JP5796242B2 - 熱伝導性接着剤 - Google Patents
熱伝導性接着剤 Download PDFInfo
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- JP5796242B2 JP5796242B2 JP2011273977A JP2011273977A JP5796242B2 JP 5796242 B2 JP5796242 B2 JP 5796242B2 JP 2011273977 A JP2011273977 A JP 2011273977A JP 2011273977 A JP2011273977 A JP 2011273977A JP 5796242 B2 JP5796242 B2 JP 5796242B2
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- conductive adhesive
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- solder powder
- heat dissipation
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- 230000001070 adhesive effect Effects 0.000 title claims description 144
- 239000000853 adhesive Substances 0.000 title claims description 143
- 229910000679 solder Inorganic materials 0.000 claims description 62
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 239000000843 powder Substances 0.000 claims description 55
- 238000002844 melting Methods 0.000 claims description 48
- 230000008018 melting Effects 0.000 claims description 48
- 239000003795 chemical substances by application Substances 0.000 claims description 36
- 229920001187 thermosetting polymer Polymers 0.000 claims description 36
- 239000000945 filler Substances 0.000 claims description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 32
- 230000017525 heat dissipation Effects 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 32
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- 230000000694 effects Effects 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 6
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 6
- 229910018956 Sn—In Inorganic materials 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 150000002762 monocarboxylic acid derivatives Chemical group 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims 2
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 claims 1
- 238000001723 curing Methods 0.000 description 60
- 238000013007 heat curing Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000000113 differential scanning calorimetry Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- WTNDADANUZETTI-UHFFFAOYSA-N cyclohexane-1,2,4-tricarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C(C(O)=O)C1 WTNDADANUZETTI-UHFFFAOYSA-N 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- 241000272525 Anas platyrhynchos Species 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 glycidyl ether compound Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Chemical & Material Sciences (AREA)
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- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Conductive Materials (AREA)
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Description
金属フィラーは、銀粉及びハンダ粉を有し、
該ハンダ粉は、熱伝導性接着剤の熱硬化処理温度よりも低い溶融温度を示し、且つ該熱伝導性接着剤の熱硬化処理条件下で銀粉と反応して、当該ハンダ粉の溶融温度より高い融点を示す高融点ハンダ合金を生成するものであり、
該硬化剤は、金属フィラーに対してフラックス活性を有する硬化剤である
ことを特徴とする熱伝導性接着剤を提供する。
