JP2018506190A - 多層デバイスおよび多層デバイスを製造するための方法 - Google Patents
多層デバイスおよび多層デバイスを製造するための方法 Download PDFInfo
- Publication number
- JP2018506190A JP2018506190A JP2017544357A JP2017544357A JP2018506190A JP 2018506190 A JP2018506190 A JP 2018506190A JP 2017544357 A JP2017544357 A JP 2017544357A JP 2017544357 A JP2017544357 A JP 2017544357A JP 2018506190 A JP2018506190 A JP 2018506190A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer device
- metal pattern
- substrate
- ceramic
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
- H01C7/112—ZnO type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3241—Chromium oxides, chromates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3262—Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
- C04B2235/3265—Mn2O3
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3275—Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
- C04B2235/3277—Co3O4
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3279—Nickel oxides, nickalates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3289—Noble metal oxides
- C04B2235/3291—Silver oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3294—Antimony oxides, antimonates, antimonites or oxide forming salts thereof, indium antimonate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3298—Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3409—Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/408—Noble metals, e.g. palladium, platina or silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
Abstract
Description
−セラミック材を含む層(複数)と電極ペーストを含む層(複数)とを交互に上下に重ねて配設し、1つの積層体とするステップ。このセラミック材は、この電極ペーストの1つの材料でドーピングされており、具体的にはこの電極ペーストの金属の化合物でドーピングされている。好ましくはこのセラミック材は、この電極ペーストの材料を用いて0.1〜1mol%でドーピングされている。
−この積層体を焼結して、その間に内部電極(複数)が配設されたセラミック層(複数)とするステップ。
−上記のセラミック材の少なくとも1つの表面に1つの絶縁層をとりつけるステップであって、この絶縁層が上記の電極ペーストの1つの材料でドーピングされているステップ。さらにこの絶縁層は、上記のセラミック材の1つの材料でドーピングされていてよい。好ましくはこの絶縁層は、上記のセラミック材からの主ドーパントでドーピングされている。
−約95mol%のZnO、
−Sb2O3,Bi2O3を用いた、0.5〜5mol%の範囲でのドーピング、
−Co3O4,Mn2O3,SiO2,Cr2O3を用いた、0.05〜2mol%の範囲でのドーピング、
−B2O3,Al2O3,SiO2,およびNiOを用いた、0.1mol%の未満の濃度でのドーピング。
2 : 基体
3 : 内部電極
4 : パッシベーション/パッシベーション層
5 : 外部メタライジング部
6 : ビア
Claims (15)
- 1つのセラミック基体(2)および少なくとも1つの金属パターン(3,5,6)を備える多層デバイス(1)であって、
前記金属パターン(3,5,6)は共焼結されており、
前記基体(2)は、前記金属パターン(3,5,6)の1つの材料を用いたドーピングを含み、
前記基体(2)は、前記金属パターン(3,5,6)の1つの材料を用いて、焼結工程中の前記金属パターン(3,5,6)の材料の前記基体(2)への拡散が低減されるようにドーピングされている、
ことを特徴とする多層デバイス。 - 前記基体(2)は、前記金属パターン(3,5,6)の前記材料の化合物の0.1〜1mol%のドーピングを含むことを特徴とする、請求項1に記載の多層デバス。
- 請求項1または2に記載の多層デバイスにおいて、
前記金属パターン(3,5,6)は、少なくとも1つの内部電極(3)および/または少なくとも1つの外部メタライジング部(5)および/または少なくとも1つのビア(6)を備え、
前記金属パターン(3,5,6)は、セラミックの前記基体(2)の1つの材料を用いたドーピングを含む、
