JP2020513475A5 - - Google Patents

Download PDF

Info

Publication number
JP2020513475A5
JP2020513475A5 JP2019526467A JP2019526467A JP2020513475A5 JP 2020513475 A5 JP2020513475 A5 JP 2020513475A5 JP 2019526467 A JP2019526467 A JP 2019526467A JP 2019526467 A JP2019526467 A JP 2019526467A JP 2020513475 A5 JP2020513475 A5 JP 2020513475A5
Authority
JP
Japan
Prior art keywords
metal
base
electroplating
trace
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019526467A
Other languages
English (en)
Japanese (ja)
Other versions
JP7657546B2 (ja
JP2020513475A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from US15/817,049 external-priority patent/US10640879B2/en
Publication of JP2020513475A publication Critical patent/JP2020513475A/ja
Publication of JP2020513475A5 publication Critical patent/JP2020513475A5/ja
Priority to JP2022127306A priority Critical patent/JP2022184833A/ja
Application granted granted Critical
Publication of JP7657546B2 publication Critical patent/JP7657546B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019526467A 2016-11-18 2017-11-17 高アスペクト比電気めっき構造及び異方性電気めっきプロセス Active JP7657546B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022127306A JP2022184833A (ja) 2016-11-18 2022-08-09 高アスペクト比電気めっき構造及び異方性電気めっきプロセス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662423995P 2016-11-18 2016-11-18
US62/423,995 2016-11-18
US15/817,049 US10640879B2 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes
PCT/US2017/062416 WO2018094280A1 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes
US15/817,049 2017-11-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022127306A Division JP2022184833A (ja) 2016-11-18 2022-08-09 高アスペクト比電気めっき構造及び異方性電気めっきプロセス

Publications (3)

Publication Number Publication Date
JP2020513475A JP2020513475A (ja) 2020-05-14
JP2020513475A5 true JP2020513475A5 (enExample) 2021-01-07
JP7657546B2 JP7657546B2 (ja) 2025-04-07

Family

ID=62144325

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019526467A Active JP7657546B2 (ja) 2016-11-18 2017-11-17 高アスペクト比電気めっき構造及び異方性電気めっきプロセス
JP2022127306A Pending JP2022184833A (ja) 2016-11-18 2022-08-09 高アスペクト比電気めっき構造及び異方性電気めっきプロセス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022127306A Pending JP2022184833A (ja) 2016-11-18 2022-08-09 高アスペクト比電気めっき構造及び異方性電気めっきプロセス

Country Status (5)

Country Link
US (2) US10640879B2 (enExample)
JP (2) JP7657546B2 (enExample)
KR (2) KR20190082295A (enExample)
CN (1) CN110140203A (enExample)
WO (1) WO2018094280A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488198B (zh) * 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
WO2018094280A1 (en) 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
KR101963287B1 (ko) * 2017-06-28 2019-03-28 삼성전기주식회사 코일 부품 및 그의 제조방법
CN113396246B (zh) * 2018-11-26 2025-08-26 哈钦森技术股份有限公司 电气装置和线圈
JP7582944B2 (ja) * 2018-11-30 2024-11-13 ハッチンソン テクノロジー インコーポレイテッド 高密度コイルの設計および処理
CN112389269B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 一种汽车、能量转换装置及能量转换方法
CN112389231B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 能量转换装置及车辆
US20220213610A1 (en) * 2021-01-06 2022-07-07 Rohm And Haas Electronic Materials Llc Photoresist resolution capabilities by copper electroplating anisotropically
TWI793891B (zh) * 2021-12-03 2023-02-21 和碩聯合科技股份有限公司 熱傳導模組與電子裝置

