ITTO20030444A1 - Sensore di pressione a struttura integrata. - Google Patents

Sensore di pressione a struttura integrata.

Info

Publication number
ITTO20030444A1
ITTO20030444A1 IT000444A ITTO20030444A ITTO20030444A1 IT TO20030444 A1 ITTO20030444 A1 IT TO20030444A1 IT 000444 A IT000444 A IT 000444A IT TO20030444 A ITTO20030444 A IT TO20030444A IT TO20030444 A1 ITTO20030444 A1 IT TO20030444A1
Authority
IT
Italy
Prior art keywords
pressure sensor
integrated structure
structure pressure
support
integrated
Prior art date
Application number
IT000444A
Other languages
English (en)
Inventor
Paolo Bellini
Renato Conta
Original Assignee
Olivetti Jet Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olivetti Jet Spa filed Critical Olivetti Jet Spa
Priority to IT000444A priority Critical patent/ITTO20030444A1/it
Priority to PCT/IT2004/000337 priority patent/WO2004111595A1/en
Priority to US10/559,936 priority patent/US7401521B2/en
Priority to AT04736456T priority patent/ATE411514T1/de
Priority to EP04736456A priority patent/EP1634046B1/en
Priority to DE602004017172T priority patent/DE602004017172D1/de
Publication of ITTO20030444A1 publication Critical patent/ITTO20030444A1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
IT000444A 2003-06-13 2003-06-13 Sensore di pressione a struttura integrata. ITTO20030444A1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT000444A ITTO20030444A1 (it) 2003-06-13 2003-06-13 Sensore di pressione a struttura integrata.
PCT/IT2004/000337 WO2004111595A1 (en) 2003-06-13 2004-06-09 Pressure sensor with integrated structure
US10/559,936 US7401521B2 (en) 2003-06-13 2004-06-09 Pressure sensor with integrated structure
AT04736456T ATE411514T1 (de) 2003-06-13 2004-06-09 Drucksensor mit integrierter struktur
EP04736456A EP1634046B1 (en) 2003-06-13 2004-06-09 Pressure sensor with integrated structure
DE602004017172T DE602004017172D1 (de) 2003-06-13 2004-06-09 Drucksensor mit integrierter struktur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000444A ITTO20030444A1 (it) 2003-06-13 2003-06-13 Sensore di pressione a struttura integrata.

Publications (1)

Publication Number Publication Date
ITTO20030444A1 true ITTO20030444A1 (it) 2004-12-14

Family

ID=33548884

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000444A ITTO20030444A1 (it) 2003-06-13 2003-06-13 Sensore di pressione a struttura integrata.

Country Status (6)

Country Link
US (1) US7401521B2 (it)
EP (1) EP1634046B1 (it)
AT (1) ATE411514T1 (it)
DE (1) DE602004017172D1 (it)
IT (1) ITTO20030444A1 (it)
WO (1) WO2004111595A1 (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1893080A2 (en) 2005-06-21 2008-03-05 CardioMems, Inc. Method of manufacturing implantable wireless sensor for in vivo pressure measurement
JP2008261796A (ja) * 2007-04-13 2008-10-30 Denso Corp 温度センサ一体型圧力センサ装置
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
CN102023066B (zh) * 2010-05-31 2012-07-18 昆山双桥传感器测控技术有限公司 汽车通用压力传感器
JP4968371B2 (ja) * 2010-06-30 2012-07-04 大日本印刷株式会社 センサデバイスの製造方法及びセンサデバイス
US10226218B2 (en) 2011-06-30 2019-03-12 Endotronix, Inc. Pressure sensing implant
US11896365B2 (en) 2011-06-30 2024-02-13 Endotronix, Inc. MEMS device for an implant assembly
US10638955B2 (en) 2011-06-30 2020-05-05 Endotronix, Inc. Pressure sensing implant
ES2660779T3 (es) 2011-06-30 2018-03-26 Endotronix, Inc. Carcasa de sensor implantable con paredes laterales delgadas
CN105324652B (zh) * 2013-03-15 2019-05-28 内电子有限公司 压力感应植入物
EP3654835A1 (en) 2017-07-19 2020-05-27 Endotronix, Inc. Physiological monitoring system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763098A (en) * 1985-04-08 1988-08-09 Honeywell Inc. Flip-chip pressure transducer
US4823605A (en) * 1987-03-18 1989-04-25 Siemens Aktiengesellschaft Semiconductor pressure sensor with casing and method for its manufacture
US4942383A (en) 1989-03-06 1990-07-17 Honeywell Inc. Low cost wet-to-wet pressure sensor package
US5454270A (en) * 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
US6148673A (en) * 1994-10-07 2000-11-21 Motorola, Inc. Differential pressure sensor and method thereof
US6116269A (en) * 1998-07-07 2000-09-12 Fasco Controls Corporation Solenoid pressure transducer
US6351996B1 (en) * 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors

Also Published As

Publication number Publication date
DE602004017172D1 (de) 2008-11-27
US20060137461A1 (en) 2006-06-29
EP1634046B1 (en) 2008-10-15
EP1634046A1 (en) 2006-03-15
US7401521B2 (en) 2008-07-22
ATE411514T1 (de) 2008-10-15
WO2004111595A1 (en) 2004-12-23

Similar Documents

Publication Publication Date Title
ITTO20030444A1 (it) Sensore di pressione a struttura integrata.
TW200739706A (en) Method of polishing a semiconductor-on-insulator structure
JP2006005358A5 (it)
JP2007121167A5 (it)
AR044678A1 (es) Toalla higienica delgada que tiene prominencias
ATE456788T1 (de) Optischer sensor
TW200706373A (en) Display surface material and a display incorporating the same
WO2009028283A1 (ja) 半導体歪みセンサー
EP1854760A3 (en) Semiconductor device and method of manufacturing the same
GB2369889B (en) Strain sensing installation
WO2006000828A3 (en) Electrode for electrochemical sensor
IL203461A (en) Polishing pad
TW200506808A (en) Touch sensor using light control
TW200701303A (en) A substrate and a method for polishing a substrate
ATE326688T1 (de) Dehnungsmesser
MY137372A (en) Die design with integrated assembly aid
GB2439018A (en) Garment support member with foam support layer and method of using same
ATE466289T1 (de) Masseisolierter piezoelektrischer sensor zur messung von beschleunigung oder druck
TW200705582A (en) Semiconductor device and manufacturing method therefor
ATE425683T1 (de) Klettverschlusse
TW200510727A (en) Acceleration sensor
TW200609129A (en) Glass substrate and electrostatic capacity type pressure sensor using the same
ATE371867T1 (de) Überwachung von zellen
TW200724510A (en) Glass substrate of flat display
JP2003297530A5 (it)