JP2019515509A5 - - Google Patents

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JP2019515509A5
JP2019515509A5 JP2018559867A JP2018559867A JP2019515509A5 JP 2019515509 A5 JP2019515509 A5 JP 2019515509A5 JP 2018559867 A JP2018559867 A JP 2018559867A JP 2018559867 A JP2018559867 A JP 2018559867A JP 2019515509 A5 JP2019515509 A5 JP 2019515509A5
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semiconductor package
die
semiconductor
cavity
molding structure
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JP2018559867A
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JP2019515509A (ja
JP7239796B2 (ja
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JP2018559867A 2016-05-10 2017-05-10 浮遊ダイパッケージ Active JP7239796B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662334133P 2016-05-10 2016-05-10
US62/334,133 2016-05-10
US15/248,151 2016-08-26
US15/248,151 US10861796B2 (en) 2016-05-10 2016-08-26 Floating die package
PCT/US2017/031987 WO2017196997A1 (en) 2016-05-10 2017-05-10 Floating die package

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JP2019515509A JP2019515509A (ja) 2019-06-06
JP2019515509A5 true JP2019515509A5 (enExample) 2020-06-25
JP7239796B2 JP7239796B2 (ja) 2023-03-15

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US (2) US10861796B2 (enExample)
EP (1) EP3455876A4 (enExample)
JP (1) JP7239796B2 (enExample)
CN (1) CN109075129B (enExample)
WO (1) WO2017196997A1 (enExample)

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