CN108447843B - 窗口型球栅阵列封装组件 - Google Patents
窗口型球栅阵列封装组件 Download PDFInfo
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Abstract
本发明提供了一种窗口型球栅阵列封装组件,包括:基板,具有相对的第一表面及第二表面,形成有贯穿第一表面及第二表面的窗口,第一表面上设置有复数个邻靠窗口的接点及矩阵排列的焊盘,第二表面包含芯片安装区,窗口两端各形成有进胶口及上模流缓速汇集口,上模流缓速汇集口相较于进胶口为尺寸扩大的缓流开口,上模流缓速汇集口的端部宽度大于窗口的通道宽度;芯片,部分覆盖窗口,并使窗口的进胶口和上模流缓速汇集口裸露在芯片之外;焊线,穿过窗口并电性连接芯片和基板;以及塑封体,包裹芯片和焊线,并填满上模流缓速汇集口。本发明可避免在基板上出现的溢胶问题以及在塑封体内出现的空洞问题。
Description
技术领域
本发明涉及半导体储存器组件,尤其涉及一种窗口型球栅阵列(Window BallGrid Array,WBGA)封装组件。
背景技术
在众多半导体装置的封装类型中,窗口型球栅阵列封装结构是将用以承载芯片的基板开设贯通的窗口,以便于焊线穿过窗口,电性连接基板与芯片。
如图1所示,一种公知的窗口型球栅阵列封装件包括具有窗口111的基板110、芯片120、焊线130、胶粘层140、塑封体150以及焊球,焊球植设于基板110的接合表面上的焊盘112。芯片120通过胶粘层140固定在基板110的安裝面,焊线130穿过窗口111电连接芯片120与基板110,塑封体150包裹芯片120以及焊线130。在注塑过程中,将基板110置于由上模具11和下模具12组成的注塑模具10中,然后注入塑封料(EMC,Epoxy Molding Compound,环氧树脂注塑化合物),形成包裹芯片120以及焊线130的塑封体150。
如图2所示,在注塑时,塑封料从浇注口13处进入模具10的内腔,沿下模流方向14B流动,部分的塑封料会经由基板窗口111一端的进胶口111A流入窗口111内,沿上模流方向14A流动,由于上模具11的内腔比下模具12的内腔小,塑封料在上模具11的流动速度快于下模具12,使上下模模流不平衡而导致在下模具12腔体内填充的塑封料中出现空洞151。同时,由于上下模流速度不同,当上模流大于下模流,会造成基板110上方模流压力大,基板110的未夹合区113就会变形下沉,当塑封料流动到出胶口111B时因流速过快会增加上模流撑开基板110的压力,导致塑封料从上模腔与基板110之间的缝隙处溢出到基板110上产生溢胶152,溢胶152甚至会覆盖焊盘112,使封装件的外接失效。如图3所示,如果芯片120向着与进胶口111A′相反的方向产生了位移,会导致出胶口111B′区域相较于进胶口111A′区域变得更窄,空洞和溢胶问题将会变得更加严重。
本发明人在实施本发明时发现,即使是设置出胶口111B区域相较于进胶口111A区域的截面尺寸更大,但由于出胶口111B的宽度仍是相同于基板窗口的宽度,也还是难以达到对上模流进行缓速的作用。
另一方面,基于本封装件是阵列型的封装组件,则上模流形成的塑封体是一条一条地呈条状分布于基板110中用于设置焊球的上表面,下模流形成的塑封体是一整片地覆盖在基板110中黏贴有芯片120的下表面。在注塑的过程中,基于上述的进胶口111A和出胶口111B的设置,上模流的注塑速度会过快,下模流的注塑速度相对较慢,但由于上模流形成的塑封体是呈条状的,则上模具11的腔室也是呈现条状分布的,随着上模流不断地填充塑封料于上模具11但下模流填充塑封料于下模具12的填充速度无法跟进,特别是上模流通过被挤压的上模流缓速汇集口使得模流速度加快回流到下模具12进而干扰下模流的流动,导致后续的塑封料无法从浇注口13处注入。
发明内容
有鉴于此,本发明提供了一种窗口型球栅阵列封装组件,包括:
基板,具有相对的第一表面及第二表面,且形成有贯穿所述第一表面及第二表面的窗口,所述第一表面上设置有复数个邻靠所述窗口的接点及复数个矩阵排列的焊盘,所述第二表面包含芯片安装区,所述窗口两端各形成有超过所述芯片安装区且供注塑时进胶以分成上模流和下模流的进胶口及缓冲所述上模流的注塑速度的上模流缓速汇集口,所述上模流缓速汇集口相较于所述进胶口为尺寸扩大的缓流开口,所述上模流缓速汇集口的宽度大于所述窗口的通道宽度;
芯片,通过胶粘层固定于所述基板的第二表面并对准于所述芯片安装区,所述芯片部分覆盖所述窗口,并使所述窗口的进胶口和上模流缓速汇集口裸露在所述芯片之外,并且所述芯片具有复数个焊垫,位于所述窗口中;
焊线,穿过所述窗口并电性连接所述芯片的所述焊垫和所述基板的所述接点;以及
塑封体,包括局部形成于所述基板第一表面上且填充所述窗口的第一塑封部和形成于所述基板第二表面上的第二塑封部,所述第一塑封部小于所述第二塑封部,所述第二塑封部由所述下模流形成,以包裹所述芯片,所述第一塑封部包裹所述焊线以及由所述焊线连接的所述芯片的所述焊垫和所述基板的所述接点,并且所述第一塑封部填满所述上模流缓速汇集口以相接至所述第二塑封部,所述焊盘裸露于所述塑封体之外,并且所述上模流缓速汇集口的宽度大于由所述上模流形成的所述第一塑封部在所述基板上的高度,但不大于所述第一塑封部在所述基板上的覆盖宽度。
进一步地,所述窗口呈锤子形,其中,所述上模流缓速汇集口为锤头形。
进一步地,所述上模流缓速汇集口为矩形。
进一步地,所述进胶口为半圆形或半椭圆形。
或者,所述进胶口的边缘包括弧形,所述弧形小于半圆形或半椭圆形。
进一步地,所述窗口型球栅阵列封装组件还包括复数个植设于所述焊盘的焊球。
进一步地,所述上模流缓速汇集口的开孔面积大于等于所述窗口的通道横切截面积。
进一步地,距离所述上模流缓速汇集口最近的基板侧边与距离所述基板侧边最近的焊盘之间的距离不大于所述基板侧边与所述上模流缓速汇集口之间的距离
本发明采用上述技术方案,具有如下优点:
本发明的窗口型球栅阵列封装组件可避免注塑过程中因上模具内的模流速度过快而在基板上出现的溢胶问题以及在塑封体内出现的空洞问题,以及可避免上模具内的模流溢出到基板中设有焊盘的表面。
上述概述仅仅是为了说明书的目的,并不意图以任何方式进行限制。除上述描述的示意性的方面、实施方式和特征之外,通过参考附图和以下的详细描述,本发明进一步的方面、实施方式和特征将会是容易明白的。
附图说明
在附图中,除非另外规定,否则贯穿多个附图相同的附图标记表示相同或相似的部件或元素。这些附图不一定是按照比例绘制的。应该理解,这些附图仅描绘了根据本发明公开的一些实施方式,而不应将其视为是对本发明范围的限制。
图1为现有技术中窗口型球栅阵列封装件在注塑过程后在横切窗口方向的结构剖面示意图。
图2为现有技术中窗口型球栅阵列封装件在注塑过程中沿窗口延伸方向的剖面示意图。
图3为现有技术中窗口型球栅阵列封装件在注塑过程中沿窗口延伸方向的剖面示意图(芯片发生位移时)。
图4为本发明的窗口型球栅阵列封装件结构的剖面示意图。
图5为本发明的注塑未完成前窗口型球栅阵列封装件的基板第一表面俯视图。
图6为本发明的窗口型球栅阵列封装件的基板第二表面俯视图。
图7为本发明的窗口型球栅阵列封装件结构在注塑过程中的剖面示意图。
图8为本发明的注塑已完成后窗口型球栅阵列封装件的基板第一表面俯视图。
10:模具 11:上模具 12:下模具 13:注浇口
14A:上模流 14B:下模流
110:基板 111:窗口 111A:进胶口 111B:出胶口
111A′:进胶口 111B′:出胶口 112:焊盘 113:夹合区域
120:芯片 130:焊线 140:胶粘层
150:塑封体 151:空穴 152:溢胶
210:基板 211:窗口 211A:进胶口 211B:上模流缓速汇集口
211C:上模流缓速汇集口的宽度 211D:通道宽度
212:第一表面 213:第二表面
214:芯片安装区 215:接点 216:焊盘
220:芯片 221:焊垫 230:焊线 240:胶粘层
250:塑封体 251:第一塑封部
