JP2018508030A5 - - Google Patents

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JP2018508030A5
JP2018508030A5 JP2017541384A JP2017541384A JP2018508030A5 JP 2018508030 A5 JP2018508030 A5 JP 2018508030A5 JP 2017541384 A JP2017541384 A JP 2017541384A JP 2017541384 A JP2017541384 A JP 2017541384A JP 2018508030 A5 JP2018508030 A5 JP 2018508030A5
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Japan
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adhesive
label assembly
face
stage
article
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JP2017541384A
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JP2018508030A (ja
JP6537620B2 (ja
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Priority claimed from PCT/US2016/016774 external-priority patent/WO2016127056A1/en
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Publication of JP2018508030A5 publication Critical patent/JP2018508030A5/ja
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JP2017541384A 2015-02-05 2016-02-05 苛酷な環境のためのラベルアセンブリー Active JP6537620B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562112216P 2015-02-05 2015-02-05
US62/112,216 2015-02-05
PCT/US2016/016774 WO2016127056A1 (en) 2015-02-05 2016-02-05 Label assemblies for adverse environments

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019072211A Division JP6789343B2 (ja) 2015-02-05 2019-04-04 苛酷な環境のためのラベルアセンブリー

Publications (3)

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JP2018508030A JP2018508030A (ja) 2018-03-22
JP2018508030A5 true JP2018508030A5 (enExample) 2019-01-17
JP6537620B2 JP6537620B2 (ja) 2019-07-03

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JP2017541384A Active JP6537620B2 (ja) 2015-02-05 2016-02-05 苛酷な環境のためのラベルアセンブリー
JP2019072211A Active JP6789343B2 (ja) 2015-02-05 2019-04-04 苛酷な環境のためのラベルアセンブリー

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JP2019072211A Active JP6789343B2 (ja) 2015-02-05 2019-04-04 苛酷な環境のためのラベルアセンブリー

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US (2) US11049421B2 (enExample)
EP (1) EP3253837B1 (enExample)
JP (2) JP6537620B2 (enExample)
KR (1) KR101996828B1 (enExample)
CN (1) CN107207924B (enExample)
AU (1) AU2016215123B2 (enExample)
BR (1) BR112017016860A2 (enExample)
CA (1) CA2975298C (enExample)
ES (1) ES2992760T3 (enExample)
MX (1) MX2017010047A (enExample)
RU (1) RU2677155C1 (enExample)
WO (1) WO2016127056A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014059058A1 (en) 2012-10-09 2014-04-17 Avery Dennison Corporation Adhesives and related methods
US9458358B2 (en) * 2014-01-08 2016-10-04 Avery Dennison Corporation Article, compositions, systems, and methods using selectively detackified adhesives
JP6537620B2 (ja) * 2015-02-05 2019-07-03 アベリー・デニソン・コーポレイションＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 苛酷な環境のためのラベルアセンブリー
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
MX2019011578A (es) * 2017-05-08 2019-12-19 Avery Dennison Corp Etiqueta de neumatico de vulcanizacion.
EP3879459A1 (en) 2017-08-29 2021-09-15 Hill-Rom Services, Inc. Rfid tag inlay for incontinence detection pad
WO2020260765A1 (en) * 2019-06-28 2020-12-30 Upm Raflatac Oy Density adjustable label
CN114269872B (zh) * 2019-08-20 2023-12-29 3M创新有限公司 包括混合溶剂屏障和底漆层的膜
US20220332150A1 (en) * 2019-10-04 2022-10-20 Pirelli Tyre S.P.A. A label for a tyre of vehicle wheels, a process for manufacturing said label and a process for manufacturing a tyre including said label
WO2021064517A1 (en) * 2019-10-04 2021-04-08 Pirelli Tyre S.P.A. A label for a tyre of vehicle wheels, a process for manufacturing said label and a process for manufacturing a tyre including said label
CN110746836B (zh) * 2019-11-06 2022-02-01 焦作卓立膜材料有限责任公司 一种耐高温蒸汽的热转印离型剂及其制备方法
US20250166760A1 (en) * 2023-11-17 2025-05-22 Lauren Crafton Information Tag and Emergency Medical Wristband

