JP2021503560A5 - - Google Patents
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- JP2021503560A5 JP2021503560A5 JP2020545450A JP2020545450A JP2021503560A5 JP 2021503560 A5 JP2021503560 A5 JP 2021503560A5 JP 2020545450 A JP2020545450 A JP 2020545450A JP 2020545450 A JP2020545450 A JP 2020545450A JP 2021503560 A5 JP2021503560 A5 JP 2021503560A5
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- JP
- Japan
- Prior art keywords
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- alkyl
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000003118 aryl group Chemical group 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 125000002877 alkyl aryl group Chemical group 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims 4
- 229910017052 cobalt Inorganic materials 0.000 claims 4
- 239000010941 cobalt Substances 0.000 claims 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 125000002837 carbocyclic group Chemical group 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 125000000623 heterocyclic group Chemical group 0.000 claims 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910001429 cobalt ion Inorganic materials 0.000 claims 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 claims 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17202568 | 2017-11-20 | ||
| EP17202568.6 | 2017-11-20 | ||
| PCT/EP2018/081692 WO2019097044A1 (en) | 2017-11-20 | 2018-11-19 | Composition for cobalt electroplating comprising leveling agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021503560A JP2021503560A (ja) | 2021-02-12 |
| JP2021503560A5 true JP2021503560A5 (enExample) | 2022-01-04 |
Family
ID=60409228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020545450A Pending JP2021503560A (ja) | 2017-11-20 | 2018-11-19 | レベリング剤を含んだコバルト電気メッキ用組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11377748B2 (enExample) |
| EP (1) | EP3714085B1 (enExample) |
| JP (1) | JP2021503560A (enExample) |
| KR (1) | KR102647950B1 (enExample) |
| CN (2) | CN111344438B (enExample) |
| IL (1) | IL274486A (enExample) |
| TW (2) | TWI870818B (enExample) |
| WO (1) | WO2019097044A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113195794A (zh) * | 2018-12-21 | 2021-07-30 | 巴斯夫欧洲公司 | 包含用于无空隙亚微米特征填充的添加剂的用于镀钴的组合物 |
| US11230778B2 (en) | 2019-12-13 | 2022-01-25 | Macdermid Enthone Inc. | Cobalt chemistry for smooth topology |
| FR3119848B1 (fr) * | 2021-02-18 | 2025-10-31 | Aveni | Electrolyte et Procédé d’électrodéposition de cobalt |
| US12410534B2 (en) | 2022-09-26 | 2025-09-09 | Dupont Electronic Materials International, Llc | Nickel electroplating compositions for rough nickel |
| US12428744B2 (en) | 2022-09-26 | 2025-09-30 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions for rough nickel |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1283417A (en) * | 1968-10-24 | 1972-07-26 | Kewanee Oil Co | High speed electrodeposition of nickel and/or cobalt |
| US3814674A (en) * | 1970-11-05 | 1974-06-04 | Oxy Metal Finishing Corp | Electrodeposition of cobalt |
| JPS5424971B1 (enExample) * | 1970-12-10 | 1979-08-24 | ||
| DE2100971B2 (de) * | 1971-01-11 | 1975-04-17 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten |
| US4036709A (en) * | 1975-09-22 | 1977-07-19 | M & T Chemicals Inc. | Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron |
| FR2472621A3 (fr) * | 1979-12-28 | 1981-07-03 | Xantia National Corp | Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome |
| US4425198A (en) | 1981-06-16 | 1984-01-10 | Omi International Corporation | Brightening composition for zinc alloy electroplating bath and its method of use |
| DE69624846T2 (de) * | 1996-06-03 | 2003-03-20 | Ebara-Udylite Co. Ltd., Tokio/Tokyo | Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung |
| US6508924B1 (en) * | 2000-05-31 | 2003-01-21 | Shipley Company L.L.C. | Control of breakdown products in electroplating baths |
| WO2002063070A1 (en) * | 2001-02-08 | 2002-08-15 | The University Of Alabama In Huntsville | Nickel cobalt phosphorous low stress electroplating |