熱硬化性接着剤を構成する硬化成分としては、硬化剤と熱硬化処理することにより接着作用を有するエポキシ樹脂、フェノール樹脂、ウレタン樹脂等を使用することができ、中でも、フラックス成分の不活性化のために、エポキシ樹脂を使用することが好ましい。このようなエポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ノボラック型エポキシ樹脂などのグリシジルエーテル型エポキシ樹脂を例示できる。その他、脂環式エポキシ樹脂や複素環含有エポキシ樹脂等、一般に知られているものを適用することができる。なお、反応速度が比較的速い脂環式エポキシ樹脂の場合、その使用に伴って熱伝導性接着剤の硬化速度が速まるので、溶融したハンダ粉によるネットワーク(金属の連続相)形成をより迅速に行うようにすることが好ましい。その場合には、より低融点のハンダ粉を使用すればよい。
上述した熱硬化性接着剤に分散させて熱伝導性接着剤を調製するための金属フィラーは、銀粉とハンダ粉とを含有する。
本発明の熱伝導性接着剤は、以上説明した金属フィラーと熱硬化性接着剤とを、常法により均一に混合することにより調製されるものであり、必要に応じて有機溶媒を添加してもよい。ここで、金属フィラーの熱伝導性接着剤中の含有量(即ち、以下の式(1)で定義される質量基準の金属フィラー充填率)は、低過ぎるとネットワーク(金属の連続相)が形成されにくくなる傾向があり、高過ぎると熱伝導性接着剤の接着力が低下する傾向があるので、好ましくは75〜95%、より好ましくは80〜90%である。
硬化成分としてビスフェノールF型エポキシ樹脂(jER806、三菱化学(株))100質量部、硬化剤としてシクロへキサン−1,2,4−トリカルボン酸−1,2−酸無水物(H−TMAn/H−TMAn−S、三菱ガス化学(株))70質量部、金属フィラーとして平均粒径20μmのSn−58Biハンダ粉(Sn−Bi、三井金属鉱業(株))340質量部及び銀粉(AgC−224、福田金属箔粉工業(株))340質量部を、撹拌装置(泡とり錬太郎・自動公転ミキサー、(株)シンキー)を用いて均一に混合し、実施例1のペースト状の熱伝導性接着剤を得た。金属フィラー充填率は80%であった。なお、硬化成分であるエポキシ樹脂と硬化剤であるシクロへキサン−1,2,4−トリカルボン酸−1,2−酸無水物とのモル当量基準の当量比([エポキシ樹脂]/[硬化剤])を表1に示した。
ハンダ粉の溶融温度と熱伝導性接着剤の硬化開始温度とが共に200℃以下であり、且つ溶融温度が硬化開始温度よりも低い場合を「◎」、ハンダ粉の溶融温度と熱伝導性接着剤の硬化開始温度とが共に200℃以下であるが、溶融温度が硬化開始温度よりも低くはない場合を「○」、それ以外の場合を「×」と評価した。
熱伝導性接着剤の硬化物を切断し、その切断面を研磨し、その研磨面を走査型電子顕微鏡(S-3000N、日立製作所(株))で撮影し、ハンダ粉により形成されたネットワーク(金属の連続相)の有無を観察した。
熱伝導性接着剤の硬化物の熱伝導率を、熱伝導率測定装置(LFA447 NanoFlash、Netzsch社製)を用いて測定した。得られた測定結果の熱伝導率が8.0W/mk以上である場合を「◎」、5.0W/mk以上、8.0W/mk未満である場合を「○」、5.0W/mk未満である場合を「×」と評価した。
100mm×15mm×0.5mmのアルミ板(A5052P)2枚の間に直径10mmとなるように熱伝導性接着剤を挟み込み(2枚のアルミ板の接触面積:15mm×15mm)、150℃、60分オーブンキュアを施し、測定サンプルを作成し、引張試験機(テンシロン、オリエンテック社)を用い、シェア強度を測定した(25℃、引張速度5mm/分)。得られた測定結果の接着強度が130kN/cm2以上である場合を「◎」、100kN/cm2以上130kN/cm2未満である場合を「○」、100kN/cm2未満である場合を「×」と評価した。
表1に示す成分を使用し、実施例1と同様の操作を繰り返すことにより、実施例2〜7、比較例1〜4のペースト状の熱伝導性接着剤を得た。得られた熱伝導性接着剤について、実施例1の場合と同様に、「低温硬化性」、「ネットワーク(金属の連続相)形成性」、「熱伝導率」、及び「接着強度」を試験・評価し、得られた結果を表1に示す。
31、34、43、51、54 熱伝導性接着剤
32、42、52 放熱基板
33、53 ボンディングワイヤー
35、44、55 ヒートシンク
41 接着剤
50 ICチップ
300 ワイヤーボンディング実装タイプのパワーLEDモジュール
400 フリップチップ実装タイプのパワーLEDモジュール
500 ワイヤーボンディング実装タイプのパワーICモジュール
Claims (10)
- 硬化成分及び該硬化成分用の硬化剤を含有する熱硬化性接着剤と、その熱硬化性接着剤中に分散した金属フィラーとを有する熱伝導性接着剤において、
金属フィラーは、銀粉及びハンダ粉を有し、
該ハンダ粉は、熱伝導性接着剤の熱硬化処理温度よりも低い溶融温度を示し、且つ該熱硬化性接着剤の熱硬化処理条件下で銀粉と反応して、当該ハンダ粉の溶融温度より高い融点を示す高融点ハンダ合金を生成するものであり、
該硬化剤は、金属フィラーに対してフラックス活性を有する硬化剤であり、
該硬化成分が、グリシジルエーテル型エポキシ樹脂であり、硬化剤がトリカルボン酸のモノ酸無水物である
ことを特徴とする熱伝導性接着剤。 - 該ハンダ粉が、Sn−Bi系ハンダ粉又はSn−In系ハンダ粉である請求項1記載の熱伝導性接着剤。
- 銀粉とハンダ粉との質量比が、1:2〜2:1である請求項1又は2記載の熱伝導性接着剤。
- 質量基準の金属フィラー充填率が、75〜95%である請求項1〜3のいずれかに記載の熱伝導性接着剤。
- 質量基準の金属フィラー充填率が、80〜90%である請求項4記載の熱伝導性接着剤。
- モル当量基準の、硬化成分と硬化剤との当量比([エポキシ樹脂]:[硬化剤])が、1:0.5〜1:1.5である請求項1〜5のいずれかに記載の熱伝導性接着剤。
- 熱硬化の際、該ハンダ粉は溶融して銀粉間にネットワークを形成する請求項1記載の熱伝導性接着剤。
- LEDチップが、請求項1〜7のいずれかに記載の熱伝導性接着剤で放熱基板の表面にダイボンド実装され、LEDチップの表面電極と放熱基板の表面電極とがワイヤーボンディングにより接続され、該放熱基板が請求項1〜7のいずれかに記載の熱伝導性接着剤でヒートシンクに接着されているパワーLEDモジュール。
- LEDチップが、放熱基板の表面にフリップチップ実装され、該放熱基板が請求項1〜7のいずれかに記載の熱伝導性接着剤でヒートシンクに接着されているパワーLEDモジュール。
- ICチップが、請求項1〜7のいずれかに記載の熱伝導性接着剤で放熱基板の表面にダイボンド実装され、ICチップの表面電極と放熱基板の表面電極とがワイヤーボンディングにより接続され、該放熱基板が請求項1〜7のいずれかに記載の熱伝導性接着剤でヒートシンクに接着されているパワーICモジュール。
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