Family Cites Families (216)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2884126A (en) * 1955-11-18 1959-04-28 Minnesota Mining & Mfg Pressure-sensitive adhesive sheet material
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (de) 1967-02-22 1969-11-15 Breveteam Sa Kleber zur unterseitigen Beschichtung von Bodenbelägen
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (de) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4185050A (en) * 1978-12-26 1980-01-22 Celanese Corporation Pressure sensitive adhesive compositions comprising a mixture of terpolymers
CA1154287A (en) 1979-02-26 1983-09-27 Joseph E. Gervay Dry-developing photosensitive dry film resist
US4288527A (en) 1980-08-13 1981-09-08 W. R. Grace & Co. Dual UV/thermally curable acrylate compositions with pinacol
JPS58152074A (ja) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc 陶磁器質タイル用接着剤組成物
US4507429A (en) * 1984-01-12 1985-03-26 Air Products And Chemicals, Inc. Pressure sensitive adhesives with improved shear resistance
EP0210261B1 (en) 1985-02-05 1991-06-26 Avery International Corporation Composite facestocks and liners
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
FI915319A0 (fi) 1989-05-11 1991-11-11 Landec Lab Inc Temperaturaktiverade limkompositioner.
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) * 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (de) 1990-07-07 1992-01-09 Bayer Ag Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
JP3035565B2 (ja) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 薄膜太陽電池の作製方法
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
NZ247073A (en) * 1992-08-26 1994-12-22 Lintec Corp Pressure sensitive adhesive label sheet with label film being polyethylene resin of a density of .925-.95 g/cc
CA2077103C (en) * 1992-08-28 2003-06-10 Moore U.S.A. Inc. Multipurpose label construction
WO1994008781A1 (en) * 1992-10-20 1994-04-28 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (id) 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
ATE228554T1 (de) 1996-07-22 2002-12-15 Dow Chemical Co Heissschmelzklebstoffe
TW412560B (en) 1996-09-04 2000-11-21 Dow Chemical Co Compositions and adhesives comprising a substantially random interpolymer of at least one vinylidene and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer, and coextruded or laminated multilayer film and tape
ES2242235T3 (es) * 1996-09-27 2005-11-01 Avery Dennison Corporation Estructuras adhesivas sensibles a la presion preestratificadas.
EP0966503B2 (en) 1997-03-14 2008-01-09 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (de) 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
FI106470B (fi) 1998-03-09 2001-02-15 Neste Chemicals Oy Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
US6235850B1 (en) 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
TR200101608T2 (tr) 1998-12-11 2001-10-22 Henkel Kommanditgesellschaft Auf Aktien Yüksek katı madde içerikli silil uçlu polimerlerin dağılımları, üretimi ve kullanımı
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6503620B1 (en) * 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (ja) 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着剤組成物
DE60121965T2 (de) 2000-06-01 2006-11-30 Kraton Polymers Research B.V. Funktionalisierte blockcopolymere enthaltende zusammensetzungen, die mit aluminiumacetylacetonaten vernetzt sind
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (ja) 2001-03-27 2002-10-03 The Inctec Inc 活性エネルギー線硬化型感圧接着剤
US6686425B2 (en) * 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
EP1410109B1 (en) 2001-07-26 2011-10-26 Basf Se Photosensitive resin composition
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
CA2493296A1 (en) * 2002-07-19 2004-01-29 Avery Dennison Corporation Labeling method employing two-part curable adhesives
