DE602004017172D1 - Drucksensor mit integrierter struktur - Google Patents

Drucksensor mit integrierter struktur

Info

Publication number
DE602004017172D1
DE602004017172D1 DE602004017172T DE602004017172T DE602004017172D1 DE 602004017172 D1 DE602004017172 D1 DE 602004017172D1 DE 602004017172 T DE602004017172 T DE 602004017172T DE 602004017172 T DE602004017172 T DE 602004017172T DE 602004017172 D1 DE602004017172 D1 DE 602004017172D1
Authority
DE
Germany
Prior art keywords
pressure sensor
integrated structure
support
integrated
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004017172T
Other languages
English (en)
Inventor
Paolo Bellini
Renato Conta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telecom Italia SpA
Original Assignee
Telecom Italia SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telecom Italia SpA filed Critical Telecom Italia SpA
Publication of DE602004017172D1 publication Critical patent/DE602004017172D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE602004017172T 2003-06-13 2004-06-09 Drucksensor mit integrierter struktur Expired - Lifetime DE602004017172D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000444A ITTO20030444A1 (it) 2003-06-13 2003-06-13 Sensore di pressione a struttura integrata.
PCT/IT2004/000337 WO2004111595A1 (en) 2003-06-13 2004-06-09 Pressure sensor with integrated structure

Publications (1)

Publication Number Publication Date
DE602004017172D1 true DE602004017172D1 (de) 2008-11-27

Family

ID=33548884

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004017172T Expired - Lifetime DE602004017172D1 (de) 2003-06-13 2004-06-09 Drucksensor mit integrierter struktur

Country Status (6)

Country Link
US (1) US7401521B2 (de)
EP (1) EP1634046B1 (de)
AT (1) ATE411514T1 (de)
DE (1) DE602004017172D1 (de)
IT (1) ITTO20030444A1 (de)
WO (1) WO2004111595A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1893080A2 (de) 2005-06-21 2008-03-05 CardioMems, Inc. Verfahren zur herstellung eines implantierbaren drahtlosen sensors für in-vivo-druckmessung
JP2008261796A (ja) * 2007-04-13 2008-10-30 Denso Corp 温度センサ一体型圧力センサ装置
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
CN102023066B (zh) * 2010-05-31 2012-07-18 昆山双桥传感器测控技术有限公司 汽车通用压力传感器
JP4968371B2 (ja) * 2010-06-30 2012-07-04 大日本印刷株式会社 センサデバイスの製造方法及びセンサデバイス
US10226218B2 (en) 2011-06-30 2019-03-12 Endotronix, Inc. Pressure sensing implant
US12029546B2 (en) 2011-06-30 2024-07-09 Endotronix, Inc. Implantable sensor enclosure with thin sidewalls
US10638955B2 (en) 2011-06-30 2020-05-05 Endotronix, Inc. Pressure sensing implant
EP3345536A1 (de) 2011-06-30 2018-07-11 Endotronix, Inc. Implantierbares sensorgehäuse mit dünnen seitenwänden
US11896365B2 (en) 2011-06-30 2024-02-13 Endotronix, Inc. MEMS device for an implant assembly
EP2967432B1 (de) * 2013-03-15 2023-09-06 Endotronix, Inc. Druckmessungsimplantat
CA3236972A1 (en) 2017-07-19 2019-01-24 Endotronix, Inc. Physiological monitoring system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763098A (en) 1985-04-08 1988-08-09 Honeywell Inc. Flip-chip pressure transducer
US4823605A (en) * 1987-03-18 1989-04-25 Siemens Aktiengesellschaft Semiconductor pressure sensor with casing and method for its manufacture
US4942383A (en) 1989-03-06 1990-07-17 Honeywell Inc. Low cost wet-to-wet pressure sensor package
US5454270A (en) * 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
US6148673A (en) * 1994-10-07 2000-11-21 Motorola, Inc. Differential pressure sensor and method thereof
US6116269A (en) * 1998-07-07 2000-09-12 Fasco Controls Corporation Solenoid pressure transducer
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors

Also Published As

Publication number Publication date
WO2004111595A1 (en) 2004-12-23
US20060137461A1 (en) 2006-06-29
ATE411514T1 (de) 2008-10-15
EP1634046A1 (de) 2006-03-15
US7401521B2 (en) 2008-07-22
EP1634046B1 (de) 2008-10-15
ITTO20030444A1 (it) 2004-12-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition