JP2013500394A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013500394A5 JP2013500394A5 JP2012522093A JP2012522093A JP2013500394A5 JP 2013500394 A5 JP2013500394 A5 JP 2013500394A5 JP 2012522093 A JP2012522093 A JP 2012522093A JP 2012522093 A JP2012522093 A JP 2012522093A JP 2013500394 A5 JP2013500394 A5 JP 2013500394A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- condensate
- composition
- polyalcohol
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 17
- 150000005846 sugar alcohols Polymers 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 3
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 230000005494 condensation Effects 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000009499 grossing Methods 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920005604 random copolymer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22980309P | 2009-07-30 | 2009-07-30 | |
| US61/229,803 | 2009-07-30 | ||
| PCT/EP2010/060276 WO2011012462A2 (en) | 2009-07-30 | 2010-07-16 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013500394A JP2013500394A (ja) | 2013-01-07 |
| JP2013500394A5 true JP2013500394A5 (enExample) | 2013-08-29 |
| JP5714581B2 JP5714581B2 (ja) | 2015-05-07 |
Family
ID=43425023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012522093A Active JP5714581B2 (ja) | 2009-07-30 | 2010-07-16 | マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9869029B2 (enExample) |
| EP (1) | EP2459778B1 (enExample) |
| JP (1) | JP5714581B2 (enExample) |
| KR (1) | KR101752018B1 (enExample) |
| CN (1) | CN102597329B (enExample) |
| IL (1) | IL217536A (enExample) |
| MY (1) | MY157126A (enExample) |
| RU (1) | RU2539897C2 (enExample) |
| SG (2) | SG177685A1 (enExample) |
| TW (1) | TWI487813B (enExample) |
| WO (1) | WO2011012462A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5775077B2 (ja) * | 2009-07-30 | 2015-09-09 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
| US8790426B2 (en) | 2010-04-27 | 2014-07-29 | Basf Se | Quaternized terpolymer |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| JP6245988B2 (ja) * | 2011-02-22 | 2017-12-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | グリセリンカーボネートに基づく重合体 |
| WO2012113618A1 (de) * | 2011-02-22 | 2012-08-30 | Basf Se | Polymere basierend auf glycerincarbonat und einem alkohol |
| RU2013158459A (ru) | 2011-06-01 | 2015-07-20 | Басф Се | Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| JP6411354B2 (ja) | 2012-11-09 | 2018-10-24 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 平坦化剤を含む金属電気めっきのための組成物 |
| KR20150127670A (ko) * | 2013-03-13 | 2015-11-17 | 바스프 에스이 | 토양에서 수분 보유를 효과적으로 증가시키는 습윤제 조성물 및 그의 관련된 식별 방법 |
| PL406197A1 (pl) * | 2013-11-22 | 2015-05-25 | Inphotech Spółka Z Ograniczoną Odpowiedzialnością | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
| CN105899715B (zh) * | 2013-12-09 | 2019-05-31 | 阿文尼公司 | 含有电化学惰性阳离子的铜电沉积浴 |
| US9617648B2 (en) * | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
| CN114059125A (zh) * | 2016-07-18 | 2022-02-18 | 巴斯夫欧洲公司 | 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物 |
| KR102457310B1 (ko) * | 2016-12-20 | 2022-10-20 | 바스프 에스이 | 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물 |
| EP3679179B1 (en) | 2017-09-04 | 2023-10-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN120776404A (zh) * | 2017-11-20 | 2025-10-14 | 巴斯夫欧洲公司 | 用于电镀钴的包含流平剂的组合物 |
| KR102786663B1 (ko) | 2018-03-29 | 2025-03-25 | 바스프 에스이 | 착화제를 포함하는 주석-은 합금 전기도금용 조성물 |
| US10529622B1 (en) | 2018-07-10 | 2020-01-07 | International Business Machines Corporation | Void-free metallic interconnect structures with self-formed diffusion barrier layers |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| IL296980A (en) | 2020-04-03 | 2022-12-01 | Basf Se | The composition for electrodeposition of copper bumps containing a polyaminoamide compensator |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| US11384446B2 (en) | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| EP4409058B1 (en) | 2021-10-01 | 2025-11-05 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| EP4551742A1 (en) | 2022-07-07 | 2025-05-14 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| KR20250124348A (ko) | 2022-12-19 | 2025-08-19 | 바스프 에스이 | 구리 나노트윈 전착용 조성물 |
| US20250149380A1 (en) * | 2023-11-02 | 2025-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect structure and method of forming same |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2441555A (en) | 1943-10-12 | 1948-05-18 | Heyden Chemical Corp | Mixed esters of polyhydric alcohols |
| GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
