性、熱安定性、又はエラストマーのポリマーを含むポリマー材料の酸エッチング製剤の使用であって、前記製剤の目的が、化学浴又は有機コーティングの適用を通して前記ポリマー材料を金属化することであり、前記エッチング浴中の酸の濃度が、10%〜最大98%であり得る、製剤の使用。
- 請求項1に記載のポリマー材料を後で金属化又は有機コーティングするための、ポリマー材料の酸エッチング浴製剤の使用であって、前記クロム(III)錯体が、酸素原子、硫黄原子、若しくは窒素原子を介して、又はこれらの原子のうちのいくつかを介して前記クロムに配位する、少なくとも1つ若しくはいくつかの一座配位子、二座配位子、三座配位子、四座配位子、五座配位子、六座配位子、又は架橋配位子の使用に基づく、製剤の使用。
- 前記配位子が、ホルメート、アセテート、プロパノエート、ブタノエート、ベンゾエート、フェニルアセテート、フェニルプロピオネート、シアナメート、アルキルベンゾエート、ピルベート、レブリネート、シトレート、イソシトレート、アコニテート、トリメリタート、グリシネート、バリネート、ロイシネート、トレオニネート、リシネート、トリプトファネート、ヒスチダネート、フェニルアラニネート、イソロイシネート、アルギニネート、メチオニネート、アラニネート、プロリネート、セリネート、システイネート、アスパラギネート、グルタミネート、チロシネート、アスパルテート、ポリアスパラテート、グルタメート、システイネート、ホモシステイネート、オルミチネート、ニコチネート、オキサレート、プロパノジオエート、ブタンジオエート、ペンタノジオエート、ヘキサノジオエート、マレエート、フマレート、フタレート、イソフタレート、テレフタレート、タルトレート、イタコネート、メサコネート、シトラコネート、グリコレート、ラクテート、マンデレート、サリチレート、グルコネート、エチレンジアミンテトラアセテート、ニトリロトリアセテート、イミノジスクシネート、エチレノ(ethyleno)ジアミンジスクシネート、メチルグリシンジアセテート、N,N,グルタメートジアセテート、シクロヘキシレンジニトリロテトラアセテート、ジエチレノトリアミナペンタアセテート(diethylenotriamainapentaacetate)、アミノエチルエチレングリコールテトラアセテート、トリエチレンテトラミナヘキサアセテート(tryethylentetraminahexaacetate)、ジヒドロキシエチルグリシネート、イミノジアセテート、オキサメート、ニトリロトリプロピオネート、エチレノジアミンジプロピオネート、チオジプロピオネート、ジチオジプロピオネート、アミノプロパノエート、アミノペンタノエート、アミノヘキサノエート、2−アミノベンゾエート、3−アミノベンゾエート、4−アミノベンゾエート、3−シクロヘキシルアミン−プロピルアミン、エチレノジアミン、1,3−ジアミノプロパン、ジメチルアミノプロピルアミン、ジエチルアミノプロピルアミン、ビス(3−アミノプロピル)−メチルアミン、ジエチレノトリアミン、ジプロピレノライミン(dipropylenotraimine)、トリエチレンテトラミン、テトラエチレノペンタミン(tetraethylenopentamine)、ポリアミン、3−(2−アミノエチル)アミノ−プロピルアミン、N,N’−ビス(3−アミノプロピル)エチレノジアミン、ネオペンタンテジアミン(neopentante diamine)、シクロヘキサノジアミン、ヘキサノ−1,6−ジアミン、イミダゾール、1−メチルイミダゾール、2−メチルイミダゾール、1,2−ジメチルイミダゾール、2−エチルイミダゾール、2−エチル−4−メチル−イミダゾール、N−(3−アミノプロピル)−イミダゾール、ピラゾール、ニシアナミド(nicyanamide)、ビピリジン、フェナントロリン、好ましくは:ホルメート、アセテート、プロピオネート、グリシネート、アルギニネート、アスパルテート、ポリアスパルテート、グルタメート、ニコチネート、オキサレート、プロパンジオエート、ブタンジオエート、ペンタンジオエート、ヘキサンジオエート、マレエート、フマレート、フタレート、サリチレート、タルトレート、シトレート、グリコレート、ラクテート、グルコネート、エチレンジアミンテトラアセテート、ニトリロトリアセテート、2−アミノベンゾエート、より好ましくは、オキサレート、プロパンジオエート、ブタンジオエート、マレエート、フマレート、フタレート、グリコレート、ラクテート、サリチレート、グリシネート、グルタメート、又はそれらのブレンドの中に見出される、請求項2に記載の製剤の使用。
- 存在するCr(III)錯体の濃度が、2mM〜2M、より好ましくは5mM〜1M、更により好ましくは0.01M〜0.4Mの範囲である、請求項1〜3に記載の製剤の使用。
- 前記酸が、硫酸、アミノ硫酸(スルファミン)酸、リン酸、二リン酸、メタリン酸、ポリリン酸、メタンスルホン酸、エタンスルホン酸、プロパンスルホン酸、ベンゼンスルホン酸、トルエンスルホン酸、クメンスルホン酸、アルキルベンゼンスルホン酸、モノアルキルリン酸、ジアルキルリン酸、イセチオン酸、過塩素酸、塩素酸、硝酸、トリフルオロフルオロメタスルホン酸、トリフルオロ酢酸、テトラフルオロホウ酸、ヘキサフルオロリン酸、ヘキサフルオロケイ酸、フッ化水素酸、ホウ酸、又はこれらのブレンド;好ましくは硫酸、アミノ硫酸(スルファミン)酸、リン酸、二リン酸、メタリン酸、ポリリン酸、メタンスルホン酸、エタンスルホン酸、プロパンスルホン酸、ベンゼンスルホン酸、トルエンスルホン酸、クメンスルホン酸、アルキルベンゼンスルホン酸、モノアルキルリン酸、ジアルキルリン酸、又はそれらのブレンド、並びにより好ましくは硫酸、リン酸、又はそれらのブレンドであり得る、請求項1〜4に記載のポリマー材料の金属化又は有機コーティングのための酸エッチング製剤の使用。
- 酸の重量パーセントが、20%〜98%、より好ましくは40%〜95%、更により好ましくは55%〜92%である、請求項1〜5に記載のポリマー材料の金属化又は有機コーティングのための酸エッチング製剤の使用。
