JP2019192667A5 - - Google Patents

Download PDF

Info

Publication number
JP2019192667A5
JP2019192667A5 JP2018079689A JP2018079689A JP2019192667A5 JP 2019192667 A5 JP2019192667 A5 JP 2019192667A5 JP 2018079689 A JP2018079689 A JP 2018079689A JP 2018079689 A JP2018079689 A JP 2018079689A JP 2019192667 A5 JP2019192667 A5 JP 2019192667A5
Authority
JP
Japan
Prior art keywords
pads
semiconductor chip
circuit forming
semiconductor device
forming surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018079689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019192667A (ja
JP7189672B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018079689A priority Critical patent/JP7189672B2/ja
Priority claimed from JP2018079689A external-priority patent/JP7189672B2/ja
Priority to US16/380,166 priority patent/US10784177B2/en
Publication of JP2019192667A publication Critical patent/JP2019192667A/ja
Publication of JP2019192667A5 publication Critical patent/JP2019192667A5/ja
Application granted granted Critical
Publication of JP7189672B2 publication Critical patent/JP7189672B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018079689A 2018-04-18 2018-04-18 半導体装置及びその製造方法 Active JP7189672B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018079689A JP7189672B2 (ja) 2018-04-18 2018-04-18 半導体装置及びその製造方法
US16/380,166 US10784177B2 (en) 2018-04-18 2019-04-10 Semiconductor device with encapsulating resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018079689A JP7189672B2 (ja) 2018-04-18 2018-04-18 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2019192667A JP2019192667A (ja) 2019-10-31
JP2019192667A5 true JP2019192667A5 (enExample) 2021-03-25
JP7189672B2 JP7189672B2 (ja) 2022-12-14

Family

ID=68238233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018079689A Active JP7189672B2 (ja) 2018-04-18 2018-04-18 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US10784177B2 (enExample)
JP (1) JP7189672B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US11101417B2 (en) * 2019-08-06 2021-08-24 X Display Company Technology Limited Structures and methods for electrically connecting printed components
US11316086B2 (en) 2020-07-10 2022-04-26 X Display Company Technology Limited Printed structures with electrical contact having reflowable polymer core

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS538566A (en) * 1976-07-12 1978-01-26 Citizen Watch Co Ltd Mounting structure of semiconductor ic circuit
EP0248566A3 (en) * 1986-05-30 1990-01-31 AT&T Corp. Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
KR100192766B1 (ko) * 1995-07-05 1999-06-15 황인길 솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조
TW434856B (en) * 2000-05-15 2001-05-16 Siliconware Precision Industries Co Ltd Manufacturing method for high coplanarity solder ball array of ball grid array integrated circuit package
JP3891838B2 (ja) * 2001-12-26 2007-03-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2003243818A (ja) 2002-02-15 2003-08-29 Denso Corp 半導体電子部品の実装方法
JP2006196728A (ja) * 2005-01-14 2006-07-27 Seiko Epson Corp 電子部品、電気光学装置、及び電子機器
JP2009049499A (ja) * 2007-08-14 2009-03-05 Fujifilm Corp 半導体チップの実装方法及び半導体装置
JP2009117767A (ja) * 2007-11-09 2009-05-28 Shinko Electric Ind Co Ltd 半導体装置の製造方法及びそれにより製造した半導体装置
JP5375708B2 (ja) * 2010-03-29 2013-12-25 パナソニック株式会社 半導体装置の製造方法
JP2010161425A (ja) 2010-04-26 2010-07-22 Panasonic Corp モジュールの製造方法と、その製造設備
JP2011243683A (ja) * 2010-05-17 2011-12-01 Fujitsu Ltd 電子部品の実装方法、電子部品の製造方法および電子部品、電子部品の製造装置
KR101712043B1 (ko) * 2010-10-14 2017-03-03 삼성전자주식회사 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법
US8367475B2 (en) * 2011-03-25 2013-02-05 Broadcom Corporation Chip scale package assembly in reconstitution panel process format
CN103959451B (zh) * 2012-01-17 2016-12-21 松下知识产权经营株式会社 半导体装置制造方法以及半导体装置
US9343419B2 (en) * 2012-12-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
US9070644B2 (en) * 2013-03-15 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
US8970051B2 (en) * 2013-06-28 2015-03-03 Intel Corporation Solution to deal with die warpage during 3D die-to-die stacking
JP6303373B2 (ja) 2013-10-02 2018-04-04 住友ベークライト株式会社 圧縮成形用モールドアンダーフィル材料、半導体パッケージ、構造体および半導体パッケージの製造方法
KR20160004065A (ko) * 2014-07-02 2016-01-12 삼성전자주식회사 반도체 패키지 및 이의 제조방법
JP2016063013A (ja) * 2014-09-17 2016-04-25 株式会社東芝 半導体装置
CN106206633A (zh) * 2015-05-28 2016-12-07 精材科技股份有限公司 影像感测装置

Similar Documents

Publication Publication Date Title
JP6305302B2 (ja) 半導体装置およびその製造方法
JP2014127706A5 (ja) 半導体装置の製造方法
JP6127293B2 (ja) リードフレーム、半導体装置及びその製造方法
WO2012157584A1 (ja) 半導体装置とその製造方法
CN106663639B (zh) 半导体装置
JP2009141169A5 (enExample)
JP2015115419A5 (enExample)
JP2012099352A5 (enExample)
JP2018125349A5 (enExample)
JP2018160653A5 (enExample)
JP2019192667A5 (enExample)
JP2020096018A5 (enExample)
TWM517910U (zh) 晶片封裝結構
JP4058637B2 (ja) 半導体チップ、半導体装置、回路基板及び電子機器
JP6080305B2 (ja) 半導体装置の製造方法、半導体装置及びリードフレーム
JP2017028155A5 (enExample)
CN109314087B (zh) 电子模块、连接体的制造方法以及电子模块的制造方法
JP2018085487A5 (enExample)
JP2008252058A5 (enExample)
JP5849935B2 (ja) 半導体装置及び半導体装置の製造方法
TWI545670B (zh) 影像感測器封裝用之壓頭
JP5674537B2 (ja) 電気部品モジュール
JP2008109429A5 (enExample)
JP2007324506A5 (enExample)
JP2001250843A (ja) 半導体素子及び半導体素子製造方法