251A:第一塑封部的高度 251B:第一塑封部的宽度
252:第二塑封部
260:焊球
210A:上模流缓速汇集口距离基板侧边最近的距离
210B:距离上模流缓速汇集口最近的基板侧边与距离该基板侧边最近的焊盘之间的距离
20:模具 21:上模具 22:下模具 23:注浇口
24A:上模流 24B:下模流
具体实施方式
在下文中,仅简单地描述了某些示例性实施例。正如本领域技术人员可认识到的那样,在不脱离本发明的精神或范围的情况下,可通过各种不同方式修改所描述的实施例。因此,附图和描述被认为本质上是示例性的而非限制性的。
如图4、图5和图6所示,本实施例的窗口型球栅阵列封装组件包括基板210、芯片220、焊线230、胶粘层240、塑封体250和焊球260。
基板210具有相对的第一表面212及第二表面213,且形成有贯穿所述第一表面212及第二表面213的窗口211。基板210的第一表面212上设置有复数个邻靠窗口211的接点215及复数个矩阵排列的焊盘216。基板210的第二表面213包含芯片安装区214。
窗口211两端各形成有超过芯片安装区214且供注塑时进胶以将胶流分成上模流流入上模具和下模流流入下模具的进胶口211A,以及缓冲上模流的注塑速度的上模流缓速汇集口211B。其中,上模流缓速汇集口211B相较于进胶口211A为尺寸扩大的开口,以利于缓冲上模流的注塑速度,上模流缓速汇集口211B的宽度211C大于窗口211的通道宽度211D,可以起到对上模流的注塑速度缓速的作用。本实施例中,窗口211的形状为锤子形,上模流缓速汇集口211B相当于锤子的锤头。上模流缓速汇集口211B优选为矩形,可使面积最大化。进胶口211A优选为半圆形或半椭圆形,也可以为如下形状:其边缘为包括小于半圆或小于半椭圆的弧形。
芯片220通过胶粘层240固定于基板210的第二表面213,并对准于芯片安装区214。芯片220部分覆盖窗口211,以使进胶口211A和上模流缓速汇集口211B裸露于芯片220之外。芯片220上具有复数个位于窗口211中的焊垫221。
焊线230穿过窗口211,一端连接芯片210的焊垫221,另一端连接基板210的接点215,实现芯片220和基板210的电性连接。
塑封体250包裹芯片220和焊线230,形成保护,基板第一表面212上的焊盘216应裸露于塑封体250之外。塑封体250填满上模流缓速汇集口211B,它包括局部形成于基板第一表面212上且填充窗口211的第一塑封部251和形成于基板第二表面213上的第二塑封部252。第二塑封部252由下模流形成,用于包裹芯片220的非胶粘表面。第一塑封部251由上模流形成,用于包裹焊线230以及焊线230两端连接的焊垫221和接点215,且第一塑封部251填满上模流缓速汇集口211B以相接至第二塑封部252。以及,第一塑封部251的体积小于第二塑封部252。上模流缓速汇集口211B的开孔面积大于等于窗口211的通道横切截面积,横切方向垂直于上模流方向以及基板210的表面。
复数个焊球260对应植设于基板第一表面212上的焊盘216,用以提供外部连接。
如图7所示,在注塑过程中,将基板210置于由上模具21和下模具22组成的模具20中,在下模具22上开设有注浇口23,从注浇口23向模具20的型腔内注入塑封料。塑封料沿下模流方向24B流动,部分的塑封料会经由基板窗口211一端的进胶口211A流入窗口211内,并沿上模流方向24A流动。由于上模流缓速汇集口211B大于进胶口211A,塑封料在上模具21的型腔以及上模流缓速汇集口211B处的流动速度都会减慢,从而避免从上模具21的型腔与基板210之间缝隙处溢胶的问题,降低焊盘216的连接失效率,同时塑封料在上模具型腔内和下模具型腔内的流动速度趋于平衡,可避免形成于下模具22型腔内的第二塑封部252内产生空洞。