- 作業温度が、10℃〜95℃、より好ましくは15℃〜80℃、更により好ましくは20℃〜70℃である、請求項1〜6に記載の製剤の使用。
- エッチング時間が、30秒〜1時間、より好ましくは1分〜45分、更により好ましくは2分〜30分である、請求項1〜7に記載の製剤の使用。
- 前記ポリマー材料の有機コーティングが、塗料、ワニス、又は他の有機コーティングによるものである、請求項1〜8に記載の製剤の使用。
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4870689A (ja) * | 1971-04-01 | 1973-09-25 | ||
JPS5152384A (ja) * | 1970-04-02 | 1976-05-08 | Du Pont | |
JPS5817181A (ja) * | 1981-07-24 | 1983-02-01 | Sony Corp | メツキ阻害用インキ |
JPS61113295A (ja) * | 1984-10-29 | 1986-05-31 | アンプ―アクゾ コーポレイション | 非導電性基材上に金属図形を形成する方法 |
JPH03115584A (ja) * | 1989-09-28 | 1991-05-16 | Okuno Seiyaku Kogyo Kk | ポリカーボネート樹脂へのめっき方法 |
JPH07188935A (ja) * | 1993-12-28 | 1995-07-25 | Ibiden Co Ltd | アンカー特性に優れる接着剤、およびこの接着剤を用いたプリント配線板とその製造方法 |
JPH08269723A (ja) * | 1995-03-27 | 1996-10-15 | Toyoda Gosei Co Ltd | めっき層を有する樹脂成形品及びその製造方法 |
JP2000144439A (ja) * | 1998-10-30 | 2000-05-26 | Kizai Kk | 不導体素材へのめっき処理方法とそのための無電解処理液組成物 |
JP2007126745A (ja) * | 2005-10-03 | 2007-05-24 | Okuno Chem Ind Co Ltd | クロム酸−硫酸混液によるエッチング処理の後処理剤 |
JP2014212319A (ja) * | 2013-04-16 | 2014-11-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 混合酸溶液を用いた有機ポリマーのクロムフリーエッチング法 |
WO2019063859A1 (es) * | 2017-09-28 | 2019-04-04 | Avanzare Innovacion Tencologica S.L. | Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismo |
Family Cites Families (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL75772C (ja) * | 1948-03-20 | |||
GB996326A (en) | 1961-05-27 | 1965-06-23 | Wacker Chfmie G M B H | Polymerisation catalysts and their use for polymerising unsaturated organic compounds |
US3379556A (en) * | 1965-02-24 | 1968-04-23 | Ampex | Electroless plating system |
DE1974043U (de) | 1967-09-29 | 1967-12-07 | Wilhelm Wolk | Ringbuchmechanik. |
GB1246391A (en) | 1968-11-01 | 1971-09-15 | Allied Chem | Chromium complexes |
US3617411A (en) * | 1969-01-14 | 1971-11-02 | Ibm | Process for etching a pattern of closely spaced conducting lines in an integrated circuit |
US3787326A (en) | 1970-04-02 | 1974-01-22 | Du Pont | Chromium (iii) compositions and their preparation |
US3900689A (en) * | 1970-04-02 | 1975-08-19 | Du Pont | Substrates treated with chromium(iii) complexes to increase the adhesion of organic polymers thereto |
US3869488A (en) | 1971-02-19 | 1975-03-04 | Du Pont | Werner chromium complexes and methods for their preparation |
US3708430A (en) * | 1971-11-18 | 1973-01-02 | Crown City Plating Co | Chromic acid conditioner for treatment of polymeric resin surfaces for electroless plating |
BE793615A (fr) | 1972-01-03 | 1973-05-02 | Shipley Co | Procede de traitement d'un substrat de matiere plastique pour la formation d'un depot chimique de metal |