| JP4128005B2 (ja) | 2001-12-28 | 2008-07-30 | 日本リーロナール有限会社 | 電気ニッケルめっき液 |
| ES2271848T3 (es) | 2003-02-24 | 2007-04-16 | Basf Aktiengesellschaft | Polimeros que contienen carboxilato para el tratamiento de superficies metalicas. |
| TW200707640A (en) * | 2005-03-18 | 2007-02-16 | Applied Materials Inc | Contact metallization scheme using a barrier layer over a silicide layer |
| DE102005038608A1 (de) | 2005-08-16 | 2007-02-22 | Basf Ag | Polymerzusammensetzung für den Korrosionsschutz |
| TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
| JP5201315B2 (ja) * | 2007-09-26 | 2013-06-05 | 上村工業株式会社 | 電気めっき方法 |
| US20090188805A1 (en) | 2008-01-25 | 2009-07-30 | Government Of The United States Of America, As Represented By The | Superconformal electrodeposition of nickel iron and cobalt magnetic alloys |
| SG10201404301WA (en) * | 2009-07-30 | 2014-09-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| KR101752018B1 (ko) * | 2009-07-30 | 2017-06-28 | 바스프 에스이 | 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물 |
| US8691687B2 (en) | 2010-01-07 | 2014-04-08 | International Business Machines Corporation | Superfilled metal contact vias for semiconductor devices |
| MY156690A (en) * | 2010-03-18 | 2016-03-15 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2392692A1 (en) * | 2010-06-01 | 2011-12-07 | Basf Se | Composition for metal electroplating comprising leveling agent |
| RU2013133648A (ru) * | 2010-12-21 | 2015-01-27 | Басф Се | Композиция для электролитического осаждения металлов, содержащая выравнивающий агент |
| WO2012164509A1 (en) * | 2011-06-01 | 2012-12-06 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
| EP2530102A1 (en) * | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US9514983B2 (en) | 2012-12-28 | 2016-12-06 | Intel Corporation | Cobalt based interconnects and methods of fabrication thereof |
| EP2801640A1 (en) * | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
| US20150071980A1 (en) * | 2013-09-06 | 2015-03-12 | Savannah River Nuclear Solutions, Llc | Formation of nanosized metal particles on a titanate carrier |
| WO2016006631A1 (ja) * | 2014-07-09 | 2016-01-14 | 日立化成株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| US9777386B2 (en) * | 2015-03-19 | 2017-10-03 | Lam Research Corporation | Chemistry additives and process for cobalt film electrodeposition |
| CN107849722A (zh) * | 2015-06-30 | 2018-03-27 | 麦德美乐思公司 | 微电子电路中的互连部的钴填充 |
| US20170067173A1 (en) * | 2015-09-09 | 2017-03-09 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
| CN109477234B (zh) | 2016-07-18 | 2021-12-10 | 巴斯夫欧洲公司 | 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物 |
| US10329683B2 (en) * | 2016-11-03 | 2019-06-25 | Lam Research Corporation | Process for optimizing cobalt electrofill using sacrificial oxidants |
| US11035048B2 (en) * | 2017-07-05 | 2021-06-15 | Macdermid Enthone Inc. | Cobalt filling of interconnects |
| WO2019089282A1 (en) * | 2017-11-01 | 2019-05-09 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
| WO2019201623A2 (en) | 2018-04-19 | 2019-10-24 | Basf Se | Composition for cobalt or cobalt alloy electroplating |
-
2018
- 2018-11-19 KR KR1020207016960A patent/KR102647950B1/ko active Active
- 2018-11-19 CN CN201880072834.XA patent/CN111344438B/zh active Active
- 2018-11-19 CN CN202510649087.3A patent/CN120776404A/zh active Pending
- 2018-11-19 WO PCT/EP2018/081692 patent/WO2019097044A1/en not_active Ceased
- 2018-11-19 EP EP18800670.4A patent/EP3714085B1/en active Active
- 2018-11-19 JP JP2020545450A patent/JP2021503560A/ja active Pending
- 2018-11-19 US US16/762,717 patent/US11377748B2/en active Active
- 2018-11-20 TW TW112112867A patent/TWI870818B/zh active
- 2018-11-20 TW TW107141016A patent/TWI800558B/zh active
-
2020
- 2020-05-06 IL IL274486A patent/IL274486A/en unknown
-
2022
- 2022-06-02 US US17/805,144 patent/US20220298664A1/en not_active Abandoned
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