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
WO2004015019A1 (en) 2002-07-31 2004-02-19 Nexicor Llc Induction bondable high-pressure laminate
MXPA05001109A (es) 2002-07-31 2005-09-08 Surface Specialties Sa Adhesivos de acrilico sensibles a la presion.
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (de) 2003-05-21 2004-12-16 Tesa Ag Flammfeste und Hitze-aktivierbare Haftklebemassen
WO2004109786A1 (ja) 2003-06-06 2004-12-16 Hitachi Chemical Co., Ltd. 接着シート、ダイシングテープ一体型接着シート、及び半導体装置の製造方法
EP1867665A3 (en) 2003-06-09 2008-04-02 Mitsui Chemicals, Inc. Crosslinkable methacrylic resin composition and transparent member
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
JPWO2005042612A1 (ja) 2003-11-04 2007-04-05 綜研化学株式会社 重合性組成物及び（メタ）アクリル系熱伝導性シート
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
EA011898B1 (ru) * 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Этикетка для стеклянной бутылки и способ ее удаления
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
US20050215655A1 (en) * 2004-03-29 2005-09-29 Bilodeau Wayne L Anaerobic pressure sensitive adhesive
US7645829B2 (en) 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
KR20070049105A (ko) * 2004-10-22 2007-05-10 가부시키가이샤 사토 Ｒｆｉｄ 태그를 갖춘 라벨을 물품 상에 부착하는 방법
US20080280111A1 (en) * 2004-11-10 2008-11-13 Avery Dennison Corporation In-Mold Labels and Uses Thereof
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
JP5231987B2 (ja) 2005-03-17 2013-07-10 ダウ グローバル テクノロジーズ エルエルシー エチレン／α−オレフィン共重合体から製造される接着剤およびマーキング用組成物
EP1858937B1 (en) 2005-03-17 2019-09-25 Dow Global Technologies LLC Functionalized ethylene/(alpha) -olefin interpolymer compositions
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI353360B (en) 2005-04-07 2011-12-01 Nippon Catalytic Chem Ind Production process of polyacrylic acid (salt) wate
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (ja) 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
CN101223257B (zh) 2005-07-19 2011-06-29 陶氏康宁公司 压敏粘合剂及其制备方法
JP4711777B2 (ja) 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
US20100311920A1 (en) 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
US20070092733A1 (en) 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
ES2557155T3 (es) 2005-12-01 2016-01-22 Henkel Ag & Co. Kgaa Nuevo material formador de estructuras supramoleculares, proceso y usos
CN101000899A (zh) 2006-01-11 2007-07-18 南茂科技股份有限公司 晶片封装结构
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
JP2007286193A (ja) * 2006-04-13 2007-11-01 Brother Ind Ltd タグテープ及び無線タグラベル
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
JP5433416B2 (ja) 2006-08-08 2014-03-05 ワールド プラパティーズ、 インコーポレイテッド 回路材料、回路および多層回路積層板
JP2008060151A (ja) 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
US7776969B2 (en) 2006-12-04 2010-08-17 Bayer Materialscience Llc Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers
CA2671033C (en) 2006-12-07 2016-04-19 3M Innovative Properties Company Block copolymer blend adhesives with multiple tackifiers
TW200842174A (en) 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
KR100907982B1 (ko) 2006-12-27 2009-07-16 제일모직주식회사 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름
WO2008093398A1 (ja) 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
JP5089201B2 (ja) 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
AU2008228842B2 (en) 2007-03-21 2014-01-16 Avery Dennison Corporation Pressure sensitive adhesives
JP5419376B2 (ja) 2007-04-20 2014-02-19 日東電工株式会社 粘着シートの自動車塗膜面への接着方法
JP5038770B2 (ja) 2007-05-01 2012-10-03 日東電工株式会社 車両用塗膜面に対する粘着シートの接着方法
JP5118880B2 (ja) 2007-05-08 2013-01-16 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
US8334037B2 (en) 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
