JP7189672B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP7189672B2
JP7189672B2 JP2018079689A JP2018079689A JP7189672B2 JP 7189672 B2 JP7189672 B2 JP 7189672B2 JP 2018079689 A JP2018079689 A JP 2018079689A JP 2018079689 A JP2018079689 A JP 2018079689A JP 7189672 B2 JP7189672 B2 JP 7189672B2
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pads
semiconductor chip
bonding
circuit forming
semiconductor device
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JP2019192667A (ja
JP2019192667A5 (enExample
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聖二 佐藤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2018079689A priority Critical patent/JP7189672B2/ja
Priority to US16/380,166 priority patent/US10784177B2/en
Publication of JP2019192667A publication Critical patent/JP2019192667A/ja
Publication of JP2019192667A5 publication Critical patent/JP2019192667A5/ja
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2018079689A 2018-04-18 2018-04-18 半導体装置及びその製造方法 Active JP7189672B2 (ja)

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JP2018079689A JP7189672B2 (ja) 2018-04-18 2018-04-18 半導体装置及びその製造方法
US16/380,166 US10784177B2 (en) 2018-04-18 2019-04-10 Semiconductor device with encapsulating resin

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JP2019192667A5 JP2019192667A5 (enExample) 2021-03-25
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US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US11101417B2 (en) * 2019-08-06 2021-08-24 X Display Company Technology Limited Structures and methods for electrically connecting printed components
US11316086B2 (en) 2020-07-10 2022-04-26 X Display Company Technology Limited Printed structures with electrical contact having reflowable polymer core

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243818A (ja) 2002-02-15 2003-08-29 Denso Corp 半導体電子部品の実装方法
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