JP2020502370A5 - - Google Patents
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- JP2020502370A5 JP2020502370A5 JP2019533638A JP2019533638A JP2020502370A5 JP 2020502370 A5 JP2020502370 A5 JP 2020502370A5 JP 2019533638 A JP2019533638 A JP 2019533638A JP 2019533638 A JP2019533638 A JP 2019533638A JP 2020502370 A5 JP2020502370 A5 JP 2020502370A5
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- Japan
- Prior art keywords
- composition according
- formula
- branched
- linear
- alkanediyl
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- 239000000203 mixture Substances 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 5
- -1 ethanediyl Chemical group 0.000 claims 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 238000001556 precipitation Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16205553.7 | 2016-12-20 | ||
| EP16205553 | 2016-12-20 | ||
| PCT/EP2017/083603 WO2018114985A1 (en) | 2016-12-20 | 2017-12-19 | Composition for metal plating comprising suppressing agent for void free filling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020502370A JP2020502370A (ja) | 2020-01-23 |
| JP2020502370A5 true JP2020502370A5 (enExample) | 2021-02-04 |
Family
ID=57860616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019533638A Withdrawn JP2020502370A (ja) | 2016-12-20 | 2017-12-19 | ボイドフリーでの埋め込みのための抑制剤を含む金属めっきのための組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11926918B2 (enExample) |
| EP (1) | EP3559317B1 (enExample) |
| JP (1) | JP2020502370A (enExample) |
| KR (1) | KR102457310B1 (enExample) |
| CN (2) | CN110100048B (enExample) |
| IL (1) | IL267332A (enExample) |
| TW (1) | TWI746746B (enExample) |
| WO (1) | WO2018114985A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102641595B1 (ko) | 2017-09-04 | 2024-02-27 | 바스프 에스이 | 평탄화 제제를 포함하는 금속 전기 도금용 조성물 |
| US20190186032A1 (en) * | 2017-12-14 | 2019-06-20 | Soulbrain Co., Ltd. | Composition for cobalt plating and method for forming metal wiring using the same |
| WO2019121092A1 (en) * | 2017-12-20 | 2019-06-27 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| CN112135929B (zh) * | 2018-04-20 | 2023-12-15 | 巴斯夫欧洲公司 | 包含抑制剂的用于锡或锡合金电镀的组合物 |
| CN111690958B (zh) * | 2019-03-15 | 2023-07-28 | 上海新阳半导体材料股份有限公司 | 一种锡镀液、其制备方法和应用 |
| US20220356592A1 (en) | 2019-09-27 | 2022-11-10 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| US20220333262A1 (en) | 2019-09-27 | 2022-10-20 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN110938848B (zh) * | 2019-12-26 | 2021-05-11 | 江苏艾森半导体材料股份有限公司 | 一种用于电解沉积铜的组合物及酸铜电镀液 |
| WO2021175935A1 (en) * | 2020-03-06 | 2021-09-10 | Basf Se | Electroplating with a polycarboxylate ether supressor |
| EP4127025B1 (en) | 2020-04-03 | 2025-10-01 | Basf Se | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent |
| WO2021225827A1 (en) * | 2020-05-08 | 2021-11-11 | Lam Research Corporation | Electroplating cobalt, nickel, and alloys thereof |
| US11280014B2 (en) | 2020-06-05 | 2022-03-22 | Macdermid Enthone Inc. | Silver/tin electroplating bath and method of using the same |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| US20230265576A1 (en) * | 2020-07-13 | 2023-08-24 | Basf Se | Composition For Copper Electroplating On A Cobalt Seed |
| US11384446B2 (en) * | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| KR102339867B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| US20240318342A1 (en) * | 2021-08-05 | 2024-09-26 | Macdermid Enthone Inc. | Compositions and methods for the eletrodeposition of nanotwinned copper |
| EP4409058B1 (en) | 2021-10-01 | 2025-11-05 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
| EP4551742A1 (en) | 2022-07-07 | 2025-05-14 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| CN120457244A (zh) | 2022-12-19 | 2025-08-08 | 巴斯夫欧洲公司 | 用于铜纳米孪晶电沉积的组合物 |