Family Cites Families (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315985A (en) 1972-11-30 1982-02-16 International Business Machines Corporation Fine-line circuit fabrication and photoresist application therefor
DE3139670A1 (de) * 1981-10-06 1983-04-21 Robert Bosch Gmbh, 7000 Stuttgart Elektronische duennschichtschaltung und deren herstellungsverfahren
JPS60230993A (ja) 1984-05-02 1985-11-16 Asahi Chem Ind Co Ltd 異方性メツキ用ピロリン酸銅溶液
US4733944A (en) * 1986-01-24 1988-03-29 Xmr, Inc. Optical beam integration system
JPS644091A (en) * 1987-06-26 1989-01-09 Sony Corp Plating
JPH03169249A (ja) 1989-11-27 1991-07-22 Asahi Chem Ind Co Ltd コアレスモータ用回転子
JPH04137405A (ja) 1990-09-28 1992-05-12 Fujikura Ltd テープ電線並びにテープ電線とプリント配線板との接合構造
JPH0548247A (ja) * 1991-08-20 1993-02-26 Fujitsu Ltd 導体パターン形成方法
US5209817A (en) * 1991-08-22 1993-05-11 International Business Machines Corporation Selective plating method for forming integral via and wiring layers
US5401913A (en) 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5661086A (en) 1995-03-28 1997-08-26 Mitsui High-Tec, Inc. Process for manufacturing a plurality of strip lead frame semiconductor devices
US5867347A (en) 1997-06-13 1999-02-02 Hutchinson Technology Incorporated Head suspension with stacked coil microactuator for tracking axis adjustment of a read/write head
JP3313629B2 (ja) 1997-10-06 2002-08-12 東京パーツ工業株式会社 扁平コアレスモータの印刷配線コミュテータ
US6600404B1 (en) * 1998-01-12 2003-07-29 Tdk Corporation Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
JPH11259883A (ja) 1998-03-09 1999-09-24 Akai Electric Co Ltd 光ヘッド用駆動コイル
US6239979B1 (en) 1998-11-04 2001-05-29 Intel Corporation Printed circuit board bracket assembly and system
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
US7447037B2 (en) 1999-08-04 2008-11-04 Super Talent Electronics, Inc. Single chip USB packages by various assembly methods
US6423200B1 (en) * 1999-09-30 2002-07-23 Lam Research Corporation Copper interconnect seed layer treatment methods and apparatuses for treating the same
US20020112963A1 (en) 2001-02-22 2002-08-22 Nikon Corporation Methods for fabricating high-precision thermally stable electromagnetic coils
US7027141B2 (en) * 2001-05-03 2006-04-11 Applied Kinetics, Inc. Static attitude determination and adjust of head suspension components
FR2825228B1 (fr) 2001-05-25 2003-09-19 Framatome Connectors Int Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci
US6847527B2 (en) 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
US6815126B2 (en) * 2002-04-09 2004-11-09 International Business Machines Corporation Printed wiring board with conformally plated circuit traces
CN1685507B (zh) 2002-05-23 2010-08-18 肖特股份公司 带有适合射频应用的导体结构的元件的制造方法
US6791845B2 (en) 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
JP4191506B2 (ja) 2003-02-21 2008-12-03 Ｔｄｋ株式会社 高密度インダクタおよびその製造方法
US6924777B2 (en) 2003-03-17 2005-08-02 Hewlett-Packard Development Company, L.P. Enhanced antenna using flexible circuitry
JP4556422B2 (ja) 2003-12-02 2010-10-06 パナソニック株式会社 電子部品およびその製造方法
JP2005190534A (ja) 2003-12-25 2005-07-14 Shinka Jitsugyo Kk サスペンション、ヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置
US20050173152A1 (en) 2004-02-10 2005-08-11 Post Scott E. Circuit board surface mount package
US7384531B1 (en) 2004-02-19 2008-06-10 Hutchinson Technology Incorporated Plated ground features for integrated lead suspensions
JP2005236158A (ja) 2004-02-23 2005-09-02 Murata Mfg Co Ltd 積層コイル部品、及び積層コイル部品の製造方法、並びに積層コイル部品の実装構造
JP2005266963A (ja) 2004-03-16 2005-09-29 Omron Corp 薄型ｉｃタグおよびその製造方法
JP2007537562A (ja) 2004-05-14 2007-12-20 ハッチンソン テクノロジー インコーポレーティッド サスペンションアセンブリ用貴金属導電性リードの作製方法
US7527713B2 (en) 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
JP4097636B2 (ja) * 2004-08-05 2008-06-11 日東電工株式会社 配線回路基板前駆構造物集合シート及び該シートを用いた配線回路基板の製造方法
US7436678B2 (en) * 2004-10-18 2008-10-14 E.I. Du Pont De Nemours And Company Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof
JP3957000B1 (ja) 2006-07-07 2007-08-08 株式会社村田製作所 基板実装用アンテナコイル及びアンテナ装置
US7929252B1 (en) 2006-10-10 2011-04-19 Hutchinson Technology Incorporated Multi-layer ground plane structures for integrated lead suspensions
US7832082B1 (en) 2006-10-10 2010-11-16 Hutchinson Technology Incorporated Method for manufacturing an integrated lead suspension component
US7697237B1 (en) * 2007-01-11 2010-04-13 Hutchinson Technology Incorporated Shielded copper-dielectric flexure for disk drive head suspensions
JP4483869B2 (ja) 2007-02-01 2010-06-16 ソニー株式会社 像ぶれ補正装置、レンズ鏡筒及び撮像装置
CN201051498Y (zh) * 2007-05-30 2008-04-23 宁波康强电子股份有限公司 集成电路引线框架
US8269345B2 (en) * 2007-10-11 2012-09-18 Maxim Integrated Products, Inc. Bump I/O contact for semiconductor device