US3795622A (en) * | 1972-07-31 | 1974-03-05 | O Dutkewych | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
US3962497A (en) * | 1975-03-11 | 1976-06-08 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating |
US4078980A (en) | 1976-10-01 | 1978-03-14 | National Semiconductor Corporation | Electrolytic chromium etching of chromium-layered semiconductor |
US4151126A (en) | 1977-04-25 | 1979-04-24 | E. I. Du Pont De Nemours And Company | Polyolefin/conductive carbon composites |
JPS56166134A (en) | 1980-05-27 | 1981-12-21 | Mitsui Toatsu Chem Inc | Preparation of alcohol |
DE3148280A1 (de) | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
DE3339856A1 (de) | 1983-11-04 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur haftaktivierung von polyamidsubstraten fuer die stromlose metallisierung |
US4644073A (en) * | 1985-03-11 | 1987-02-17 | Phillips Petroleum Company | Permeability contrast correction employing a sulfate-free propionate-sequestered chromium (III) solution |
US4636572A (en) | 1985-03-11 | 1987-01-13 | Phillips Petroleum Company | Permeability contrast correction employing propionate-sequestered chromium(III) prepared by nitrite/dichromate redox |
JP2615819B2 (ja) | 1988-04-28 | 1997-06-04 | 三菱瓦斯化学株式会社 | シアノピリジンの製造法 |
SU1633016A1 (ru) * | 1989-01-09 | 1991-03-07 | Переславский Филиал Всесоюзного Государственного Научно-Исследовательского Института Химико-Фотографической Промышленности | Способ подготовки неметаллической поверхности к химической металлизации |
US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
US5904797A (en) | 1996-02-12 | 1999-05-18 | E. I. Du Pont De Nemours And Company | Adhesion improvement with methylacrylate-chromium complexes and poly(vinyl alcohol) |
US7314671B1 (en) | 1996-04-19 | 2008-01-01 | Surtec International Gmbh | Chromium(VI)-free conversion layer and method for producing it |
US5962073A (en) * | 1997-06-02 | 1999-10-05 | Lacks Industries, Inc. | Method for electroplating elastomer-modified polyphthalamide articles |
US5928727A (en) | 1997-06-02 | 1999-07-27 | Lacks Industries, Inc. | Method for electroplating elastomer-modified polyphthalamide articles |
DE19740431C1 (de) | 1997-09-11 | 1998-11-12 | Atotech Deutschland Gmbh | Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats |
DE19823888C1 (de) | 1998-05-28 | 2000-04-13 | Bk Giulini Chem Gmbh & Co Ohg | Verwendung von neutralisierten oder teilneutralisierten Chrom-(III)-Verbindungen |
US7045461B2 (en) * | 2000-01-07 | 2006-05-16 | Nikkon Materials Co., Ltd. | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
FR2812307B1 (fr) * | 2000-07-25 | 2003-02-14 | Chemetall S A | Couche noire anticorrosive sur un alliage de zinc et son procede de preparation |
