PL406197A1 - Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi - Google Patents
Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymiInfo
- Publication number
- PL406197A1 PL406197A1 PL406197A PL40619713A PL406197A1 PL 406197 A1 PL406197 A1 PL 406197A1 PL 406197 A PL406197 A PL 406197A PL 40619713 A PL40619713 A PL 40619713A PL 406197 A1 PL406197 A1 PL 406197A1
- Authority
- PL
- Poland
- Prior art keywords
- connecting optical
- optical fibres
- metallic elements
- conducting layers
- cleaning
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/006—Welding metals by means of an electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Sposób przedstawiony na rysunku łączenia włókien światłowodowych pokrytych warstwą przewodzącą korzystnie metalizowaną z elementami metalowymi zawiera etapy: sporządzenie elektrolitu, oczyszczenie powierzchni światłowodu i oczyszczenia elektrod, umieszczenie światłowodu i metalowego elementu czujnika w elektrolizerze, włączenie przepływu prądu, oczyszczenie elementów - połączonego elementu światłowodowego z elementem metalowym.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL406197A PL406197A1 (pl) | 2013-11-22 | 2013-11-22 | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
JP2016533536A JP2017503915A (ja) | 2013-11-22 | 2014-11-22 | 導電性コーティングを有する光ファイバを金属要素に接着させる方法 |
EP14830743.2A EP3071735A1 (en) | 2013-11-22 | 2014-11-22 | A method of bonding optical fibers with conductive coatings with metal elements |
US15/038,376 US20160288268A1 (en) | 2013-11-22 | 2014-11-22 | A method of bonding optical fibers with conductive coatings with metal elements |
CN201480073684.6A CN106164341A (zh) | 2013-11-22 | 2014-11-22 | 具有导电涂层的光纤与金属元件结合的方法 |
PCT/PL2014/050074 WO2015076685A1 (en) | 2013-11-22 | 2014-11-22 | A method of bonding optical fibers with conductive coatings with metal elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL406197A PL406197A1 (pl) | 2013-11-22 | 2013-11-22 | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
Publications (1)
Publication Number | Publication Date |
---|---|
PL406197A1 true PL406197A1 (pl) | 2015-05-25 |
Family
ID=52396790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL406197A PL406197A1 (pl) | 2013-11-22 | 2013-11-22 | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160288268A1 (pl) |
EP (1) | EP3071735A1 (pl) |
JP (1) | JP2017503915A (pl) |
CN (1) | CN106164341A (pl) |
PL (1) | PL406197A1 (pl) |
WO (1) | WO2015076685A1 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107414221B (zh) * | 2017-04-14 | 2019-04-30 | 哈尔滨工业大学 | 一种三维微纳结构电化学诱导加工方法 |
CN111781152B (zh) * | 2020-07-10 | 2021-05-11 | 德州学院 | 一种石墨烯增敏的光纤乳酸传感器及其制备方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2710832A (en) * | 1952-03-28 | 1955-06-14 | Western Electric Co | Electroplating of iron |
US3341350A (en) * | 1964-09-30 | 1967-09-12 | Philip D Anderson | Method of preparing a uranium article for a protective coating |
DE2647108A1 (de) * | 1976-10-19 | 1978-04-20 | Felten & Guilleaume Carlswerk | Verfahren und vorrichtung zur kontinuierlichen metallisierung von nichtmetallischen endlosfasern |
PL134228B1 (en) | 1982-01-28 | 1985-08-31 | Politechnika Warszawska | Bath for electroplating of bright copper coatings |
EP0274772B1 (en) * | 1984-01-20 | 1992-04-22 | Hughes Aircraft Company | Fiber optic structure |
US4733933A (en) * | 1984-01-20 | 1988-03-29 | Hughes Aircraft Company | Fiber optic structure and method of making |