| WO2025026863A1 (en) | 2023-08-03 | 2025-02-06 | Basf Se | Composition for copper electroplating on a metal seed |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093594A (en) * | 1976-08-18 | 1978-06-06 | Celanese Polymer Specialties Company | Process for preparing cathodically depositable coating compositions |
| US4146442A (en) * | 1978-05-12 | 1979-03-27 | R. O. Hull & Company, Inc. | Zinc electroplating baths and process |
| US4347108A (en) | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| JP4296358B2 (ja) | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6679983B2 (en) | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| KR20030048110A (ko) | 2000-11-03 | 2003-06-18 | 쉬플리 캄파니, 엘.엘.씨. | 전자 디바이스 제조용 금속의 전기화학적 공침착 |
| US6881732B2 (en) * | 2002-06-13 | 2005-04-19 | Chelator Llc | Neuroprotection and cardioprotection afforded by chelators with high affinity and specificity for cations of first transition series elements |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| BRPI0721265A2 (pt) * | 2006-12-21 | 2014-04-01 | Basf Se | Uso de polímeros termicamente sensíveis, processo para a lavagem de têxteis coloridos, copolímero, e, formulação de composição de lavagem. |
| FR2911878B1 (fr) * | 2007-01-31 | 2012-11-02 | Rhodia Recherches & Tech | Procede de preparation de polyhydroxy-urethanes. |
| US20110077376A1 (en) * | 2008-05-30 | 2011-03-31 | Katsumi Tokumoto | Process for producing hydroxyalkyltriethylenediamine, and catalyst composition for the production of polyurethane resin using it |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US20120027948A1 (en) | 2009-04-07 | 2012-02-02 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| JP5702359B2 (ja) * | 2009-04-07 | 2015-04-15 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | サブミクロンの窪みの無ボイド充填用の抑制剤含有金属めっき組成物 |
| RU2542219C2 (ru) | 2009-04-07 | 2015-02-20 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| WO2010115757A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US9869029B2 (en) * | 2009-07-30 | 2018-01-16 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| EP2459779B1 (en) * | 2009-07-30 | 2015-09-09 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| EP3848417B1 (en) | 2009-11-27 | 2025-01-08 | Basf Se | Composition for copper electroplating comprising leveling agent |
| SG185736A1 (en) | 2010-06-01 | 2012-12-28 | Basf Se | Composition for metal electroplating comprising leveling agent |
| SG10201510522XA (en) | 2010-12-21 | 2016-01-28 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN102212305B (zh) * | 2011-05-03 | 2013-07-31 | 中国科学院宁波材料技术与工程研究所 | 一种改进羟烷基酰胺/聚酯粉末涂料针孔和流平性的方法 |
| MY168658A (en) * | 2011-06-01 | 2018-11-28 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
| DE102011116764A1 (de) * | 2011-10-22 | 2013-04-25 | Gonzalo Urrutia Desmaison | Polykationen und Derivate |
| US8980077B2 (en) | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| CN104797633B (zh) * | 2012-11-09 | 2018-04-24 | 巴斯夫欧洲公司 | 用于金属电镀的包含调平剂的组合物 |
| US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2017
- 2017-12-19 KR KR1020197020953A patent/KR102457310B1/ko active Active
- 2017-12-19 EP EP17835664.8A patent/EP3559317B1/en active Active
- 2017-12-19 WO PCT/EP2017/083603 patent/WO2018114985A1/en not_active Ceased
- 2017-12-19 JP JP2019533638A patent/JP2020502370A/ja not_active Withdrawn
- 2017-12-19 CN CN201780078648.2A patent/CN110100048B/zh active Active
- 2017-12-19 US US16/468,467 patent/US11926918B2/en active Active
- 2017-12-19 CN CN202210633931.XA patent/CN115182004A/zh active Pending
- 2017-12-20 TW TW106144836A patent/TWI746746B/zh active
-
2019
- 2019-06-13 IL IL267332A patent/IL267332A/en unknown
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