US6559242B1 (en) | 2002-05-02 | 2003-05-06 | Ford Global Technologies, Inc. | Surface activation and coating processes of a thermoplastic olefin using an aqueous immersion bath and products produced thereby |
WO2004024984A1 (ja) | 2002-09-10 | 2004-03-25 | Nikko Materials Co., Ltd. | 金属めっき方法および前処理剤 |
US6908185B2 (en) * | 2003-06-11 | 2005-06-21 | Hewlett-Packard Development Company, L.P. | Pigment-based ink-jet ink systems with polyurethane binder and crashing agent |
KR100796894B1 (ko) * | 2004-01-29 | 2008-01-22 | 닛코킨조쿠 가부시키가이샤 | 무전해 도금 전처리제, 그것을 이용하는 무전해 도금방법,및 무전해 도금물 |
US7579049B2 (en) * | 2004-07-06 | 2009-08-25 | The Boeing Company | Nano-structured inorganic zinc phosphate corrosion protective coating for metal alloys |
JP4859232B2 (ja) | 2004-09-10 | 2012-01-25 | Jx日鉱日石金属株式会社 | 無電解めっき前処理剤及びフレキシブル基板用銅張り積層体 |
US7478902B2 (en) * | 2004-11-04 | 2009-01-20 | Hewlett-Packard Development Company, L.P. | Inkjet compositions |
DE102005051632B4 (de) * | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
CN1966765B (zh) | 2005-11-17 | 2012-07-18 | 中国科学院金属研究所 | 一种非金属材料化学镀的活化方法及其化学镀 |
JP2008126413A (ja) * | 2006-11-16 | 2008-06-05 | Fuji Xerox Co Ltd | 画像記録装置および画像記録方法 |
JP5092391B2 (ja) | 2006-12-22 | 2012-12-05 | 富士通株式会社 | 樹脂筐体及びその製造方法 |
US20090023011A1 (en) * | 2007-07-20 | 2009-01-22 | Hewlett-Packard Development Company, L.P. | Systems and Methods for Forming Conductive Traces on Plastic Substrates |
JP2009137055A (ja) * | 2007-12-04 | 2009-06-25 | Canon Inc | インクジェット記録用反応液、インクジェット記録方法及びインクジェット記録用インクセット |
JP2010023339A (ja) * | 2008-07-18 | 2010-02-04 | Fujifilm Corp | インクセット及び画像記録方法 |
WO2010065851A2 (en) * | 2008-12-05 | 2010-06-10 | Omg Americas, Inc. | Electroless palladium plating solution and method of use |
JP5776141B2 (ja) * | 2009-06-23 | 2015-09-09 | 株式会社リコー | インクジェット記録用インク、並びに、該インクを用いたインクジェット記録方法、該インクを収容したカートリッジ、及び記録物 |
EP2295509B1 (en) * | 2009-09-10 | 2013-01-09 | Canon Kabushiki Kaisha | Liquid composition, set, liquid cartridge, inkjet recording method, and inkjet recording apparatus |
FR2950633B1 (fr) * | 2009-09-30 | 2011-11-25 | Alchimer | Solution et procede d'activation de la surface oxydee d'un substrat semi-conducteur. |
CN101892470A (zh) | 2010-07-19 | 2010-11-24 | 复旦大学 | 一种柔性聚酯覆镍电极的制备方法 |
JP5800663B2 (ja) * | 2010-11-24 | 2015-10-28 | キヤノン株式会社 | 転写型インクジェット記録方法 |
JP5554290B2 (ja) * | 2011-06-17 | 2014-07-23 | 富士フイルム株式会社 | インクセット及び画像形成方法 |
US10260000B2 (en) | 2012-01-23 | 2019-04-16 | Macdermid Acumen, Inc. | Etching of plastic using acidic solutions containing trivalent manganese |
