JP2020096177A - ウエーハ分割装置 - Google Patents
ウエーハ分割装置 Download PDFInfo
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- JP2020096177A JP2020096177A JP2019213864A JP2019213864A JP2020096177A JP 2020096177 A JP2020096177 A JP 2020096177A JP 2019213864 A JP2019213864 A JP 2019213864A JP 2019213864 A JP2019213864 A JP 2019213864A JP 2020096177 A JP2020096177 A JP 2020096177A
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- 239000002390 adhesive tape Substances 0.000 claims abstract description 84
- 235000012431 wafers Nutrition 0.000 claims description 223
- 230000003028 elevating effect Effects 0.000 claims description 72
- 238000004140 cleaning Methods 0.000 claims description 41
- 239000011261 inert gas Substances 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
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Abstract
Description
該第一の仮受け手段の直下に配設され、少なくともウエーハの大きさに対応する大きさの透明板を備えた透明テーブルを備え、該反転手段は、該透明テーブルの上部に配設され該第三の搬出入手段によって該第一の仮受け手段に搬出された洗浄済みのウエーハを支持しているフレームを保持する保持部を備え180度回転してフレームの表裏を反転させ該透明テーブルにフレームを載置し、更に、該反転手段を該透明テーブルから該第一の仮受け手段まで昇降させる昇降手段と、該反転手段によって表裏が反転しウエーハが上を向いたフレームを載置した該透明テーブルを該第一の仮受け手段の直下から該第二の仮受け手段の方向に移動するテーブル移動手段と、該第二の仮受け手段の下方に配設され、該テーブル移動手段によって移動した該透明テーブルに載置されたフレームに支持されたウエーハを覆い不活性ガスを供給するチャンバーと、該チャンバーの下方に配設されフレームに貼着された粘着テープに紫外線を照射する紫外線照射手段と、を備えるのが好適である。
該反転手段は、該第一の仮受け手段に支持されたフレームを保持する保持部を備えると共にX軸方向の回転軸で180度回転してフレームの表裏を反転させる第一の反転手段と、該透明テーブルの上部に配設され該第三の搬出入手段によって該第一の仮受け手段に搬出された洗浄済みのウエーハを支持しているフレームを保持する保持部を備え180度回転してフレームの表裏を反転させ該透明テーブルにフレームを載置する第二の反転手段とを有するのが好ましい。
該搬送手段は、該第一の反転手段によって反転されたフレームをY軸方向に移動する第一の搬送手段と、該第二の搬出入手段によって該第三の仮受け手段から該第二の仮受け手段に搬出され粘着テープが収縮したフレームを該第一の仮受け手段まで搬送する第二の搬送手段とを有するのが公的である。
該第二の反転手段の保持部は、一方の保持部と反対側の他方の保持部とを有し、該紫外線照射手段によって粘着テープに紫外線が照射されウエーハが上を向いたフレームを載置した該透明テーブルが該テーブル移動手段によって該第一の仮受け手段の直下に位置づけられた際、該第二の反転手段は、該透明テーブルに載置されたフレームを該一方の保持部で保持すると共に、該第一の仮受け手段に支持された洗浄済みのウエーハを支持している次のフレームを該他方の保持部で保持し、180度回転して該一方の保持部で保持したフレームを該第一の反転手段に保持させ、該他方の保持部で保持した次のフレームを該透明テーブルに載置し、該第一の反転手段は、X軸方向の回転軸で180度回転して保持したフレームを該第一の仮受け手段に支持させ、該第一の搬出入手段は、該第一の仮受け手段に支持されたフレームを該カセットに搬出するのが好都合である。
