JP2020107860A5 - - Google Patents

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Publication number
JP2020107860A5
JP2020107860A5 JP2018248298A JP2018248298A JP2020107860A5 JP 2020107860 A5 JP2020107860 A5 JP 2020107860A5 JP 2018248298 A JP2018248298 A JP 2018248298A JP 2018248298 A JP2018248298 A JP 2018248298A JP 2020107860 A5 JP2020107860 A5 JP 2020107860A5
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JP
Japan
Prior art keywords
forming
insulating layer
wiring board
pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018248298A
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English (en)
Japanese (ja)
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JP2020107860A (ja
JP7145068B2 (ja
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Priority to JP2018248298A priority Critical patent/JP7145068B2/ja
Priority claimed from JP2018248298A external-priority patent/JP7145068B2/ja
Priority to US16/710,619 priority patent/US10804210B2/en
Publication of JP2020107860A publication Critical patent/JP2020107860A/ja
Publication of JP2020107860A5 publication Critical patent/JP2020107860A5/ja
Application granted granted Critical
Publication of JP7145068B2 publication Critical patent/JP7145068B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018248298A 2018-12-28 2018-12-28 配線基板及びその製造方法 Active JP7145068B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018248298A JP7145068B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法
US16/710,619 US10804210B2 (en) 2018-12-28 2019-12-11 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018248298A JP7145068B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2020107860A JP2020107860A (ja) 2020-07-09
JP2020107860A5 true JP2020107860A5 (enExample) 2021-12-16
JP7145068B2 JP7145068B2 (ja) 2022-09-30

Family

ID=71124178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018248298A Active JP7145068B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US10804210B2 (enExample)
JP (1) JP7145068B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7589574B2 (ja) * 2021-02-10 2024-11-26 Ｔｏｐｐａｎホールディングス株式会社 多層配線基板
US11978699B2 (en) 2021-08-19 2024-05-07 Texas Instruments Incorporated Electronic device multilevel package substrate for improved electromigration preformance
CN115995453A (zh) * 2021-10-19 2023-04-21 群创光电股份有限公司 电子装置及电子装置的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293353A (en) * 1964-03-30 1966-12-20 Gen Electric Shielded interconnecting wiring medium
US4061263A (en) * 1976-09-22 1977-12-06 International Telephone And Telegraph Corporation Method of bonding a dielectric substrate to a metallic carrier in a printed circuit assembly
JP3260941B2 (ja) * 1993-06-18 2002-02-25 株式会社日立製作所 多層配線基板および多層配線基板の製造方法
US6106923A (en) * 1997-05-20 2000-08-22 Fujitsu Limited Venting hole designs for multilayer conductor-dielectric structures
US6977345B2 (en) * 2002-01-08 2005-12-20 International Business Machines Corporation Vents with signal image for signal return path
US6747216B2 (en) * 2002-02-04 2004-06-08 Intel Corporation Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
JP2003332483A (ja) * 2002-05-16 2003-11-21 Hitachi Ltd 配線基板とそれを用いた電子装置
US7659790B2 (en) * 2006-08-22 2010-02-09 Lecroy Corporation High speed signal transmission line having reduced thickness regions
JP4916300B2 (ja) * 2006-12-19 2012-04-11 新光電気工業株式会社 多層配線基板
JP5931547B2 (ja) * 2012-03-30 2016-06-08 イビデン株式会社 配線板及びその製造方法
JP2015162528A (ja) * 2014-02-27 2015-09-07 京セラサーキットソリューションズ株式会社 配線基板
JP6324876B2 (ja) * 2014-07-16 2018-05-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP2016051834A (ja) * 2014-09-01 2016-04-11 イビデン株式会社 プリント配線基板およびその製造方法

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