CN111344438B - 用于电镀钴的包含流平剂的组合物 - Google Patents

用于电镀钴的包含流平剂的组合物 Download PDF

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Publication number
CN111344438B
CN111344438B CN201880072834.XA CN201880072834A CN111344438B CN 111344438 B CN111344438 B CN 111344438B CN 201880072834 A CN201880072834 A CN 201880072834A CN 111344438 B CN111344438 B CN 111344438B
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China
Prior art keywords
group
composition
cobalt
integer
acid
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CN201880072834.XA
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English (en)
Chinese (zh)
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CN111344438A (zh
Inventor
N·恩格尔哈特
D·迈耶
M·阿诺德
A·弗鲁格尔
C·埃姆内特
L·B·亨德森
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BASF SE
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BASF SE
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Priority to CN202510649087.3A priority Critical patent/CN120776404A/zh
Publication of CN111344438A publication Critical patent/CN111344438A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201880072834.XA 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物 Active CN111344438B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510649087.3A CN120776404A (zh) 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17202568.6 2017-11-20
EP17202568 2017-11-20
PCT/EP2018/081692 WO2019097044A1 (en) 2017-11-20 2018-11-19 Composition for cobalt electroplating comprising leveling agent

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202510649087.3A Division CN120776404A (zh) 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物

Publications (2)

Publication Number Publication Date
CN111344438A CN111344438A (zh) 2020-06-26
CN111344438B true CN111344438B (zh) 2025-06-06

Family

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CN202510649087.3A Pending CN120776404A (zh) 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物
CN201880072834.XA Active CN111344438B (zh) 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物

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CN202510649087.3A Pending CN120776404A (zh) 2017-11-20 2018-11-19 用于电镀钴的包含流平剂的组合物

Country Status (8)

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US (2) US11377748B2 (enExample)
EP (1) EP3714085B1 (enExample)
JP (1) JP2021503560A (enExample)
KR (1) KR102647950B1 (enExample)
CN (2) CN120776404A (enExample)
IL (1) IL274486A (enExample)
TW (2) TWI870818B (enExample)
WO (1) WO2019097044A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12098473B2 (en) 2018-12-21 2024-09-24 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
FR3119848B1 (fr) * 2021-02-18 2025-10-31 Aveni Electrolyte et Procédé d’électrodéposition de cobalt
US12428744B2 (en) 2022-09-26 2025-09-30 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel
US12410534B2 (en) 2022-09-26 2025-09-09 Dupont Electronic Materials International, Llc Nickel electroplating compositions for rough nickel

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1283417A (en) * 1968-10-24 1972-07-26 Kewanee Oil Co High speed electrodeposition of nickel and/or cobalt
US3814674A (en) * 1970-11-05 1974-06-04 Oxy Metal Finishing Corp Electrodeposition of cobalt
JPS5424971B1 (enExample) * 1970-12-10 1979-08-24
DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
US4036709A (en) * 1975-09-22 1977-07-19 M & T Chemicals Inc. Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
US6193789B1 (en) * 1996-06-03 2001-02-27 Hideo Honma Electroless copper plating solution and method for electroless copper plating
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
DE502004001320D1 (de) 2003-02-24 2006-10-12 Basf Ag Carboxylat-haltige polymere für die metalloberflächenbehandlung
US20060252252A1 (en) * 2005-03-18 2006-11-09 Zhize Zhu Electroless deposition processes and compositions for forming interconnects
DE102005038608A1 (de) 2005-08-16 2007-02-22 Basf Ag Polymerzusammensetzung für den Korrosionsschutz
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5201315B2 (ja) * 2007-09-26 2013-06-05 上村工業株式会社 電気めっき方法
US20090188805A1 (en) 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
JP5714581B2 (ja) * 2009-07-30 2015-05-07 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物
JP5775077B2 (ja) * 2009-07-30 2015-09-09 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
EP2547731B1 (en) * 2010-03-18 2014-07-30 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
WO2012085811A1 (en) * 2010-12-21 2012-06-28 Basf Se Composition for metal electroplating comprising leveling agent
CN103547631B (zh) * 2011-06-01 2016-07-06 巴斯夫欧洲公司 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US9514983B2 (en) 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
US20150071980A1 (en) * 2013-09-06 2015-03-12 Savannah River Nuclear Solutions, Llc Formation of nanosized metal particles on a titanate carrier
WO2016006631A1 (ja) 2014-07-09 2016-01-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
US9777386B2 (en) 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
TWI758252B (zh) * 2015-06-30 2022-03-21 美商麥克達米德恩索龍股份有限公司 微電子中之互連的鈷填充
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
CN114059125A (zh) 2016-07-18 2022-02-18 巴斯夫欧洲公司 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
KR102568350B1 (ko) * 2017-11-01 2023-08-21 램 리써치 코포레이션 전기화학적 도금 장치 상에서 도금 전해질 농도 제어
US11585004B2 (en) 2018-04-19 2023-02-21 Basf Se Composition for cobalt or cobalt alloy electroplating

Also Published As

Publication number Publication date
EP3714085B1 (en) 2023-08-09
TW201923154A (zh) 2019-06-16
US20220298664A1 (en) 2022-09-22
WO2019097044A1 (en) 2019-05-23
KR102647950B1 (ko) 2024-03-14
JP2021503560A (ja) 2021-02-12
EP3714085A1 (en) 2020-09-30
CN120776404A (zh) 2025-10-14
KR20200089697A (ko) 2020-07-27
CN111344438A (zh) 2020-06-26
US20200347503A1 (en) 2020-11-05
IL274486A (en) 2020-06-30
TWI870818B (zh) 2025-01-21
TW202334510A (zh) 2023-09-01
US11377748B2 (en) 2022-07-05
TWI800558B (zh) 2023-05-01

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