JP2020502370A5 - - Google Patents
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- JP2020502370A5 JP2020502370A5 JP2019533638A JP2019533638A JP2020502370A5 JP 2020502370 A5 JP2020502370 A5 JP 2020502370A5 JP 2019533638 A JP2019533638 A JP 2019533638A JP 2019533638 A JP2019533638 A JP 2019533638A JP 2020502370 A5 JP2020502370 A5 JP 2020502370A5
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- JP
- Japan
- Prior art keywords
- composition according
- formula
- branched
- linear
- alkanediyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 5
- -1 ethanediyl Chemical group 0.000 claims 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 238000001556 precipitation Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16205553.7 | 2016-12-20 | ||
| EP16205553 | 2016-12-20 | ||
| PCT/EP2017/083603 WO2018114985A1 (en) | 2016-12-20 | 2017-12-19 | Composition for metal plating comprising suppressing agent for void free filling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020502370A JP2020502370A (ja) | 2020-01-23 |
| JP2020502370A5 true JP2020502370A5 (enExample) | 2021-02-04 |
Family
ID=57860616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019533638A Withdrawn JP2020502370A (ja) | 2016-12-20 | 2017-12-19 | ボイドフリーでの埋め込みのための抑制剤を含む金属めっきのための組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11926918B2 (enExample) |
| EP (1) | EP3559317B1 (enExample) |
| JP (1) | JP2020502370A (enExample) |
| KR (1) | KR102457310B1 (enExample) |
| CN (2) | CN115182004A (enExample) |
| IL (1) | IL267332A (enExample) |
| TW (1) | TWI746746B (enExample) |
| WO (1) | WO2018114985A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3679179B1 (en) | 2017-09-04 | 2023-10-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US20190186032A1 (en) * | 2017-12-14 | 2019-06-20 | Soulbrain Co., Ltd. | Composition for cobalt plating and method for forming metal wiring using the same |
| KR102653074B1 (ko) | 2017-12-20 | 2024-03-29 | 바스프 에스이 | 억제제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물 |
| JP2021522410A (ja) | 2018-04-20 | 2021-08-30 | ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ | 抑制剤を含むスズ又はスズ合金電気メッキのための組成物 |
| CN111690958B (zh) * | 2019-03-15 | 2023-07-28 | 上海新阳半导体材料股份有限公司 | 一种锡镀液、其制备方法和应用 |
| US12559852B2 (en) | 2019-09-16 | 2026-02-24 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN110938848B (zh) * | 2019-12-26 | 2021-05-11 | 江苏艾森半导体材料股份有限公司 | 一种用于电解沉积铜的组合物及酸铜电镀液 |
| EP4115006B1 (en) | 2020-03-06 | 2025-06-25 | Basf Se | Electroplating with a polycarboxylate ether supressor |
| IL296980A (en) | 2020-04-03 | 2022-12-01 | Basf Se | The composition for electrodeposition of copper bumps containing a polyaminoamide compensator |
| JP7799623B2 (ja) * | 2020-05-08 | 2026-01-15 | ラム リサーチ コーポレーション | コバルト、ニッケル、および、それらの合金の電気メッキ |
| US11280014B2 (en) * | 2020-06-05 | 2022-03-22 | Macdermid Enthone Inc. | Silver/tin electroplating bath and method of using the same |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| JP7781850B2 (ja) | 2020-07-13 | 2025-12-08 | ビーエーエスエフ ソシエタス・ヨーロピア | コバルトシード上の銅電気メッキ用組成物 |
| US11384446B2 (en) * | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| JP2024500793A (ja) * | 2020-12-18 | 2024-01-10 | ビーエーエスエフ ソシエタス・ヨーロピア | スズ又はスズ合金電気めっきするための、平滑化剤を含む組成物 |
| KR102339867B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| CN117795135A (zh) * | 2021-08-05 | 2024-03-29 | 麦克德米德乐思公司 | 用于电沉积纳米孪晶铜的组合物和方法 |
| EP4409058B1 (en) | 2021-10-01 | 2025-11-05 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
| EP4551742A1 (en) | 2022-07-07 | 2025-05-14 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| KR20250124348A (ko) | 2022-12-19 | 2025-08-19 | 바스프 에스이 | 구리 나노트윈 전착용 조성물 |