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US8169746B1 (en) 2008-04-08 2012-05-01 Hutchinson Technology Incorporated Integrated lead suspension with multiple trace configurations
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP5091810B2 (ja) * 2008-09-03 2012-12-05 日東電工株式会社 配線回路基板およびその製造方法
JP5136311B2 (ja) * 2008-09-11 2013-02-06 大日本印刷株式会社 サスペンション用基板
JP2010118367A (ja) 2008-11-11 2010-05-27 Murata Mfg Co Ltd 分配器
JP5306789B2 (ja) 2008-12-03 2013-10-02 日本特殊陶業株式会社 多層配線基板及びその製造方法
US9070393B2 (en) 2009-01-27 2015-06-30 Panasonic Corporation Three-dimensional structure in which wiring is provided on its surface
WO2010123887A2 (en) * 2009-04-20 2010-10-28 Integrated Sensors, Llp Plasma panel based ionizing-particle radiation detector
CN102474009B (zh) 2009-07-03 2015-01-07 株式会社村田制作所 天线及天线模块
JP5699311B2 (ja) * 2009-10-06 2015-04-08 大日本印刷株式会社 配線回路基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよび配線回路基板の製造方法
US20110123783A1 (en) * 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8344842B1 (en) 2010-01-20 2013-01-01 Vlt, Inc. Vertical PCB surface mount inductors and power converters
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
JP5728837B2 (ja) 2010-06-29 2015-06-03 大日本印刷株式会社 サスペンション用基板、サスペンション用基板の製造方法、サスペンション、素子付サスペンションおよびハードディスクドライブ
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
WO2012053439A1 (ja) 2010-10-21 2012-04-26 Tdk株式会社 コイル部品及びその製造方法
US8426254B2 (en) * 2010-12-30 2013-04-23 Stmicroelectronics, Inc. Leadless semiconductor package with routable leads, and method of manufacture
JP5195956B2 (ja) 2011-04-05 2013-05-15 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US9489567B2 (en) 2011-04-11 2016-11-08 Intel Corporation Tracking and recognition of faces using selected region classification
US20130051018A1 (en) 2011-08-23 2013-02-28 Tyco Electronics Corporation Metal clad circuit board
DE102012203251B8 (de) 2012-03-01 2013-11-07 Bundesdruckerei Gmbh Kontaktlose Datenübertragungseinrichtung, diese enthaltendes Sicherheits- bzw. Wertdokument
JP2013228504A (ja) 2012-04-25 2013-11-07 Tamron Co Ltd アクチュエータ、レンズユニット、及びカメラ
KR20140020505A (ko) 2012-08-09 2014-02-19 삼성전기주식회사 인덕터 소자 및 이의 제조 방법
JP2014049170A (ja) 2012-09-04 2014-03-17 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブおよびそれらの製造方法
JP6102578B2 (ja) * 2012-09-27 2017-03-29 Tdk株式会社 異方性めっき方法
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8933540B2 (en) 2013-02-28 2015-01-13 International Business Machines Corporation Thermal via for 3D integrated circuits structures
KR101983137B1 (ko) 2013-03-04 2019-05-28 삼성전기주식회사 파워 인덕터 및 그 제조방법
TWI488198B (zh) 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
US9432925B2 (en) 2013-08-05 2016-08-30 Nokia Technologies Oy Method, apparatus, and computer program product for hop count usage in cluster selection
KR101933405B1 (ko) 2013-08-19 2018-12-28 삼성전기 주식회사 코일 부품 및 그 실장 기판
WO2015079773A1 (ja) 2013-11-28 2015-06-04 株式会社村田製作所 電磁石、カメラレンズ駆動装置及び電磁石の製造方法
KR101525703B1 (ko) * 2013-12-18 2015-06-03 삼성전기주식회사 칩 전자부품 및 그 제조방법
JP6446783B2 (ja) 2014-01-20 2019-01-09 リコーイメージング株式会社 駆動装置、駆動方法、及び撮像装置
KR102080660B1 (ko) * 2014-03-18 2020-04-14 삼성전기주식회사 칩 전자부품 및 그 제조방법
US9469912B2 (en) * 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
KR102004791B1 (ko) 2014-05-21 2019-07-29 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101558092B1 (ko) 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
JP2015230993A (ja) 2014-06-05 2015-12-21 キヤノン株式会社 積層半導体装置
KR101598295B1 (ko) 2014-09-22 2016-02-26 삼성전기주식회사 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판
US9611138B2 (en) 2014-10-14 2017-04-04 The Regents Of The University Of California Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)
US9366879B1 (en) 2014-12-02 2016-06-14 Hutchinson Technology Incorporated Camera lens suspension with polymer bearings
CN112164546B (zh) 2015-03-13 2022-05-03 住友电工印刷电路株式会社 平面线圈元件及平面线圈元件的制造方法
JP6585912B2 (ja) 2015-03-31 2019-10-02 旭化成エレクトロニクス株式会社 カメラモジュール
KR101693749B1 (ko) 2015-04-06 2017-01-06 삼성전기주식회사 인덕터 소자 및 그 제조방법
KR101762024B1 (ko) 2015-11-19 2017-07-26 삼성전기주식회사 코일 부품 및 그 실장 기판
JP6643720B2 (ja) 2016-06-24 2020-02-12 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール及びカメラ搭載装置
CN206272920U (zh) 2016-08-31 2017-06-20 维沃移动通信有限公司 一种线路板结构及移动终端
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
WO2018094280A1 (en) 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
CN209449029U (zh) 2016-11-28 2019-09-27 株式会社村田制作所 多层基板以及多层基板向电路基板的安装构造
KR101862503B1 (ko) 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법
KR102674655B1 (ko) 2017-01-23 2024-06-12 삼성전기주식회사 코일부품 및 그 제조방법
CN109390352A (zh) 2017-08-09 2019-02-26 昆山国显光电有限公司 阵列基板及其制造方法、显示面板及其制造方法
US20240170208A1 (en) 2022-11-17 2024-05-23 Hutchinson Technology Incorporated High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