該第三の仮受け手段の該一対の第三のガイドレールはZ軸方向上部の上段ガイドレール部とZ軸方向下部の下段ガイドレール部とを備え、該第二の仮受け手段に位置づけられチップに分割される前のウエーハを支持しているフレームは、該第二の搬出入手段によって該第二の仮受け手段から該第三の仮受け手段の該上段ガイドレール部に搬入され、該上段ガイドレール部に支持されたフレームを該フレーム昇降手段によって上昇させ該分割手段によってウエーハをチップに分割した後、チップに分割されたウエーハを支持しているフレームは該下段ガイドレール部に支持され、該第二の仮受け手段に位置づけられチップに分割される前の次のウエーハを支持しているフレームは該第二の搬出入手段によって該第二の仮受け手段から該第三の仮受け手段の該上段ガイドレール部に搬入され、該下段ガイドレール部に支持されチップに分割されたウエーハを支持しているフレームは該第二の搬出入手段によって該第二の仮受け手段に搬出されるのが好ましい。
該第二の仮受け手段を二等分するY軸を対称軸として、該第二の搬出入手段と同じ構成を有する鏡構造の第二の搬出入手段と、該第三の仮受け手段と同じ構成を有する鏡構造の第三の仮受け手段と、該フレーム昇降手段と同じ構成を有する鏡構造のフレーム昇降手段と、該分割手段と同じ構成を有する鏡構造の分割手段と、該吸引テーブルと同じ構成を有する鏡構造の吸引テーブルと、該テープ収縮手段と同じ構成を有する鏡構造のテープ収縮手段と、が配設されるのが好適である。
4:カセットテーブル
8:カセット
10:ウエーハ
10a:ウエーハの表面
10b:ウエーハの裏面
12:分割予定ライン
16:フレーム
16a:フレームの開口部
18:粘着テープ
26:第一の搬出入手段
36:第一の仮受け手段
38:第一のガイドレール(第一の仮受け手段)
40:ガイドレール開閉部(第一の仮受け手段)
42:第一の反転手段
44:第一の搬送手段
52:回転軸(第一の反転手段)
54:保持部(第一の反転手段)
60:第二のガイドレール(第二の仮受け手段)
62:第二の仮受け手段
64:第二の搬出入手段
72:第三の仮受け手段
74:第三のガイドレール(第三の仮受け手段)
76:ガイドレール作動部(第三の仮受け手段)
80:上部片(第三のガイドレールの上段ガイドレール部)
82:下部片(第三のガイドレールの下段ガイドレール部)
84:フレーム昇降手段
94:円筒部
96:分割手段
98:吸引テーブル
100:テープ収縮手段
112:第二の搬送手段
126:洗浄手段
128:第三の搬出入手段
144:透明テーブル
146:第二の反転手段
148:昇降手段
150:テーブル移動手段
154:透明板(透明テーブル)
170:保持部(第二の反転手段)
174:吸引パッド(第二の反転手段の一方の保持部)
176:吸引パッド(第二の反転手段の他方の保持部)
178:チャンバー
188:紫外線照射手段
Claims (8)
- 粘着テープに貼着されフレームの開口部に支持されたウエーハを分割予定ラインに沿って個々のチップに分割するウエーハ分割装置であって、
粘着テープに貼着されフレームの開口部に支持されたウエーハを複数収容するカセットを載置しZ軸方向に昇降可能なカセットテーブルと、
該カセットテーブルに載置されたカセットからフレームを把持してZ軸方向に直交するX軸方向に搬出および搬入する第一の搬出入手段と、
該第一の搬出入手段によって搬入されたフレームを支持するX軸方向に延在する一対の第一のガイドレールと該一対の第一のガイドレールの間隔をZ軸方向とX軸方向とに直交するY軸方向に広げフレームのZ軸方向の通過を許容するガイドレール開閉部とを備えた第一の仮受け手段と、
該第一の仮受け手段に支持されたフレームを保持する保持部を備えると共にX軸方向の回転軸で180度回転してフレームの表裏を反転させる反転手段と、
反転されたフレームをY軸方向に移動する搬送手段と、
Y軸方向に移動したフレームを支持するX軸方向に延在する一対の第二のガイドレールを有する第二の仮受け手段と、
該第二の仮受け手段に支持されたフレームをX軸方向に移動する第二の搬出入手段と、
該第二の仮受け手段のX軸方向片側に配設され該第二の搬出入手段によって移動したフレームを支持するX軸方向に延在する一対の第三のガイドレールと該一対の第三のガイドレールの間隔をY軸方向に広げフレームのZ軸方向の通過を許容するガイドレール作動部とを備えた第三の仮受け手段と、
該第三の仮受け手段のZ軸方向下部に配設され該第三の仮受け手段に支持されたフレームを支持しZ軸方向に昇降させるフレーム昇降手段と、
該第三の仮受け手段のZ軸方向上部に配設され該フレーム昇降手段に支持されたフレームが上昇した際にフレームとウエーハとの間にある粘着テープを拡張しウエーハを分割予定ラインに沿って個々のチップに分割する円筒部を備えた分割手段と、
該円筒部の内部に配設されチップに分割されたウエーハを吸引保持してチップとチップの間隔を維持する吸引テーブルと、
該フレーム昇降手段側に配設され弛んだ粘着テープを加熱して収縮させるテープ収縮手段と、から少なくとも構成され、
