JP2016134417A5 - - Google Patents
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- Publication number
- JP2016134417A5 JP2016134417A5 JP2015006564A JP2015006564A JP2016134417A5 JP 2016134417 A5 JP2016134417 A5 JP 2016134417A5 JP 2015006564 A JP2015006564 A JP 2015006564A JP 2015006564 A JP2015006564 A JP 2015006564A JP 2016134417 A5 JP2016134417 A5 JP 2016134417A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- underfill
- package substrate
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 17
- 230000035515 penetration Effects 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015006564A JP6464762B2 (ja) | 2015-01-16 | 2015-01-16 | 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015006564A JP6464762B2 (ja) | 2015-01-16 | 2015-01-16 | 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016134417A JP2016134417A (ja) | 2016-07-25 |
| JP2016134417A5 true JP2016134417A5 (enExample) | 2018-02-01 |
| JP6464762B2 JP6464762B2 (ja) | 2019-02-06 |
Family
ID=56464392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015006564A Active JP6464762B2 (ja) | 2015-01-16 | 2015-01-16 | 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6464762B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020191397A (ja) * | 2019-05-23 | 2020-11-26 | 凸版印刷株式会社 | 複合配線基板及びその製造方法 |
| CN112992691B (zh) * | 2021-04-23 | 2021-09-03 | 度亘激光技术（苏州）有限公司 | 半导体器件的焊接方法及半导体器件 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244384A (ja) * | 2000-02-28 | 2001-09-07 | Matsushita Electric Works Ltd | ベアチップ搭載プリント配線基板 |
| JP4321269B2 (ja) * | 2004-01-14 | 2009-08-26 | 株式会社デンソー | 半導体装置 |
| JP5162226B2 (ja) * | 2007-12-12 | 2013-03-13 | 新光電気工業株式会社 | 配線基板及び半導体装置 |
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2015
- 2015-01-16 JP JP2015006564A patent/JP6464762B2/ja active Active