Similar Documents

Publication Publication Date Title
JP2020513475A5 (enExample)
JP2014154800A5 (enExample)
JP2012134500A5 (enExample)
US20170033037A1 (en) Packaging substrate
JP2014131011A (ja) 回路基板及びその製造方法
TW201435936A (zh) 用樹脂基板並藉由電鑄造而製造線圈元件的方法
US9433101B2 (en) Substrate via filling
JP2017050310A5 (enExample)
JP2020188189A5 (enExample)
JP2016219559A5 (enExample)
JP2014063950A5 (enExample)
JP2020107860A5 (enExample)
JP2019153670A5 (enExample)
TWI616120B (zh) 結合載板的可撓性電路板結構及其製造方法
CN106550555B (zh) 一种奇数层封装基板及其加工方法
CN105679740A (zh) 基板结构及其制法
CN107404797B (zh) 具有段差结构的多层电路板及其制作方法
TWI505759B (zh) 印刷電路板及其製造方法
JP2014011403A (ja) 配線基板の製造方法
KR102149797B1 (ko) 기판 및 그 제조 방법
JP2016134417A5 (enExample)
CN103531484B (zh) 芯片承载基板结构的制作方法
CN103857202B (zh) 印刷电路板及其铜柱制作方法
TWI392413B (zh) 具有埋入零件之電路板及其製造方法
JPWO2015107618A1 (ja) プリント配線板の製造方法