該搬送手段は、該第二の搬出入手段によって該第三の仮受け手段から該第二の仮受け手段に搬出され粘着テープが収縮したフレームを該第一の仮受け手段まで搬送するウエーハ分割装置。 - 該第一の仮受け手段を挟むように該カセットテーブルと反対側に配設されウエーハを洗浄する洗浄手段と、
該第一の仮受け手段に搬送されたウエーハを支持しているフレームを該洗浄手段に搬入および搬出する第三の搬出入手段と、
を備える請求項1記載のウエーハ分割装置。 - 該第一の仮受け手段の直下に配設され、少なくともウエーハの大きさに対応する大きさの透明板を備えた透明テーブルを備え、
該反転手段は、該透明テーブルの上部に配設され該第三の搬出入手段によって該第一の仮受け手段に搬出された洗浄済みのウエーハを支持しているフレームを保持する保持部を備え180度回転してフレームの表裏を反転させ該透明テーブルにフレームを載置し、
更に、
該反転手段を該透明テーブルから該第一の仮受け手段まで昇降させる昇降手段と、
該反転手段によって表裏が反転しウエーハが上を向いたフレームを載置した該透明テーブルを該第一の仮受け手段の直下から該第二の仮受け手段の方向に移動するテーブル移動手段と、
該第二の仮受け手段の下方に配設され、該テーブル移動手段によって移動した該透明テーブルに載置されたフレームに支持されたウエーハを覆い不活性ガスを供給するチャンバーと、
該チャンバーの下方に配設されフレームに貼着された粘着テープに紫外線を照射する紫外線照射手段と、
を備える請求項2記載のウエーハ分割装置。 - 該反転手段は、該第一の仮受け手段に支持されたフレームを保持する保持部を備えると共にX軸方向の回転軸で180度回転してフレームの表裏を反転させる第一の反転手段と、該透明テーブルの上部に配設され該第三の搬出入手段によって該第一の仮受け手段に搬出された洗浄済みのウエーハを支持しているフレームを保持する保持部を備え180度回転してフレームの表裏を反転させ該透明テーブルにフレームを載置する第二の反転手段とを有する請求項3記載のウエーハ分割装置。
- 該搬送手段は、該第一の反転手段によって反転されたフレームをY軸方向に移動する第一の搬送手段と、該第二の搬出入手段によって該第三の仮受け手段から該第二の仮受け手段に搬出され粘着テープが収縮したフレームを該第一の仮受け手段まで搬送する第二の搬送手段とを有する請求項4記載のウエーハ分割装置。
- 該第二の反転手段の保持部は、一方の保持部と反対側の他方の保持部とを有し、
該紫外線照射手段によって粘着テープに紫外線が照射されウエーハが上を向いたフレームを載置した該透明テーブルが該テーブル移動手段によって該第一の仮受け手段の直下に位置づけられた際、
該第二の反転手段は、該透明テーブルに載置されたフレームを該一方の保持部で保持すると共に、該第一の仮受け手段に支持された洗浄済みのウエーハを支持している次のフレームを該他方の保持部で保持し、180度回転して該一方の保持部で保持したフレームを該第一の反転手段に保持させ、該他方の保持部で保持した次のフレームを該透明テーブルに載置し、
該第一の反転手段は、X軸方向の回転軸で180度回転して保持したフレームを該第一の仮受け手段に支持させ、
該第一の搬出入手段は、該第一の仮受け手段に支持されたフレームを該カセットに搬出する請求項4記載のウエーハ分割装置。 - 該第三の仮受け手段の該一対の第三のガイドレールはZ軸方向上部の上段ガイドレール部とZ軸方向下部の下段ガイドレール部とを備え、
該第二の仮受け手段に位置づけられチップに分割される前のウエーハを支持しているフレームは、該第二の搬出入手段によって該第二の仮受け手段から該第三の仮受け手段の該上段ガイドレール部に搬入され、
該上段ガイドレール部に支持されたフレームを該フレーム昇降手段によって上昇させ該分割手段によってウエーハをチップに分割した後、チップに分割されたウエーハを支持しているフレームは該下段ガイドレール部に支持され、
該第二の仮受け手段に位置づけられチップに分割される前の次のウエーハを支持しているフレームは該第二の搬出入手段によって該第二の仮受け手段から該第三の仮受け手段の該上段ガイドレール部に搬入され、
該下段ガイドレール部に支持されチップに分割されたウエーハを支持しているフレームは該第二の搬出入手段によって該第二の仮受け手段に搬出される請求項1記載のウエーハ分割装置。 - 該第二の仮受け手段を二等分するY軸を対称軸として、
該第二の搬出入手段と同じ構成を有する鏡構造の第二の搬出入手段と、
該第三の仮受け手段と同じ構成を有する鏡構造の第三の仮受け手段と、
該フレーム昇降手段と同じ構成を有する鏡構造のフレーム昇降手段と、
該分割手段と同じ構成を有する鏡構造の分割手段と、
該吸引テーブルと同じ構成を有する鏡構造の吸引テーブルと、
該テープ収縮手段と同じ構成を有する鏡構造のテープ収縮手段と、
が配設される請求項1記載のウエーハ分割装置。
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