IL274486A - A preparation for electroplating with cobalt containing an equalizing factor - Google Patents

A preparation for electroplating with cobalt containing an equalizing factor

Info

Publication number
IL274486A
IL274486A IL274486A IL27448620A IL274486A IL 274486 A IL274486 A IL 274486A IL 274486 A IL274486 A IL 274486A IL 27448620 A IL27448620 A IL 27448620A IL 274486 A IL274486 A IL 274486A
Authority
IL
Israel
Prior art keywords
composition
leveling agent
cobalt electroplating
electroplating
cobalt
Prior art date
Application number
IL274486A
Other languages
English (en)
Hebrew (he)
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL274486A publication Critical patent/IL274486A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IL274486A 2017-11-20 2020-05-06 A preparation for electroplating with cobalt containing an equalizing factor IL274486A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17202568 2017-11-20
PCT/EP2018/081692 WO2019097044A1 (en) 2017-11-20 2018-11-19 Composition for cobalt electroplating comprising leveling agent

Publications (1)

Publication Number Publication Date
IL274486A true IL274486A (en) 2020-06-30

Family

ID=60409228

Family Applications (1)

Application Number Title Priority Date Filing Date
IL274486A IL274486A (en) 2017-11-20 2020-05-06 A preparation for electroplating with cobalt containing an equalizing factor

Country Status (8)

Country Link
US (2) US11377748B2 (enExample)
EP (1) EP3714085B1 (enExample)
JP (1) JP2021503560A (enExample)
KR (1) KR102647950B1 (enExample)
CN (2) CN111344438B (enExample)
IL (1) IL274486A (enExample)
TW (2) TWI870818B (enExample)
WO (1) WO2019097044A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020126687A1 (en) * 2018-12-21 2020-06-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel
US12428744B2 (en) * 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1283417A (en) 1968-10-24 1972-07-26 Kewanee Oil Co High speed electrodeposition of nickel and/or cobalt
US3814674A (en) * 1970-11-05 1974-06-04 Oxy Metal Finishing Corp Electrodeposition of cobalt
JPS5424971B1 (enExample) * 1970-12-10 1979-08-24
DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
US4036709A (en) * 1975-09-22 1977-07-19 M & T Chemicals Inc. Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
US6193789B1 (en) * 1996-06-03 2001-02-27 Hideo Honma Electroless copper plating solution and method for electroless copper plating
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
ATE338090T1 (de) 2003-02-24 2006-09-15 Basf Ag Carboxylat-haltige polymere für die metalloberflächenbehandlung
US7514353B2 (en) * 2005-03-18 2009-04-07 Applied Materials, Inc. Contact metallization scheme using a barrier layer over a silicide layer
DE102005038608A1 (de) 2005-08-16 2007-02-22 Basf Ag Polymerzusammensetzung für den Korrosionsschutz
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5201315B2 (ja) * 2007-09-26 2013-06-05 上村工業株式会社 電気めっき方法
US20090188805A1 (en) 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
CN102597329B (zh) * 2009-07-30 2015-12-16 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
WO2011012475A1 (en) * 2009-07-30 2011-02-03 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
TWI500823B (zh) * 2010-03-18 2015-09-21 Basf Se 包含整平劑之金屬電鍍用組合物
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
MY170653A (en) * 2010-12-21 2019-08-23 Basf Se Composition for metal electroplating comprising leveling agent
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
SG194983A1 (en) * 2011-06-01 2013-12-30 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
US9514983B2 (en) 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
US20150071980A1 (en) * 2013-09-06 2015-03-12 Savannah River Nuclear Solutions, Llc Formation of nanosized metal particles on a titanate carrier
US10283373B2 (en) 2014-07-09 2019-05-07 Hitachi Chemical Company, Ltd. CMP polishing liquid and polishing method
US9777386B2 (en) 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
TWI758252B (zh) * 2015-06-30 2022-03-21 美商麥克達米德恩索龍股份有限公司 微電子中之互連的鈷填充
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
WO2018015168A1 (en) 2016-07-18 2018-01-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
WO2019089282A1 (en) * 2017-11-01 2019-05-09 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN119121333A (zh) 2018-04-19 2024-12-13 巴斯夫欧洲公司 用于钴或钴合金电镀的组合物

Also Published As

Publication number Publication date
CN111344438A (zh) 2020-06-26
TWI800558B (zh) 2023-05-01
TW201923154A (zh) 2019-06-16
KR20200089697A (ko) 2020-07-27
EP3714085A1 (en) 2020-09-30
TWI870818B (zh) 2025-01-21
US20200347503A1 (en) 2020-11-05
EP3714085B1 (en) 2023-08-09
WO2019097044A1 (en) 2019-05-23
CN111344438B (zh) 2025-06-06
JP2021503560A (ja) 2021-02-12
KR102647950B1 (ko) 2024-03-14
US11377748B2 (en) 2022-07-05
TW202334510A (zh) 2023-09-01
CN120776404A (zh) 2025-10-14
US20220298664A1 (en) 2022-09-22

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