IL274486A - A preparation for electroplating with cobalt containing an equalizing factor - Google Patents

A preparation for electroplating with cobalt containing an equalizing factor

Info

Publication number
IL274486A
IL274486A IL274486A IL27448620A IL274486A IL 274486 A IL274486 A IL 274486A IL 274486 A IL274486 A IL 274486A IL 27448620 A IL27448620 A IL 27448620A IL 274486 A IL274486 A IL 274486A
Authority
IL
Israel
Prior art keywords
composition
leveling agent
cobalt electroplating
electroplating
cobalt
Prior art date
Application number
IL274486A
Other languages
English (en)
Hebrew (he)
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL274486A publication Critical patent/IL274486A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
IL274486A 2017-11-20 2020-05-06 A preparation for electroplating with cobalt containing an equalizing factor IL274486A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17202568 2017-11-20
PCT/EP2018/081692 WO2019097044A1 (en) 2017-11-20 2018-11-19 Composition for cobalt electroplating comprising leveling agent

Publications (1)

Publication Number Publication Date
IL274486A true IL274486A (en) 2020-06-30

Family

ID=60409228

Family Applications (1)

Application Number Title Priority Date Filing Date
IL274486A IL274486A (en) 2017-11-20 2020-05-06 A preparation for electroplating with cobalt containing an equalizing factor

Country Status (8)

Country Link
US (2) US11377748B2 (enExample)
EP (1) EP3714085B1 (enExample)
JP (1) JP2021503560A (enExample)
KR (1) KR102647950B1 (enExample)
CN (2) CN120776404A (enExample)
IL (1) IL274486A (enExample)
TW (2) TWI800558B (enExample)
WO (1) WO2019097044A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3899107A1 (en) * 2018-12-21 2021-10-27 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12428744B2 (en) * 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1283417A (en) 1968-10-24 1972-07-26 Kewanee Oil Co High speed electrodeposition of nickel and/or cobalt
US3814674A (en) * 1970-11-05 1974-06-04 Oxy Metal Finishing Corp Electrodeposition of cobalt
JPS5424971B1 (enExample) * 1970-12-10 1979-08-24
DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
US4036709A (en) * 1975-09-22 1977-07-19 M & T Chemicals Inc. Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
CN1195889C (zh) * 1996-06-03 2005-04-06 本间英夫 无电镀铜溶液和无电镀铜的方法
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
WO2004074372A1 (de) 2003-02-24 2004-09-02 Basf Aktiengesellschaft Carboxylat-haltige polymere für die metalloberflächenbehandlung
US20060252252A1 (en) * 2005-03-18 2006-11-09 Zhize Zhu Electroless deposition processes and compositions for forming interconnects
DE102005038608A1 (de) 2005-08-16 2007-02-22 Basf Ag Polymerzusammensetzung für den Korrosionsschutz
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5201315B2 (ja) * 2007-09-26 2013-06-05 上村工業株式会社 電気めっき方法
US20090188805A1 (en) 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
WO2011012462A2 (en) * 2009-07-30 2011-02-03 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
JP5775077B2 (ja) * 2009-07-30 2015-09-09 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
EP2547731B1 (en) * 2010-03-18 2014-07-30 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
EP2655457B1 (en) * 2010-12-21 2019-04-10 Basf Se Composition for metal electroplating comprising leveling agent
RU2013158459A (ru) * 2011-06-01 2015-07-20 Басф Се Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US9514983B2 (en) 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
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WO2016006631A1 (ja) * 2014-07-09 2016-01-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US9777386B2 (en) * 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
KR102448669B1 (ko) * 2015-06-30 2022-09-29 맥더미드 엔쏜 인코포레이티드 마이크로일렉트로닉스 내의 상호연결들의 코발트 충진
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
CN114059125A (zh) 2016-07-18 2022-02-18 巴斯夫欧洲公司 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
WO2019089282A1 (en) * 2017-11-01 2019-05-09 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN119121333A (zh) 2018-04-19 2024-12-13 巴斯夫欧洲公司 用于钴或钴合金电镀的组合物

Also Published As

Publication number Publication date
KR20200089697A (ko) 2020-07-27
EP3714085A1 (en) 2020-09-30
KR102647950B1 (ko) 2024-03-14
TWI800558B (zh) 2023-05-01
US11377748B2 (en) 2022-07-05
TW201923154A (zh) 2019-06-16
WO2019097044A1 (en) 2019-05-23
US20220298664A1 (en) 2022-09-22
TWI870818B (zh) 2025-01-21
CN111344438A (zh) 2020-06-26
CN120776404A (zh) 2025-10-14
TW202334510A (zh) 2023-09-01
CN111344438B (zh) 2025-06-06
US20200347503A1 (en) 2020-11-05
JP2021503560A (ja) 2021-02-12
EP3714085B1 (en) 2023-08-09

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