KR20190082295A - 고형상비 전기도금 구조 및 이방성 전기도금 프로세스 - Google Patents

고형상비 전기도금 구조 및 이방성 전기도금 프로세스 Download PDF

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Publication number
KR20190082295A
KR20190082295A KR1020197016946A KR20197016946A KR20190082295A KR 20190082295 A KR20190082295 A KR 20190082295A KR 1020197016946 A KR1020197016946 A KR 1020197016946A KR 20197016946 A KR20197016946 A KR 20197016946A KR 20190082295 A KR20190082295 A KR 20190082295A
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KR
South Korea
Prior art keywords
aspect ratio
metal
trace
high aspect
electroplating
Prior art date
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Ceased
Application number
KR1020197016946A
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English (en)
Korean (ko)
Inventor
더글라스 피. 리머
쿠르트 씨. 스완슨
피터 에프. 래드윅
Original Assignee
허친슨 테크놀로지 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 허친슨 테크놀로지 인코포레이티드 filed Critical 허친슨 테크놀로지 인코포레이티드
Priority to KR1020237028302A priority Critical patent/KR102767042B1/ko
Publication of KR20190082295A publication Critical patent/KR20190082295A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020197016946A 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스 Ceased KR20190082295A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237028302A KR102767042B1 (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662423995P 2016-11-18 2016-11-18
US62/423,995 2016-11-18
US15/817,049 US10640879B2 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes
PCT/US2017/062416 WO2018094280A1 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes
US15/817,049 2017-11-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237028302A Division KR102767042B1 (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Publications (1)

Publication Number Publication Date
KR20190082295A true KR20190082295A (ko) 2019-07-09

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KR1020197016946A Ceased KR20190082295A (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스
KR1020237028302A Active KR102767042B1 (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Family Applications After (1)

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KR1020237028302A Active KR102767042B1 (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Country Status (5)

Country Link
US (2) US10640879B2 (enExample)
JP (2) JP7657546B2 (enExample)
KR (2) KR20190082295A (enExample)
CN (1) CN110140203A (enExample)
WO (1) WO2018094280A1 (enExample)

Cited By (3)

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US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
US12378687B2 (en) 2016-11-18 2025-08-05 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes

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CN113396246B (zh) * 2018-11-26 2025-08-26 哈钦森技术股份有限公司 电气装置和线圈
JP7582944B2 (ja) * 2018-11-30 2024-11-13 ハッチンソン テクノロジー インコーポレイテッド 高密度コイルの設計および処理
CN112389269B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 一种汽车、能量转换装置及能量转换方法
CN112389231B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 能量转换装置及车辆
US20220213610A1 (en) * 2021-01-06 2022-07-07 Rohm And Haas Electronic Materials Llc Photoresist resolution capabilities by copper electroplating anisotropically
TWI793891B (zh) * 2021-12-03 2023-02-21 和碩聯合科技股份有限公司 熱傳導模組與電子裝置

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JP6643720B2 (ja) 2016-06-24 2020-02-12 ミツミ電機株式会社 レンズ駆動装置、カメラモジュール及びカメラ搭載装置
CN206272920U (zh) 2016-08-31 2017-06-20 维沃移动通信有限公司 一种线路板结构及移动终端
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
WO2018094280A1 (en) 2016-11-18 2018-05-24 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
CN209449029U (zh) 2016-11-28 2019-09-27 株式会社村田制作所 多层基板以及多层基板向电路基板的安装构造
KR101862503B1 (ko) 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법
KR102674655B1 (ko) 2017-01-23 2024-06-12 삼성전기주식회사 코일부품 및 그 제조방법
CN109390352A (zh) 2017-08-09 2019-02-26 昆山国显光电有限公司 阵列基板及其制造方法、显示面板及其制造方法
US20240170208A1 (en) 2022-11-17 2024-05-23 Hutchinson Technology Incorporated High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
US12308157B2 (en) 2016-11-18 2025-05-20 Hutchinson Technology Incorporated High density coil design and process
US12378687B2 (en) 2016-11-18 2025-08-05 Hutchinson Technology Incorporated High aspect ratio electroplated structures and anisotropic electroplating processes

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US12378687B2 (en) 2025-08-05
JP7657546B2 (ja) 2025-04-07
KR20230128394A (ko) 2023-09-04
KR102767042B1 (ko) 2025-02-14
JP2022184833A (ja) 2022-12-13
WO2018094280A1 (en) 2018-05-24
US10640879B2 (en) 2020-05-05
US20200232112A1 (en) 2020-07-23
JP2020513475A (ja) 2020-05-14
US20180142370A1 (en) 2018-05-24
CN110140203A (zh) 2019-08-16

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