US4647147A (en) * | 1984-01-20 | 1987-03-03 | Hughes Aircraft Company | Fiber optic to integrated optical chip coupler |
DE3486273T2 (de) * | 1984-01-20 | 1994-05-19 | Hughes Aircraft Co | Faseroptisches Bauelement. |
JPS6290603A (ja) * | 1985-10-17 | 1987-04-25 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバアレイの成端方法 |
DE3541733C1 (de) * | 1985-11-26 | 1986-11-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 8000 München | Faseroptische Fabry-Perot-Einrichtung |
US4767508A (en) * | 1986-02-27 | 1988-08-30 | Nippon Mining Co., Ltd. | Strike plating solution useful in applying primer plating to electronic parts |
JPH02275910A (ja) * | 1989-04-18 | 1990-11-09 | Yokogawa Electric Corp | 光ファイバの固定方法 |
JP2567951B2 (ja) * | 1989-08-30 | 1996-12-25 | 古河電気工業株式会社 | 金属被覆光ファイバの製造方法 |
JPH04106509A (ja) * | 1990-08-27 | 1992-04-08 | Kyowa Densen Kk | 光ファイバ素材 |
US5048919A (en) | 1990-10-05 | 1991-09-17 | Bell Communications Research, Inc. | Low-stress coupling of electrooptical device to optical fiber |
US5235179A (en) * | 1991-09-24 | 1993-08-10 | Hughes Aircraft Company | Evanescent wave liquid level sensor with density compensation |
JPH05258623A (ja) * | 1992-03-10 | 1993-10-08 | Furukawa Electric Co Ltd:The | 超電導線の銅安定化層を電気メッキ法により形成する方法 |
US5311610A (en) | 1993-03-31 | 1994-05-10 | Bell Communications Research, Inc. | Low-stress coupling of electrooptical device to optical fiber |
US6126798A (en) * | 1997-11-13 | 2000-10-03 | Novellus Systems, Inc. | Electroplating anode including membrane partition system and method of preventing passivation of same |
US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
JP2000054192A (ja) * | 1998-08-03 | 2000-02-22 | Ngk Insulators Ltd | 複合金属酸化物膜の製造方法 |
JP4481541B2 (ja) * | 2000-12-20 | 2010-06-16 | 日本リーロナール有限会社 | 電解銅めっき液および電解銅めっき液の管理方法 |
US6784104B2 (en) | 2001-07-27 | 2004-08-31 | Texas Instruments Incorporated | Method for improved cu electroplating in integrated circuit fabrication |
JP2003195092A (ja) * | 2001-12-26 | 2003-07-09 | Kyocera Corp | 気密性光ファイバカプラ及びその製造方法 |
US20070102300A1 (en) * | 2005-11-07 | 2007-05-10 | Jin-Shing Dai | Method for ceramic electroplating a cylinder assembly of an internal combustion engine |
EP1839883B1 (de) * | 2006-03-08 | 2016-08-24 | Homag Holzbearbeitungssysteme AG | Verfahren und vorrichtung zum bedrucken plattförmiger werkstücke |
US8062386B2 (en) * | 2006-06-08 | 2011-11-22 | Eveready Battery Company, Inc. | Tin-plated anode casings for alkaline cells |
US20090038947A1 (en) * | 2007-08-07 | 2009-02-12 | Emat Technology, Llc. | Electroplating aqueous solution and method of making and using same |
RU2539897C2 (ru) * | 2009-07-30 | 2015-01-27 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
EP2547731B1 (en) * | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
CN102788603B (zh) * | 2012-07-27 | 2016-02-24 | 华东理工大学 | 全金属封装的耐高温光纤光栅传感器及其制造方法 |
-
2013
- 2013-11-22 PL PL406197A patent/PL406197A1/pl unknown
-
2014
- 2014-11-22 EP EP14830743.2A patent/EP3071735A1/en not_active Withdrawn
- 2014-11-22 JP JP2016533536A patent/JP2017503915A/ja active Pending
- 2014-11-22 CN CN201480073684.6A patent/CN106164341A/zh active Pending
- 2014-11-22 US US15/038,376 patent/US20160288268A1/en not_active Abandoned
- 2014-11-22 WO PCT/PL2014/050074 patent/WO2015076685A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN106164341A (zh) | 2016-11-23 |
EP3071735A1 (en) | 2016-09-28 |
JP2017503915A (ja) | 2017-02-02 |
WO2015076685A1 (en) | 2015-05-28 |
US20160288268A1 (en) | 2016-10-06 |
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