JP2013500395A5 - - Google Patents

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Publication number
JP2013500395A5
JP2013500395A5 JP2012522097A JP2012522097A JP2013500395A5 JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5 JP 2012522097 A JP2012522097 A JP 2012522097A JP 2012522097 A JP2012522097 A JP 2012522097A JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5
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JP
Japan
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composition according
support
choh
composition
additive
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JP2012522097A
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English (en)
Japanese (ja)
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JP2013500395A (ja
JP5775077B2 (ja
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Priority claimed from PCT/EP2010/060375 external-priority patent/WO2011012475A1/en
Publication of JP2013500395A publication Critical patent/JP2013500395A/ja
Publication of JP2013500395A5 publication Critical patent/JP2013500395A5/ja
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JP2012522097A 2009-07-30 2010-07-19 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 Active JP5775077B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22980909P 2009-07-30 2009-07-30
US61/229,809 2009-07-30
PCT/EP2010/060375 WO2011012475A1 (en) 2009-07-30 2010-07-19 Composition for metal plating comprising suppressing agent for void free submicron feature filling

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015132392A Division JP6117284B2 (ja) 2009-07-30 2015-07-01 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物

Publications (3)

Publication Number Publication Date
JP2013500395A JP2013500395A (ja) 2013-01-07
JP2013500395A5 true JP2013500395A5 (enExample) 2013-09-05
JP5775077B2 JP5775077B2 (ja) 2015-09-09

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ID=42733749

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012522097A Active JP5775077B2 (ja) 2009-07-30 2010-07-19 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物
JP2015132392A Active JP6117284B2 (ja) 2009-07-30 2015-07-01 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015132392A Active JP6117284B2 (ja) 2009-07-30 2015-07-01 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物

Country Status (11)

Country Link
US (1) US9617647B2 (enExample)
EP (1) EP2459779B1 (enExample)
JP (2) JP5775077B2 (enExample)
KR (1) KR101738708B1 (enExample)
CN (1) CN102471910B (enExample)
IL (1) IL217234A (enExample)
MY (1) MY160150A (enExample)
RU (1) RU2539895C2 (enExample)
SG (2) SG177418A1 (enExample)
TW (1) TWI515341B (enExample)
WO (1) WO2011012475A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201510522XA (en) 2010-12-21 2016-01-28 Basf Se Composition for metal electroplating comprising leveling agent
EP2530102A1 (en) 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
MY168658A (en) 2011-06-01 2018-11-28 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
US20130133243A1 (en) 2011-06-28 2013-05-30 Basf Se Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants
CN104797633B (zh) 2012-11-09 2018-04-24 巴斯夫欧洲公司 用于金属电镀的包含调平剂的组合物
EP3141633B1 (en) * 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
KR102457310B1 (ko) * 2016-12-20 2022-10-20 바스프 에스이 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물
CN107604414B (zh) * 2017-08-22 2020-03-24 珠海市奥美伦精细化工有限公司 一种铝及铝合金阳极氧化高温无镍封闭剂
KR102641595B1 (ko) 2017-09-04 2024-02-27 바스프 에스이 평탄화 제제를 포함하는 금속 전기 도금용 조성물
JP2021503560A (ja) * 2017-11-20 2021-02-12 ビーエイエスエフ・ソシエタス・エウロパエアBasf Se レベリング剤を含んだコバルト電気メッキ用組成物
PT3508620T (pt) * 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
US20220333262A1 (en) 2019-09-27 2022-10-20 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
US20220356592A1 (en) 2019-09-27 2022-11-10 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
EP4127025B1 (en) 2020-04-03 2025-10-01 Basf Se Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
US20230265576A1 (en) 2020-07-13 2023-08-24 Basf Se Composition For Copper Electroplating On A Cobalt Seed
EP4409058B1 (en) 2021-10-01 2025-11-05 Basf Se Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
EP4551742A1 (en) 2022-07-07 2025-05-14 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
CN120457244A (zh) 2022-12-19 2025-08-08 巴斯夫欧洲公司 用于铜纳米孪晶电沉积的组合物
WO2025026863A1 (en) 2023-08-03 2025-02-06 Basf Se Composition for copper electroplating on a metal seed

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US4505839A (en) 1981-05-18 1985-03-19 Petrolite Corporation Polyalkanolamines
SU1035097A1 (ru) * 1981-07-20 1983-08-15 Днепропетровский Ордена Трудового Красного Знамени Государственный Университет Им.300-Летия Воссоединения Украины С Россией Электролит меднени
US4430490A (en) * 1982-08-10 1984-02-07 Ppg Industries, Inc. Polyether polyols and their method of preparation
JPS59182986A (ja) * 1983-04-01 1984-10-17 Keigo Obata スズ、鉛及びすず−鉛合金メツキ浴
JPS62182295A (ja) * 1985-08-07 1987-08-10 Daiwa Tokushu Kk 銅メツキ浴組成物
DE4003243A1 (de) 1990-02-03 1991-08-08 Basf Ag Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen
JPH0641581A (ja) * 1992-07-23 1994-02-15 Seiko Epson Corp コンタクトレンズ用親水性洗浄剤
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US6682642B2 (en) 2000-10-13 2004-01-27 Shipley Company, L.L.C. Seed repair and electroplating bath
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
EP1422320A1 (en) 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
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JP2008266722A (ja) * 2007-04-20 2008-11-06 Ebara Udylite Kk パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴
US9869029B2 (en) * 2009-07-30 2018-01-16 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling

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