| US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| SU1055781A1 (ru) * | 1982-03-22 | 1983-11-23 | Ленинградский ордена Трудового Красного Знамени технологический институт целлюлозно-бумажной промышленности | Водный электролит блест щего меднени |
| US4487853A (en) * | 1983-12-27 | 1984-12-11 | Basf Wyandotte Corporation | Low ethylene oxide/high primary hydroxyl content polyether-ester polyols and polyurethane foams based thereon |
| JPS62182295A (ja) * | 1985-08-07 | 1987-08-10 | Daiwa Tokushu Kk | 銅メツキ浴組成物 |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| US5888373A (en) * | 1997-06-23 | 1999-03-30 | Industrial Technology Research Institute | Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof |
| DE10033433A1 (de) * | 2000-07-10 | 2002-01-24 | Basf Ag | Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten |
| EP1197587B1 (en) | 2000-10-13 | 2006-09-20 | Shipley Co. L.L.C. | Seed layer repair and electroplating bath |
| US20020074242A1 (en) * | 2000-10-13 | 2002-06-20 | Shipley Company, L.L.C. | Seed layer recovery |
| EP1341951B1 (en) * | 2000-10-19 | 2004-05-19 | ATOTECH Deutschland GmbH | Copper bath and method of depositing a matt copper coating |
| US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| DE10107880B4 (de) | 2001-02-20 | 2007-12-06 | Clariant Produkte (Deutschland) Gmbh | Alkoxylierte Polyglycerine und ihre Verwendung als Emulsionsspalter |
| EP1422320A1 (en) | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| DE10325198B4 (de) | 2003-06-04 | 2007-10-25 | Clariant Produkte (Deutschland) Gmbh | Verwendung von alkoxylierten vernetzten Polyglycerinen als biologisch abbaubare Emulsionsspalter |
| US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| EP1819848A1 (en) | 2004-11-29 | 2007-08-22 | Technic, Incorporated | Near neutral ph tin electroplating solution |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2282682C1 (ru) * | 2005-04-28 | 2006-08-27 | Российский химико-технологический университет им. Д.И. Менделеева | Электролит и способ меднения |
| MY142392A (en) | 2005-10-26 | 2010-11-30 | Malaysian Palm Oil Board | A process for preparing polymers of polyhydric alcohols |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| RU2385366C1 (ru) * | 2008-12-15 | 2010-03-27 | Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта | Электролит меднения стальных подложек |
| RU2542219C2 (ru) | 2009-04-07 | 2015-02-20 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| WO2010115756A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| SG174264A1 (en) | 2009-04-07 | 2011-10-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2010
- 2010-07-16 WO PCT/EP2010/060276 patent/WO2011012462A2/en not_active Ceased
- 2010-07-16 JP JP2012522093A patent/JP5714581B2/ja active Active
- 2010-07-16 RU RU2012107133/02A patent/RU2539897C2/ru not_active IP Right Cessation
- 2010-07-16 MY MYPI2012000302A patent/MY157126A/en unknown
- 2010-07-16 CN CN201080033647.4A patent/CN102597329B/zh active Active
- 2010-07-16 SG SG2012003315A patent/SG177685A1/en unknown
- 2010-07-16 US US13/387,776 patent/US9869029B2/en active Active
- 2010-07-16 KR KR1020127004870A patent/KR101752018B1/ko active Active
- 2010-07-16 SG SG10201404394QA patent/SG10201404394QA/en unknown
- 2010-07-16 EP EP10731757.0A patent/EP2459778B1/en active Active
- 2010-07-30 TW TW099125535A patent/TWI487813B/zh active
-
2012
- 2012-01-15 IL IL217536A patent/IL217536A/en active IP Right Grant
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2012107133A (ru) | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности | |
| JP2013527325A5 (enExample) | ||
| JP2020502370A5 (enExample) | ||
| JP2011525044A5 (enExample) | ||
| US10822501B2 (en) | Hexagonal boron nitride epoxy compound anticorrosive paint, and preparation method and use thereof | |
| TWI471455B (zh) | 無電解鍍液及使用其之無電解鍍方法及配線基板的製造方法 | |
| JP2013500395A5 (enExample) | ||
| JP2012506928A5 (enExample) | ||
| JP2010535791A5 (enExample) | ||
| RU2012157535A (ru) | Композиция для нанесения металлического покрытия посредством электролитического осаждения, содержащая выравнивающий агент | |
| JP2007526496A5 (enExample) | ||
| JP7781850B2 (ja) | コバルトシード上の銅電気メッキ用組成物 | |
| JP2005536579A5 (enExample) | ||
| JP2009132898A5 (enExample) | ||
| JP2010523752A5 (enExample) | ||
| JP2020509137A5 (enExample) | ||
| JP2014127563A5 (enExample) | ||
| RU2012108226A (ru) | Способ получения полимеров этилена с узким молекулярно-массовым распределением | |
| CN111511963A (zh) | 金属材料用表面处理剂以及具有表面处理皮膜的金属材料及其制造方法 | |
| JP2008095060A5 (enExample) | ||
| CN111681952B (zh) | 基板处理装置 | |
| JP5323042B2 (ja) | シリコンインゴット用水性切削液 | |
| CN104558628A (zh) | 一种磁性纳米级树脂化合物及其制备方法及应用 | |
| JP2011122146A5 (enExample) | ||
| CN119137091A (zh) | 含氟醚化合物、磁记录介质用润滑剂及磁记录介质 |