JP5714581B2 - マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物 - Google Patents

マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物 Download PDF

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JP5714581B2
JP5714581B2 JP2012522093A JP2012522093A JP5714581B2 JP 5714581 B2 JP5714581 B2 JP 5714581B2 JP 2012522093 A JP2012522093 A JP 2012522093A JP 2012522093 A JP2012522093 A JP 2012522093A JP 5714581 B2 JP5714581 B2 JP 5714581B2
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copper
oxide
condensate
composition according
polyhydric alcohol
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JP2013500394A5 (enExample
JP2013500394A (ja
Inventor
レーガー−ゲプフェルト，コルネリア
ベネディクト レター，ロマーン
ベネディクト レター，ロマーン
ハーク，アレクサンドラ
マイァ，ディーター
エムネット，シャルロッテ
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BASF SE
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BASF SE
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Paints Or Removers (AREA)
JP2012522093A 2009-07-30 2010-07-16 マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物 Active JP5714581B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22980309P 2009-07-30 2009-07-30
US61/229,803 2009-07-30
PCT/EP2010/060276 WO2011012462A2 (en) 2009-07-30 2010-07-16 Composition for metal plating comprising suppressing agent for void free submicron feature filling

Publications (3)

Publication Number Publication Date
JP2013500394A JP2013500394A (ja) 2013-01-07
JP2013500394A5 JP2013500394A5 (enExample) 2013-08-29
JP5714581B2 true JP5714581B2 (ja) 2015-05-07

Family

ID=43425023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012522093A Active JP5714581B2 (ja) 2009-07-30 2010-07-16 マイクロメーター以下の機構をボイドを形成することなく満たすための抑制剤を含む金属メッキ用組成物

Country Status (11)

Country Link
US (1) US9869029B2 (enExample)
EP (1) EP2459778B1 (enExample)
JP (1) JP5714581B2 (enExample)
KR (1) KR101752018B1 (enExample)
CN (1) CN102597329B (enExample)
IL (1) IL217536A (enExample)
MY (1) MY157126A (enExample)
RU (1) RU2539897C2 (enExample)
SG (2) SG177685A1 (enExample)
TW (1) TWI487813B (enExample)
WO (1) WO2011012462A2 (enExample)

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US8790426B2 (en) 2010-04-27 2014-07-29 Basf Se Quaternized terpolymer
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JP6245988B2 (ja) * 2011-02-22 2017-12-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ グリセリンカーボネートに基づく重合体
WO2012113618A1 (de) * 2011-02-22 2012-08-30 Basf Se Polymere basierend auf glycerincarbonat und einem alkohol
RU2013158459A (ru) 2011-06-01 2015-07-20 Басф Се Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов
EP2530102A1 (en) 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US20130133243A1 (en) 2011-06-28 2013-05-30 Basf Se Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants
JP6411354B2 (ja) 2012-11-09 2018-10-24 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 平坦化剤を含む金属電気めっきのための組成物
KR20150127670A (ko) * 2013-03-13 2015-11-17 바스프 에스이 토양에서 수분 보유를 효과적으로 증가시키는 습윤제 조성물 및 그의 관련된 식별 방법
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CN105899715B (zh) * 2013-12-09 2019-05-31 阿文尼公司 含有电化学惰性阳离子的铜电沉积浴
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CN114059125A (zh) * 2016-07-18 2022-02-18 巴斯夫欧洲公司 包含用于无空隙亚微米结构填充的添加剂的钴镀覆用组合物
KR102457310B1 (ko) * 2016-12-20 2022-10-20 바스프 에스이 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물
EP3679179B1 (en) 2017-09-04 2023-10-11 Basf Se Composition for metal electroplating comprising leveling agent
CN120776404A (zh) * 2017-11-20 2025-10-14 巴斯夫欧洲公司 用于电镀钴的包含流平剂的组合物
KR102786663B1 (ko) 2018-03-29 2025-03-25 바스프 에스이 착화제를 포함하는 주석-은 합금 전기도금용 조성물
US10529622B1 (en) 2018-07-10 2020-01-07 International Business Machines Corporation Void-free metallic interconnect structures with self-formed diffusion barrier layers
WO2021058334A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
EP4034697A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
IL296980A (en) 2020-04-03 2022-12-01 Basf Se The composition for electrodeposition of copper bumps containing a polyaminoamide compensator
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US11384446B2 (en) 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
EP4409058B1 (en) 2021-10-01 2025-11-05 Basf Se Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
EP4551742A1 (en) 2022-07-07 2025-05-14 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
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Also Published As

Publication number Publication date
KR101752018B1 (ko) 2017-06-28
SG177685A1 (en) 2012-02-28
RU2539897C2 (ru) 2015-01-27
EP2459778B1 (en) 2015-01-14
US20120128888A1 (en) 2012-05-24
WO2011012462A2 (en) 2011-02-03
IL217536A (en) 2016-05-31
KR20120051721A (ko) 2012-05-22
WO2011012462A3 (en) 2012-01-19
TW201109477A (en) 2011-03-16
EP2459778A2 (en) 2012-06-06
SG10201404394QA (en) 2014-10-30
IL217536A0 (en) 2012-02-29
CN102597329A (zh) 2012-07-18
CN102597329B (zh) 2015-12-16
TWI487813B (zh) 2015-06-11
RU2012107133A (ru) 2013-09-10
MY157126A (en) 2016-05-13
US9869029B2 (en) 2018-01-16
JP2013500394A (ja) 2013-01-07

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