IL267332A - A preparation for metal coating containing a suppressant for filling without a void - Google Patents
A preparation for metal coating containing a suppressant for filling without a voidInfo
- Publication number
- IL267332A IL267332A IL267332A IL26733219A IL267332A IL 267332 A IL267332 A IL 267332A IL 267332 A IL267332 A IL 267332A IL 26733219 A IL26733219 A IL 26733219A IL 267332 A IL267332 A IL 267332A
- Authority
- IL
- Israel
- Prior art keywords
- composition
- metal plating
- suppressing agent
- void free
- free filling
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16205553 | 2016-12-20 | ||
| PCT/EP2017/083603 WO2018114985A1 (en) | 2016-12-20 | 2017-12-19 | Composition for metal plating comprising suppressing agent for void free filling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL267332A true IL267332A (en) | 2019-08-29 |
Family
ID=57860616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL267332A IL267332A (en) | 2016-12-20 | 2019-06-13 | A preparation for metal coating containing a suppressant for filling without a void |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11926918B2 (enExample) |
| EP (1) | EP3559317B1 (enExample) |
| JP (1) | JP2020502370A (enExample) |
| KR (1) | KR102457310B1 (enExample) |
| CN (2) | CN110100048B (enExample) |
| IL (1) | IL267332A (enExample) |
| TW (1) | TWI746746B (enExample) |
| WO (1) | WO2018114985A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102641595B1 (ko) | 2017-09-04 | 2024-02-27 | 바스프 에스이 | 평탄화 제제를 포함하는 금속 전기 도금용 조성물 |
| US20190186032A1 (en) * | 2017-12-14 | 2019-06-20 | Soulbrain Co., Ltd. | Composition for cobalt plating and method for forming metal wiring using the same |
| WO2019121092A1 (en) * | 2017-12-20 | 2019-06-27 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| US11242606B2 (en) | 2018-04-20 | 2022-02-08 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| CN111690958B (zh) * | 2019-03-15 | 2023-07-28 | 上海新阳半导体材料股份有限公司 | 一种锡镀液、其制备方法和应用 |
| WO2021052817A1 (en) | 2019-09-16 | 2021-03-25 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN110938848B (zh) * | 2019-12-26 | 2021-05-11 | 江苏艾森半导体材料股份有限公司 | 一种用于电解沉积铜的组合物及酸铜电镀液 |
| CN115190921A (zh) * | 2020-03-06 | 2022-10-14 | 巴斯夫欧洲公司 | 使用聚羧酸化物醚抑制剂的电镀 |
| US12134834B2 (en) | 2020-04-03 | 2024-11-05 | Basf Se | Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent |
| CN115867695A (zh) * | 2020-05-08 | 2023-03-28 | 朗姆研究公司 | 电镀钴、镍及其合金 |
| US11280014B2 (en) | 2020-06-05 | 2022-03-22 | Macdermid Enthone Inc. | Silver/tin electroplating bath and method of using the same |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| KR20230037553A (ko) | 2020-07-13 | 2023-03-16 | 바스프 에스이 | 코발트 시드 상의 구리 전기도금을 위한 조성물 |
| US11384446B2 (en) * | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| US12509790B2 (en) * | 2020-12-18 | 2025-12-30 | Basf Se | Composition for tin or tin alloy electroplating comprising leveling agent |
| KR102339867B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| WO2023014524A1 (en) * | 2021-08-05 | 2023-02-09 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| IL311715A (en) | 2021-10-01 | 2024-05-01 | Basf Se | The composition for electrical deposition of copper containing a polyaminoamide compensator |
| US20230203694A1 (en) * | 2021-12-29 | 2023-06-29 | Basf Se | Alkaline composition for copper electroplating comprising a grain refiner |
| WO2024008562A1 (en) | 2022-07-07 | 2024-01-11 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| CN120457244A (zh) | 2022-12-19 | 2025-08-08 | 巴斯夫欧洲公司 | 用于铜纳米孪晶电沉积的组合物 |
| WO2025026863A1 (en) | 2023-08-03 | 2025-02-06 | Basf Se | Composition for copper electroplating on a metal seed |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093594A (en) * | 1976-08-18 | 1978-06-06 | Celanese Polymer Specialties Company | Process for preparing cathodically depositable coating compositions |