进一步地,如图4和图8所示,上模流缓速汇集口211B的宽度211C大于第一塑封部251在基板210上的高度251A,但不大于第一塑封部251在基板210上的覆盖宽度251B。如此,上模流缓速汇集口211B形成一个又扁又宽的端口,即使上模流缓速汇集口211B不大于进胶口211A,也可以对上模流的速度进行缓冲,与下模流的速度均衡。而且,由于模流缓速汇集口211B的宽度211C不大于第一塑封部251在基板210上的覆盖宽度251B,可以进一步避免上模流缓速汇集口211B在对上模流进行缓速时上模流溢出到基板210中设有焊盘216的表面,即基板的每一表面212,降低焊盘216的连接失效率。
如图8所示,上模流缓速汇集口211B距离基板侧边最近的距离210A不小于距离上模流缓速汇集口211B最近的基板侧边与其最近的焊盘216之间的距离210B,以维持基板210在接近上模流缓速汇集口211B一侧的结构强度。
因此,本发明的窗口型球栅阵列封装组件可避免注塑过程中因上模具内的模流速度过快而在基板上出现的溢胶问题以及在塑封体内出现的空洞问题,以及可避免上模具内的模流溢出到基板中用于设置焊盘的表面。
应该注意,本文所述的“前”、“后”、“上”、“下”等方位均是为了描述的方便而设,并不是一定与实际工作时的空间上的前后上下完全对应。
在本说明书的描述中,参见术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到其各种变化或替换,这些都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。
Claims (8)
1.一种窗口型球栅阵列封装组件,其特征在于,包括:
基板,具有相对的第一表面及第二表面,且形成有贯穿所述第一表面及第二表面的窗口, 所述第一表面上设置有复数个邻靠所述窗口的接点及复数个矩阵排列的焊盘,所述第二表面包含芯片安装区,所述窗口两端各形成有超过所述芯片安装区且供注塑时进胶以分成上模流和下模流的进胶口及缓冲所述上模流的注塑速度的上模流缓速汇集口,所述上模流缓速汇集口相较于所述进胶口为尺寸扩大的缓流开口,所述上模流缓速汇集口的宽度大于所述窗口的通道宽度;
芯片,通过胶粘层固定于所述基板的第二表面并对准于所述芯片安装区,所述芯片部分覆盖所述窗口,并使所述窗口的进胶口和上模流缓速汇集口裸露在所述芯片之外,并且所述芯片具有复数个焊垫,位于所述窗口中;
焊线,穿过所述窗口并电性连接所述芯片的所述焊垫和所述基板的所述接点;以及
塑封体,包括局部形成于所述基板第一表面上且填充所述窗口的第一塑封部和形成于所述基板第二表面上的第二塑封部,所述第一塑封部小于所述第二塑封部,所述第二塑封部由所述下模流形成,用于包裹所述芯片的非胶粘表面,所述第一塑封部包裹所述焊线以及由所述焊线连接的所述芯片的所述焊垫和所述基板的所述接点,并且所述第一塑封部填满所述上模流缓速汇集口以相接至所述第二塑封部,所述焊盘裸露于所述塑封体之外,并且所述上模流缓速汇集口的宽度大于由所述上模流形成的所述第一塑封部在所述基板上的高度,但不大于所述第一塑封部在所述基板上的覆盖宽度。
2.根据权利要求1所述的窗口型球栅阵列封装组件,其特征在于,所述窗口呈锤子形,其中,所述上模流缓速汇集口为锤头形。
3.根据权利要求2所述的窗口型球栅阵列封装组件,其特征在于,所述上模流缓速汇集口为矩形。
4.根据权利要求3所述的窗口型球栅阵列封装组件,其特征在于,所述进胶口为半圆形或半椭圆形。
5.根据权利要求3所述的窗口型球栅阵列封装组件,其特征在于,所述进胶口的边缘包括弧形,所述弧形小于半圆形或半椭圆形。
6.根据权利要求1所述的窗口型球栅阵列封装组件,其特征在于,所述窗口型球栅阵列封装组件还包括复数个植设于所述焊盘的焊球。
7.根据权利要求1所述的窗口型球栅阵列封装组件,其特征在于,所述上模流缓速汇集口的开孔面积大于等于所述窗口的通道横切截面积。
8.根据权利要求1至7任一项所述的窗口型球栅阵列封装组件,其特征在于,距离所述上模流缓速汇集口最近的基板侧边与距离所述基板侧边最近的焊盘之间的距离不大于所述基板侧边与所述上模流缓速汇集口之间的距离。
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