JP2015156471A5 - - Google Patents
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- Publication number
- JP2015156471A5 JP2015156471A5 JP2014228199A JP2014228199A JP2015156471A5 JP 2015156471 A5 JP2015156471 A5 JP 2015156471A5 JP 2014228199 A JP2014228199 A JP 2014228199A JP 2014228199 A JP2014228199 A JP 2014228199A JP 2015156471 A5 JP2015156471 A5 JP 2015156471A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- cut portion
- adhesive layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014228199A JP6316731B2 (ja) | 2014-01-14 | 2014-11-10 | 配線基板及びその製造方法、並びに半導体パッケージ |
| US14/591,239 US9603253B2 (en) | 2014-01-14 | 2015-01-07 | Wiring substrate, manufacturing method therefor, and semiconductor package |
| CN201510013051.2A CN104779225B (zh) | 2014-01-14 | 2015-01-09 | 配线基板及其制造方法、以及半导体封装 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014004629 | 2014-01-14 | ||
| JP2014004629 | 2014-01-14 | ||
| JP2014228199A JP6316731B2 (ja) | 2014-01-14 | 2014-11-10 | 配線基板及びその製造方法、並びに半導体パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015156471A JP2015156471A (ja) | 2015-08-27 |
| JP2015156471A5 true JP2015156471A5 (enExample) | 2017-07-20 |
| JP6316731B2 JP6316731B2 (ja) | 2018-04-25 |
Family
ID=53522581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014228199A Active JP6316731B2 (ja) | 2014-01-14 | 2014-11-10 | 配線基板及びその製造方法、並びに半導体パッケージ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9603253B2 (enExample) |
| JP (1) | JP6316731B2 (enExample) |
| CN (1) | CN104779225B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10283688B2 (en) * | 2016-08-22 | 2019-05-07 | Nichia Corporation | Light emitting device |
| JP6699535B2 (ja) * | 2016-12-14 | 2020-05-27 | 株式会社デンソー | 回路基板 |
| JP6881409B2 (ja) * | 2018-09-27 | 2021-06-02 | 日亜化学工業株式会社 | 照明装置およびその製造方法 |
| TWI672711B (zh) * | 2019-01-10 | 2019-09-21 | 健策精密工業股份有限公司 | 絕緣金屬基板及其製造方法 |
| JP7676887B2 (ja) * | 2021-04-02 | 2025-05-15 | 株式会社レゾナック | 冷却装置 |
| JPWO2023054094A1 (enExample) * | 2021-09-30 | 2023-04-06 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
| JP2789563B2 (ja) * | 1993-05-28 | 1998-08-20 | いわき電子株式会社 | 集積回路装置 |
| US5808872A (en) * | 1994-11-15 | 1998-09-15 | Nippon Steel Corporation | Semiconductor package and method of mounting the same on circuit board |
| JPH0955459A (ja) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | 半導体装置 |
| US6064114A (en) * | 1997-12-01 | 2000-05-16 | Motorola, Inc. | Semiconductor device having a sub-chip-scale package structure and method for forming same |
| US6920046B2 (en) * | 2003-06-25 | 2005-07-19 | Eaton Corporation | Dissipating heat in an array of circuit components |
| US7148554B2 (en) * | 2004-12-16 | 2006-12-12 | Delphi Technologies, Inc. | Discrete electronic component arrangement including anchoring, thermally conductive pad |
| US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
| JP2008205308A (ja) * | 2007-02-21 | 2008-09-04 | Sanyo Electric Co Ltd | 半導体装置 |
| CN101645478A (zh) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | 发光二极管散热结构 |
| JP2011103353A (ja) * | 2009-11-10 | 2011-05-26 | Koito Mfg Co Ltd | 発光モジュール |
| JP2012033855A (ja) * | 2010-07-01 | 2012-02-16 | Hitachi Cable Ltd | Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法 |
| US9084373B2 (en) * | 2011-02-24 | 2015-07-14 | Dexerials Corporation | Thermally conductive adhesive |
| JP5844101B2 (ja) | 2011-09-15 | 2016-01-13 | 新光電気工業株式会社 | 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 |
| JP5848976B2 (ja) * | 2012-01-25 | 2016-01-27 | 新光電気工業株式会社 | 配線基板、発光装置及び配線基板の製造方法 |
| JP6230777B2 (ja) * | 2012-01-30 | 2017-11-15 | 新光電気工業株式会社 | 配線基板、配線基板の製造方法、及び発光装置 |
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2014
- 2014-11-10 JP JP2014228199A patent/JP6316731B2/ja active Active
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2015
- 2015-01-07 US US14/591,239 patent/US9603253B2/en active Active
- 2015-01-09 CN CN201510013051.2A patent/CN104779225B/zh active Active