| US4146442A (en) | 1978-05-12 | 1979-03-27 | R. O. Hull & Company, Inc. | Zinc electroplating baths and process |
| US4347108A (en) | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| JP4296358B2 (ja) | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6679983B2 (en) | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| AU2002245083A1 (en) | 2000-11-03 | 2002-07-24 | Shipley Company, L.L.C. | Electrochemical co-deposition of metals for electronic device manufacture |
| US6881732B2 (en) * | 2002-06-13 | 2005-04-19 | Chelator Llc | Neuroprotection and cardioprotection afforded by chelators with high affinity and specificity for cations of first transition series elements |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| MX2009005826A (es) * | 2006-12-21 | 2009-06-16 | Basf Se | Inhibidor de transferencia de colorante polimerico termicamente sensible. |
| FR2911878B1 (fr) * | 2007-01-31 | 2012-11-02 | Rhodia Recherches & Tech | Procede de preparation de polyhydroxy-urethanes. |
| US20110077376A1 (en) * | 2008-05-30 | 2011-03-31 | Katsumi Tokumoto | Process for producing hydroxyalkyltriethylenediamine, and catalyst composition for the production of polyurethane resin using it |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2417283B1 (en) * | 2009-04-07 | 2014-07-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2010115757A1 (en) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| KR20170034948A (ko) * | 2009-04-07 | 2017-03-29 | 바스프 에스이 | 무공극 서브미크론 특징부 충전을 위한 억제제를 포함하는 금속 도금용 조성물 |
| RU2542219C2 (ru) | 2009-04-07 | 2015-02-20 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| SG177685A1 (en) * | 2009-07-30 | 2012-02-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| EP2459779B1 (en) * | 2009-07-30 | 2015-09-09 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| JP5952738B2 (ja) | 2009-11-27 | 2016-07-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平滑化剤を含む金属電気メッキのための組成物 |
| CN102939339B (zh) * | 2010-06-01 | 2016-02-17 | 巴斯夫欧洲公司 | 包含流平试剂的金属电镀用组合物 |
| WO2012085811A1 (en) | 2010-12-21 | 2012-06-28 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN102212305B (zh) * | 2011-05-03 | 2013-07-31 | 中国科学院宁波材料技术与工程研究所 | 一种改进羟烷基酰胺/聚酯粉末涂料针孔和流平性的方法 |
| JP6062425B2 (ja) * | 2011-06-01 | 2017-01-18 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | シリコン貫通ビアおよび相互接続フィーチャーのボトムアップ充填のための添加剤を含む金属電気めっきのための組成物 |
| DE102011116764A1 (de) * | 2011-10-22 | 2013-04-25 | Gonzalo Urrutia Desmaison | Polykationen und Derivate |
| US8980077B2 (en) | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| RU2015121797A (ru) | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| US20150122662A1 (en) * | 2013-11-05 | 2015-05-07 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2017
- 2017-12-19 KR KR1020197020953A patent/KR102457310B1/ko active Active
- 2017-12-19 CN CN201780078648.2A patent/CN110100048B/zh active Active
- 2017-12-19 WO PCT/EP2017/083603 patent/WO2018114985A1/en not_active Ceased
- 2017-12-19 EP EP17835664.8A patent/EP3559317B1/en active Active
- 2017-12-19 JP JP2019533638A patent/JP2020502370A/ja not_active Withdrawn
- 2017-12-19 US US16/468,467 patent/US11926918B2/en active Active
- 2017-12-19 CN CN202210633931.XA patent/CN115182004A/zh active Pending
- 2017-12-20 TW TW106144836A patent/TWI746746B/zh active
-
2019
- 2019-06-13 IL IL267332A patent/IL267332A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3559317B1 (en) | 2025-02-12 |
| WO2018114985A1 (en) | 2018-06-28 |
| JP2020502370A (ja) | 2020-01-23 |
| KR102457310B1 (ko) | 2022-10-20 |
| TWI746746B (zh) | 2021-11-21 |
| CN115182004A (zh) | 2022-10-14 |
| TW201835388A (zh) | 2018-10-01 |
| CN110100048B (zh) | 2022-06-21 |
| CN110100048A (zh) | 2019-08-06 |
| US11926918B2 (en) | 2024-03-12 |
| KR20190091360A (ko) | 2019-08-05 |
| US20190309429A1 (en) | 2019-10-10 |
| EP3559317A1 (en) | 2019-10-30 |
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