| KR20260046113A (ko) | 2023-08-03 | 2026-04-06 | 바스프 에스이 | 금속 시드 상의 구리 전기도금을 위한 조성물 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093594A (en) * | 1976-08-18 | 1978-06-06 | Celanese Polymer Specialties Company | Process for preparing cathodically depositable coating compositions |
| US4146442A (en) * | 1978-05-12 | 1979-03-27 | R. O. Hull & Company, Inc. | Zinc electroplating baths and process |
| US4347108A (en) | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| JP4296358B2 (ja) | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6679983B2 (en) | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| AU2002245083A1 (en) | 2000-11-03 | 2002-07-24 | Shipley Company, L.L.C. | Electrochemical co-deposition of metals for electronic device manufacture |
| US6881732B2 (en) * | 2002-06-13 | 2005-04-19 | Chelator Llc | Neuroprotection and cardioprotection afforded by chelators with high affinity and specificity for cations of first transition series elements |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| EP2106413A1 (de) * | 2006-12-21 | 2009-10-07 | Basf Se | Thermosensitiver polymerer farbübertragungsinhibitor |
| FR2911878B1 (fr) * | 2007-01-31 | 2012-11-02 | Rhodia Recherches & Tech | Procede de preparation de polyhydroxy-urethanes. |
| US20110077376A1 (en) * | 2008-05-30 | 2011-03-31 | Katsumi Tokumoto | Process for producing hydroxyalkyltriethylenediamine, and catalyst composition for the production of polyurethane resin using it |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| SG174264A1 (en) * | 2009-04-07 | 2011-10-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| RU2542219C2 (ru) | 2009-04-07 | 2015-02-20 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| WO2010115756A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2010115757A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2011012462A2 (en) * | 2009-07-30 | 2011-02-03 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| JP5775077B2 (ja) * | 2009-07-30 | 2015-09-09 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
| JP5952738B2 (ja) | 2009-11-27 | 2016-07-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平滑化剤を含む金属電気メッキのための組成物 |
| EP2576696B1 (en) * | 2010-06-01 | 2017-10-04 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN102212305B (zh) * | 2011-05-03 | 2013-07-31 | 中国科学院宁波材料技术与工程研究所 | 一种改进羟烷基酰胺/聚酯粉末涂料针孔和流平性的方法 |
| RU2013158459A (ru) * | 2011-06-01 | 2015-07-20 | Басф Се | Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов |
| DE102011116764A1 (de) * | 2011-10-22 | 2013-04-25 | Gonzalo Urrutia Desmaison | Polykationen und Derivate |
| US8980077B2 (en) | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| JP6411354B2 (ja) * | 2012-11-09 | 2018-10-24 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平坦化剤を含む金属電気めっきのための組成物 |
| US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2017
- 2017-12-19 KR KR1020197020953A patent/KR102457310B1/ko active Active
- 2017-12-19 JP JP2019533638A patent/JP2020502370A/ja not_active Withdrawn
- 2017-12-19 EP EP17835664.8A patent/EP3559317B1/en active Active
- 2017-12-19 WO PCT/EP2017/083603 patent/WO2018114985A1/en not_active Ceased
- 2017-12-19 CN CN202210633931.XA patent/CN115182004A/zh active Pending
- 2017-12-19 CN CN201780078648.2A patent/CN110100048B/zh active Active
- 2017-12-19 US US16/468,467 patent/US11926918B2/en active Active
- 2017-12-20 TW TW106144836A patent/TWI746746B/zh active
-
2019
- 2019-06-13 IL IL267332A patent/IL267332A/en unknown
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