US8222339B2 (en) 2007-08-24 2012-07-17 Dow Global Technologies Llc Adhesives made from interpolymers of ethylene/alpha-olefins
KR100922684B1 (ko) 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
WO2009036784A1 (en) 2007-09-19 2009-03-26 Henkel Ag & Co. Kgaa Highly damping expandable material and devices
US20090142506A1 (en) 2007-11-29 2009-06-04 Bayer Material Science Llc Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
US20110067799A1 (en) 2008-04-30 2011-03-24 Tesa Se Adhesive tape
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
KR101082447B1 (ko) 2008-07-16 2011-11-11 주식회사 엘지화학 점착제 조성물, 편광판 및 액정표시장치
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
BRPI0917383A2 (pt) 2008-08-27 2015-11-17 Hitachi Chemical Co Ltd composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico
DE102008045802A1 (de) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
WO2010039623A2 (en) 2008-09-30 2010-04-08 Henkel Corporation Shear-and/or pressure-resistant microspheres
WO2010074135A1 (ja) 2008-12-26 2010-07-01 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
AT12321U1 (de) 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (ja) 2009-03-11 2013-09-18 日東電工株式会社 アクリル系粘着シート
EP2236534A1 (de) 2009-03-31 2010-10-06 Sika Technology AG Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat
JP5404174B2 (ja) 2009-05-14 2014-01-29 日東電工株式会社 熱剥離性感圧接着テープ又はシート
BRPI1010733A2 (pt) 2009-06-11 2016-03-15 Henkel Corp composição adesiva de fusão a quente termicamente reversível contendo compostos de dieno e dienófilo multifuncionais.
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
CN102498170B (zh) 2009-07-24 2015-12-16 波士胶公司 基于烯烃嵌段共聚物的热熔性粘合剂
CN102574596B (zh) * 2009-07-27 2015-07-22 艾利丹尼森公司 施加收缩标签的系统和方法
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
DE112010003180T5 (de) 2009-08-04 2012-07-26 3M Innovative Properties Company Haftklebstoff aus einem Gemisch von nicht-halogeniertemPolyisobutylen und thermoplastischem Elastomer
EP2479229A4 (en) 2009-09-16 2014-06-18 Nitto Denko Corp ACRYLIC ADHESIVE STRIP
US8916485B2 (en) 2009-09-24 2014-12-23 Avery Dennison Corporation Acrylic compositions adhering to low surface energy substrates
JP2011096988A (ja) 2009-11-02 2011-05-12 Keiwa Inc 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール
EP2695624A1 (en) 2009-12-16 2014-02-12 Avery Dennison Corporation Photovoltaic Backsheet
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
WO2011112447A2 (en) 2010-03-09 2011-09-15 3M Innovative Properties Company Heat activated optically clear adhesive for bonding display panels
WO2011119393A2 (en) 2010-03-26 2011-09-29 3M Innovative Properties Company Method of sterilization of wound dressings
JP2011231319A (ja) 2010-04-09 2011-11-17 Nitto Denko Corp 粘着性組成物およびアクリル系粘着テープ
JP5749052B2 (ja) 2010-04-12 2015-07-15 日東電工株式会社 硬化多層シートの製造方法及び硬化多層シート
US9074087B2 (en) 2010-05-11 2015-07-07 3M Innovative Properties Company Curable composition, pressure-sensitive adhesive, method of making the same, and adhesive articles
BR112012031670B8 (pt) 2010-06-14 2023-01-24 Avery Dennison Corp Método de fabricação de uma trama de estruturas condutoras
JP5432853B2 (ja) 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
US20130136874A1 (en) 2010-08-18 2013-05-30 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
KR101732344B1 (ko) 2010-08-26 2017-05-04 헨켈 아이피 앤드 홀딩 게엠베하 저온 적용 비정질 폴리-α-올레핀 접착제
WO2012026118A1 (ja) 2010-08-27 2012-03-01 日東電工株式会社 アクリル系粘着剤組成物、アクリル系粘着剤層およびアクリル系粘着テープ
DE102010035889B4 (de) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung
JP5854404B2 (ja) 2010-09-17 2016-02-09 昭和電工株式会社 光硬化性透明粘着シート用組成物
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
JP2014500360A (ja) 2010-11-23 2014-01-09 アドヒーシブズ・リサーチ・インコーポレーテッド 反応性導電性感圧接着テープ
US9208911B2 (en) 2010-11-23 2015-12-08 Westinghouse Electric Company Llc Full spectrum LOCA evaluation model and analysis methodology
