JP2020096018A5 - - Google Patents

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Publication number
JP2020096018A5
JP2020096018A5 JP2018231106A JP2018231106A JP2020096018A5 JP 2020096018 A5 JP2020096018 A5 JP 2020096018A5 JP 2018231106 A JP2018231106 A JP 2018231106A JP 2018231106 A JP2018231106 A JP 2018231106A JP 2020096018 A5 JP2020096018 A5 JP 2020096018A5
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JP
Japan
Prior art keywords
substrate
semiconductor chip
semiconductor package
back surface
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018231106A
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English (en)
Japanese (ja)
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JP2020096018A (ja
JP7163162B2 (ja
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Priority to JP2018231106A priority Critical patent/JP7163162B2/ja
Priority claimed from JP2018231106A external-priority patent/JP7163162B2/ja
Priority to US16/699,265 priority patent/US11705400B2/en
Priority to CN201911242024.7A priority patent/CN111293101B/zh
Publication of JP2020096018A publication Critical patent/JP2020096018A/ja
Publication of JP2020096018A5 publication Critical patent/JP2020096018A5/ja
Application granted granted Critical
Publication of JP7163162B2 publication Critical patent/JP7163162B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018231106A 2018-12-10 2018-12-10 半導体パッケージ Active JP7163162B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018231106A JP7163162B2 (ja) 2018-12-10 2018-12-10 半導体パッケージ
US16/699,265 US11705400B2 (en) 2018-12-10 2019-11-29 Semiconductor package
CN201911242024.7A CN111293101B (zh) 2018-12-10 2019-12-06 半导体封装

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018231106A JP7163162B2 (ja) 2018-12-10 2018-12-10 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2020096018A JP2020096018A (ja) 2020-06-18
JP2020096018A5 true JP2020096018A5 (enExample) 2021-12-16
JP7163162B2 JP7163162B2 (ja) 2022-10-31

Family

ID=70971162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018231106A Active JP7163162B2 (ja) 2018-12-10 2018-12-10 半導体パッケージ

Country Status (3)

Country Link
US (1) US11705400B2 (enExample)
JP (1) JP7163162B2 (enExample)
CN (1) CN111293101B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11094625B2 (en) * 2019-01-02 2021-08-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package with improved interposer structure
US20230187367A1 (en) * 2021-12-10 2023-06-15 Advanced Semiconductor Engineering, Inc. Electronic package structure and method for manufacturing the same
JP7740628B2 (ja) 2021-12-20 2025-09-17 新光電気工業株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
JP2023125723A (ja) * 2022-02-28 2023-09-07 新光電気工業株式会社 電子部品内蔵基板及びその製造方法
CN115151060A (zh) * 2022-07-27 2022-10-04 无锡豪帮高科股份有限公司 一种液晶面板驱动用传感器的叠板工艺

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW423081B (en) * 1998-01-19 2001-02-21 Citizen Watch Co Ltd Semiconductor package
JP4625260B2 (ja) * 2004-02-04 2011-02-02 株式会社日立メディアエレクトロニクス 薄膜バルク共振子の製造方法
JPWO2007069606A1 (ja) 2005-12-14 2009-05-21 新光電気工業株式会社 チップ内蔵基板の製造方法
JP5481724B2 (ja) * 2009-12-24 2014-04-23 新光電気工業株式会社 半導体素子内蔵基板
US8304296B2 (en) * 2010-06-23 2012-11-06 Stats Chippac Ltd. Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof
JP6076653B2 (ja) * 2012-08-29 2017-02-08 新光電気工業株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
KR102245770B1 (ko) * 2013-10-29 2021-04-28 삼성전자주식회사 반도체 패키지 장치
US9947642B2 (en) * 2015-10-02 2018-04-17 Qualcomm Incorporated Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages
US10229859B2 (en) * 2016-08-17 2019-03-12 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US10622340B2 (en) * 2016-11-21 2020-04-14 Samsung Electronics Co., Ltd. Semiconductor package
KR102427557B1 (ko) * 2017-09-29 2022-08-01 삼성전자주식회사 반도체 패키지
JP6917295B2 (ja) * 2017-12-25 2021-08-11 新光電気工業株式会社 電子部品内蔵基板、シート基板
KR102448248B1 (ko) * 2018-05-24 2022-09-27 삼성전자주식회사 Pop형 반도체 패키지 및 그 제조 방법
US11075151B2 (en) * 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out package with controllable standoff
KR102573760B1 (ko) * 2018-08-01 2023-09-04 삼성전자주식회사 반도체 패키지
US10825774B2 (en) * 2018-08-01 2020-11-03 Samsung Electronics Co., Ltd. Semiconductor package

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