US8603352B1 (en) | 2012-10-25 | 2013-12-10 | Rohm and Haas Electroncis Materials LLC | Chrome-free methods of etching organic polymers |
JP2014194045A (ja) | 2013-03-28 | 2014-10-09 | Nippon Paint Co Ltd | 金属表面処理剤及び金属表面処理方法 |
CN103531825B (zh) * | 2013-10-25 | 2015-08-19 | 哈尔滨工业大学 | 一种有效拓展微纳米电极粒子表面积的方法 |
ES2446850B1 (es) | 2013-12-11 | 2014-11-04 | Lifeak Job Accommodation Solutions For Life, S.L. | Secador corporal para ducha o baño |
CN104651823B (zh) | 2015-02-14 | 2017-08-22 | 上海盛田化工科技有限公司 | 一种无钴环保三价铬黑色钝化液及其制备方法 |
WO2016136914A1 (ja) * | 2015-02-27 | 2016-09-01 | 富士フイルム株式会社 | インクセット及び画像形成方法 |
CN107408644B (zh) | 2015-03-25 | 2021-03-30 | 大日本印刷株式会社 | 电池用包装材料和电池 |
WO2016158796A1 (ja) | 2015-03-27 | 2016-10-06 | 大日本印刷株式会社 | 電池用包装材料、その製造方法及び電池 |
CN112297567A (zh) | 2015-03-27 | 2021-02-02 | 大日本印刷株式会社 | 电池用包装材料和电池 |
US10886506B2 (en) | 2015-03-30 | 2021-01-05 | Dai Nippon Printing Co., Ltd. | Cell packaging material, method for manufacturing same, and cell |
EP3181726A1 (en) | 2015-12-18 | 2017-06-21 | ATOTECH Deutschland GmbH | Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces |
US9922951B1 (en) * | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
WO2020023354A1 (en) | 2018-07-23 | 2020-01-30 | University Of Louisville Research Foundation, Inc. | Catalysts, methods of making, and methods of hydrofluorination |
US20220059889A1 (en) | 2019-03-12 | 2022-02-24 | Dai Nippon Printing Co., Ltd. | Sheathing material for all solid state battery, all solid state battery, and method for manufacturing same |
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Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5152384A (ja) * | 1970-04-02 | 1976-05-08 | Du Pont | |
JPS4870689A (ja) * | 1971-04-01 | 1973-09-25 | ||
JPS5817181A (ja) * | 1981-07-24 | 1983-02-01 | Sony Corp | メツキ阻害用インキ |
JPS61113295A (ja) * | 1984-10-29 | 1986-05-31 | アンプ―アクゾ コーポレイション | 非導電性基材上に金属図形を形成する方法 |
JPH03115584A (ja) * | 1989-09-28 | 1991-05-16 | Okuno Seiyaku Kogyo Kk | ポリカーボネート樹脂へのめっき方法 |
JPH07188935A (ja) * | 1993-12-28 | 1995-07-25 | Ibiden Co Ltd | アンカー特性に優れる接着剤、およびこの接着剤を用いたプリント配線板とその製造方法 |
JPH08269723A (ja) * | 1995-03-27 | 1996-10-15 | Toyoda Gosei Co Ltd | めっき層を有する樹脂成形品及びその製造方法 |
JP2000144439A (ja) * | 1998-10-30 | 2000-05-26 | Kizai Kk | 不導体素材へのめっき処理方法とそのための無電解処理液組成物 |
JP2007126745A (ja) * | 2005-10-03 | 2007-05-24 | Okuno Chem Ind Co Ltd | クロム酸−硫酸混液によるエッチング処理の後処理剤 |
JP2014212319A (ja) * | 2013-04-16 | 2014-11-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 混合酸溶液を用いた有機ポリマーのクロムフリーエッチング法 |
WO2019063859A1 (es) * | 2017-09-28 | 2019-04-04 | Avanzare Innovacion Tencologica S.L. | Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismo |
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