CN110140203A - 高纵横比电镀结构和各向异性电镀工艺 - Google Patents

高纵横比电镀结构和各向异性电镀工艺 Download PDF

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Publication number
CN110140203A
CN110140203A CN201780082271.8A CN201780082271A CN110140203A CN 110140203 A CN110140203 A CN 110140203A CN 201780082271 A CN201780082271 A CN 201780082271A CN 110140203 A CN110140203 A CN 110140203A
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CN
China
Prior art keywords
aspect ratio
metal
base
trace
high aspect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780082271.8A
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English (en)
Chinese (zh)
Inventor
D·P·里默
K·C·斯旺森
P·F·拉德维希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hutchinson Technology Inc
Original Assignee
Hutchinson Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hutchinson Technology Inc filed Critical Hutchinson Technology Inc
Publication of CN110140203A publication Critical patent/CN110140203A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
CN201780082271.8A 2016-11-18 2017-11-17 高纵横比电镀结构和各向异性电镀工艺 Pending CN110140203A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662423995P 2016-11-18 2016-11-18
US62/423,995 2016-11-18
PCT/US2017/062416 WO2018094280A1 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes

Publications (1)

Publication Number Publication Date
CN110140203A true CN110140203A (zh) 2019-08-16

Family

ID=62144325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780082271.8A Pending CN110140203A (zh) 2016-11-18 2017-11-17 高纵横比电镀结构和各向异性电镀工艺

Country Status (5)

Country Link
US (2) US10640879B2 (enExample)
JP (2) JP7657546B2 (enExample)
KR (2) KR102767042B1 (enExample)
CN (1) CN110140203A (enExample)
WO (1) WO2018094280A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
US12378687B2 (en) 2016-11-18 2025-08-05 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes

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TWI488198B (zh) * 2013-08-02 2015-06-11 Cyntec Co Ltd 多層線圈之製造方法
KR101963287B1 (ko) * 2017-06-28 2019-03-28 삼성전기주식회사 코일 부품 및 그의 제조방법
KR102688488B1 (ko) * 2018-11-26 2024-07-26 허친슨 테크놀로지 인코포레이티드 고종횡비 전기도금 구조 및 이방성 전기도금 프로세스
JP7582944B2 (ja) * 2018-11-30 2024-11-13 ハッチンソン テクノロジー インコーポレイテッド 高密度コイルの設計および処理
CN112389269B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 一种汽车、能量转换装置及能量转换方法
CN112389231B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 能量转换装置及车辆
US20220213610A1 (en) * 2021-01-06 2022-07-07 Rohm And Haas Electronic Materials Llc Photoresist resolution capabilities by copper electroplating anisotropically
TWI793891B (zh) * 2021-12-03 2023-02-21 和碩聯合科技股份有限公司 熱傳導模組與電子裝置

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