JP2012013528A5 - - Google Patents

Download PDF

Info

Publication number
JP2012013528A5
JP2012013528A5 JP2010150109A JP2010150109A JP2012013528A5 JP 2012013528 A5 JP2012013528 A5 JP 2012013528A5 JP 2010150109 A JP2010150109 A JP 2010150109A JP 2010150109 A JP2010150109 A JP 2010150109A JP 2012013528 A5 JP2012013528 A5 JP 2012013528A5
Authority
JP
Japan
Prior art keywords
metal electrodes
sensor
resin
control
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010150109A
Other languages
English (en)
Japanese (ja)
Other versions
JP4968371B2 (ja
JP2012013528A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010150109A priority Critical patent/JP4968371B2/ja
Priority claimed from JP2010150109A external-priority patent/JP4968371B2/ja
Priority to PCT/JP2011/064313 priority patent/WO2012002233A1/ja
Publication of JP2012013528A publication Critical patent/JP2012013528A/ja
Publication of JP2012013528A5 publication Critical patent/JP2012013528A5/ja
Application granted granted Critical
Publication of JP4968371B2 publication Critical patent/JP4968371B2/ja
Priority to US13/729,311 priority patent/US9209319B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010150109A 2010-06-30 2010-06-30 センサデバイスの製造方法及びセンサデバイス Active JP4968371B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010150109A JP4968371B2 (ja) 2010-06-30 2010-06-30 センサデバイスの製造方法及びセンサデバイス
PCT/JP2011/064313 WO2012002233A1 (ja) 2010-06-30 2011-06-22 センサデバイスの製造方法及びセンサデバイス
US13/729,311 US9209319B2 (en) 2010-06-30 2012-12-28 Sensor device manufacturing method and sensor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010150109A JP4968371B2 (ja) 2010-06-30 2010-06-30 センサデバイスの製造方法及びセンサデバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012086208A Division JP2012181198A (ja) 2012-04-05 2012-04-05 センサデバイスの製造方法及びセンサデバイス

Publications (3)

Publication Number Publication Date
JP2012013528A JP2012013528A (ja) 2012-01-19
JP2012013528A5 true JP2012013528A5 (enExample) 2012-03-29
JP4968371B2 JP4968371B2 (ja) 2012-07-04

Family

ID=45401953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010150109A Active JP4968371B2 (ja) 2010-06-30 2010-06-30 センサデバイスの製造方法及びセンサデバイス

Country Status (3)

Country Link
US (1) US9209319B2 (enExample)
JP (1) JP4968371B2 (enExample)
WO (1) WO2012002233A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4968371B2 (ja) * 2010-06-30 2012-07-04 大日本印刷株式会社 センサデバイスの製造方法及びセンサデバイス
TWI620707B (zh) * 2014-03-11 2018-04-11 Richtek Technology Corporation 微機電模組以及其製造方法
CN105514074B (zh) * 2015-12-01 2018-07-03 上海伊诺尔信息技术有限公司 智能卡芯片封装结构及其制造方法
JP6947367B2 (ja) * 2016-12-20 2021-10-13 ローム株式会社 センサモジュールおよびその製造方法
CN110304604B (zh) * 2019-06-18 2023-04-28 上海应用技术大学 一种mems传感器的封装方法
JP2022121271A (ja) * 2021-02-08 2022-08-19 パナソニックＩｐマネジメント株式会社 電気素子

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device
JPS60160627A (ja) 1984-01-31 1985-08-22 Fujitsu Ltd 半導体集積回路装置
JPS62144368A (ja) * 1985-12-19 1987-06-27 Nec Corp 半導体式圧力センサの保護膜
JPH0748566B2 (ja) 1989-09-27 1995-05-24 山武ハネウエル株式会社 加速度センサおよびその製造方法
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
JPH06132545A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp 圧力検出装置
US5434105A (en) * 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation
JP3433570B2 (ja) 1995-05-26 2003-08-04 松下電工株式会社 半導体加速度センサ
JPH0961271A (ja) * 1995-08-29 1997-03-07 Mitsubishi Electric Corp 半導体式センサ及びその製造方法
US6401545B1 (en) * 2000-01-25 2002-06-11 Motorola, Inc. Micro electro-mechanical system sensor with selective encapsulation and method therefor
JP4407029B2 (ja) * 2000-09-18 2010-02-03 株式会社デンソー センサ装置の製造方法
JP2002098709A (ja) 2000-09-26 2002-04-05 Matsushita Electric Works Ltd 半導体加速度センサ
US6769319B2 (en) * 2001-07-09 2004-08-03 Freescale Semiconductor, Inc. Component having a filter
JP4516252B2 (ja) 2001-11-22 2010-08-04 パナソニック電工株式会社 半導体加速度センサの封止方法
ITTO20030444A1 (it) * 2003-06-13 2004-12-14 Olivetti Jet Spa Sensore di pressione a struttura integrata.
JP4277079B2 (ja) * 2004-06-18 2009-06-10 Ｏｋｉセミコンダクタ株式会社 半導体加速度センサ装置及びその製造方法
JP4524454B2 (ja) * 2004-11-19 2010-08-18 ルネサスエレクトロニクス株式会社 電子装置およびその製造方法
JP4428210B2 (ja) * 2004-11-22 2010-03-10 パナソニック電工株式会社 物理量センサの実装構造
KR100766498B1 (ko) * 2006-10-16 2007-10-15 삼성전자주식회사 반도체 패키지 및 그 제조방법
US7985628B2 (en) * 2007-12-12 2011-07-26 Stats Chippac Ltd. Integrated circuit package system with interconnect lock
JP4968371B2 (ja) * 2010-06-30 2012-07-04 大日本印刷株式会社 センサデバイスの製造方法及びセンサデバイス

Similar Documents

Publication Publication Date Title
JP2012013528A5 (enExample)
WO2008153043A1 (ja) 半導体発光装置
JP2010245417A5 (ja) 半導体装置
MY199192A (en) Integrated circuit package having wire-bonded multi-die stack
JP2009302564A5 (enExample)
JP2010267789A5 (enExample)
ATE543103T1 (de) Vertikaler hallsensor
TWI411143B (en) Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
WO2011162488A3 (ko) 적층형 반도체 패키지
TW201614747A (en) Wire bond sensor package and method
JP2013531397A5 (enExample)
EP2770409A3 (en) Touch panel and manufacturing method thereof
WO2015184152A3 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
JP2016018931A5 (enExample)
JP2014103148A5 (enExample)
EP2752873A3 (en) Semiconductor module
SG151187A1 (en) Integrated circuit package system with leads separated from a die paddle
JP2012058243A5 (enExample)
JP2014030321A5 (enExample)
JP2010287737A5 (enExample)
MY176915A (en) Method of forming an electronic package and structure
JP2009064897A5 (enExample)
CN109891584A (zh) 芯片封装结构及方法、电子设备
TW200642017A (en) Semiconductor element and manufacturing method thereof
WO2011141886A3 (en) Pressure sensor