WO2012082448A1 (en) 2010-12-13 2012-06-21 3M Innovative Properties Company Pressure sensitive adhesives for low surface energy substrates
WO2012088384A1 (en) 2010-12-22 2012-06-28 Bostik Inc. Olefin block copolymer based packaging adhesive
JP5689336B2 (ja) 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP2012193317A (ja) 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
WO2012129489A2 (en) 2011-03-24 2012-09-27 Henkel Corporation Stretch film lamination adhesive
BR112013025928B1 (pt) 2011-04-08 2021-02-09 Bostik, Inc. composição de adesivo termofundível
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
US9000659B2 (en) 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
KR101956939B1 (ko) 2011-05-10 2019-03-11 데쿠세리아루즈 가부시키가이샤 양면 점착 테이프 및 그의 제조 방법
PL2545798T3 (pl) 2011-07-13 2018-07-31 3M Innovative Properties Company System wyrobów higienicznych
US20130017389A1 (en) 2011-07-15 2013-01-17 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
CN103814095B (zh) 2011-11-08 2016-08-17 Lg化学株式会社 用于具有抗静电性的保护膜的压敏粘合剂组合物及其制备方法
DE102011088170A1 (de) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reaktive Haftklebstoffe
US20140335299A1 (en) 2011-12-22 2014-11-13 3M Innovative Properties Company Olefinic block copolymer based pressure sensitive adhesives
DE102012200854A1 (de) 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
EP2810539B1 (en) 2012-02-03 2018-03-28 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
TWI488930B (zh) 2012-03-12 2015-06-21 Lg Chemical Ltd 壓感性黏著組成物
JP5900091B2 (ja) 2012-03-27 2016-04-06 大日本印刷株式会社 化粧シート及びそれを有する化粧板
KR20200024337A (ko) 2012-03-30 2020-03-06 다우 글로벌 테크놀로지스 엘엘씨 폴리올레핀 접착제 조성물
CA2869108A1 (en) 2012-03-30 2013-10-03 Bioformix Inc. Methods for activating polymerizable compositions, polymerizable systems, and products formed thereby
CN102634286B (zh) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
CN104350121A (zh) 2012-05-29 2015-02-11 日东电工株式会社 粘合剂和使用所述粘合剂的透明基板
DE102012209116A1 (de) 2012-05-30 2013-12-05 Tesa Se Heißsiegelbares Klebeband
DE102013209827A1 (de) 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
JP5961055B2 (ja) 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
JP6252473B2 (ja) 2012-07-05 2017-12-27 株式会社スリーボンド シート状接着剤およびこれを用いた有機ｅｌパネル
EP2877883B1 (en) 2012-07-26 2017-08-23 3M Innovative Properties Company Heat de-bondable optical articles
CN104812859B (zh) 2012-07-26 2018-03-02 3M创新有限公司 可热脱粘的粘合剂制品
WO2014059058A1 (en) 2012-10-09 2014-04-17 Avery Dennison Corporation Adhesives and related methods
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
BR112015017383A2 (pt) 2013-01-24 2017-07-11 Henkel Ag & Co Kgaa composições de adesivo de fusão a quente espumável e uso das mesmas
ES2676694T3 (es) 2013-01-24 2018-07-24 Basf Se Productos adhesivos reactivos sensibles a la presión
CN105518093A (zh) * 2013-03-05 2016-04-20 艾利丹尼森公司 不同的双功能泡沫带
EP2978795B1 (en) 2013-03-28 2017-05-31 Dow Corning Corporation Organosiloxane compositions and coatings, manufactured articles, methods and uses
CN103275656B (zh) 2013-05-29 2015-07-08 北京化工大学 固化后具有结构胶性能的反应型压敏胶黏剂及其制备方法
CN105555892A (zh) 2013-09-23 2016-05-04 路博润先进材料公司 组合热熔粘合剂和压敏性粘合剂体系和由其制得的复合材料
AU2014324898B2 (en) 2013-09-25 2018-04-05 Bostik, Inc. Hot melt adhesive with functionalized metallocene catalyzed polyolefins
CN104870590A (zh) * 2013-10-10 2015-08-26 艾利丹尼森公司 胶黏剂和相关方法
CN106471083A (zh) 2014-06-18 2017-03-01 艾利丹尼森公司 可转变压敏胶粘剂、制品及相关方法
US10152672B2 (en) 2014-09-29 2018-12-11 Avery Dennison Corporation Tire tracking RFID label
JP6537620B2 (ja) * 2015-02-05 2019-07-03 アベリー・デニソン・コーポレイションＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 苛酷な環境のためのラベルアセンブリー
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers

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