ことを特徴とする多層デバイス。 - 前記基体(2)は、酸化ビスマスまたは酸化プラセオジムを含むことを特徴とする、請求項1乃至3のいずれか1項に記載の多層デバイス。
- 前記基体(2)は、液相を用いて焼結されたセラミックであることを特徴とする、請求項1乃至4のいずれか1項に記載の多層デバイス。
- 前記金属パターン(3,5,6)の厚さおよび横方向の大きさは、1.5μm以下となっていることを特徴とする、請求項1乃至5のいずれか1項に記載の多層デバイス。
- 前記金属パターン(3,5,6)は銀を含むことを特徴とする、請求項1乃至6のいずれか1項に記載の多層デバイス。
- 請求項1乃至7のいずれか1項に記載の多層デバイスにおいて、
前記基体(2)は、1つのバリスタセラミックであり、
前記ドーピングは酸化銀または炭酸銀を含む、
ことを特徴とする多層デバイス。 - 前記金属パターン(3,5,6)はパラジウムを含むことを特徴とする、請求項1乃至6のいずれか1項に記載の多層デバイス。
- 請求項1乃至7のいずれか1項に記載の多層デバイスにおいて、
前記基体(2)は、1つのバリスタセラミックであり、
前記ドーピングはパラジウム化合物を含む、
ことを特徴とする多層デバイス。 - 請求項1乃至10のいずれか1項に記載の多層デバイスにおいて、
前記多層デバイスは少なくとも1つのパッシベーション層(4)を備え、
前記パッシベーション層(4)は、共焼結されており、
前記パッシベーション層(4)の材料は、充填材を有するガラスまたは1つのセラミックを含み、
前記材料は、焼結の前に前記基体(2)上に取り付けられている、
ことを特徴とする多層デバイス。 - 請求項11に記載の多層デバイスにおいて、
前記パッシベーション層(4)は、前記金属パターン(3,5,6)の材料を用いてドーピングされており、
前記ドーピングは、前記パッシベーション層(4)における前記材料の飽和濃度以上である、
ことを特徴とする多層デバイス。 - 多層デバイス(1)を製造するための方法であって、
セラミック材を含む複数の層と電極ペーストを含む複数の層とを交互に上下に重ねて配設し、1つの積層体とするステップであって、当該セラミック材は、当該電極ペーストの1つの材料でドーピングされており、当該セラミック材は、当該電極ペーストの当該材料を用いて0.1〜1mol%でドーピングされているステップと、
前記積層体を焼結して、その間に複数の内部電極が配設された複数のセラミック層とするステップと、
を備えることを特徴とする方法。 - 請求項13に記載の方法において、
前記電極ペーストは銀を含み、
前記電極ペーストは、前記セラミック材の1つの材料を用いてドーピングされており、
前記セラミック材は、酸化銀または炭酸銀を用いてドーピングされている、
ことを特徴とする方法。 - 請求項13または14に記載の方法において、
前記方法はさらに、
前記セラミック材の少なくとも1つの表面に1つの絶縁層をとりつけるステップであって、当該絶縁層が前記電極ペーストの1つの材料および前記セラミック材の1つの材料を用いてドーピングされているステップ、
を備え、
前記絶縁層は、焼結の前に取り付けられる、
ことを特徴とする方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015120640.4 | 2015-11-27 | ||
DE102015120640.4A DE102015120640A1 (de) | 2015-11-27 | 2015-11-27 | Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements |
PCT/EP2016/076726 WO2017089095A1 (de) | 2015-11-27 | 2016-11-04 | Keramisches vielschichtbauelement und verfahren zur herstellung eines keramischen vielschichtbauelements |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018234077A Division JP6751131B2 (ja) | 2015-11-27 | 2018-12-14 | 多層デバイスおよび多層デバイスを製造するための方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018506190A true JP2018506190A (ja) | 2018-03-01 |
JP6708655B2 JP6708655B2 (ja) | 2020-06-10 |
Family
ID=57241089
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017544357A Active JP6708655B2 (ja) | 2015-11-27 | 2016-11-04 | 多層デバイスおよび多層デバイスを製造するための方法 |
JP2018234077A Active JP6751131B2 (ja) | 2015-11-27 | 2018-12-14 | 多層デバイスおよび多層デバイスを製造するための方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018234077A Active JP6751131B2 (ja) | 2015-11-27 | 2018-12-14 | 多層デバイスおよび多層デバイスを製造するための方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10262778B2 (ja) |
EP (1) | EP3238218B1 (ja) |
JP (2) | JP6708655B2 (ja) |
KR (2) | KR102038758B1 (ja) |
CN (2) | CN110010320A (ja) |
DE (1) | DE102015120640A1 (ja) |
WO (1) | WO2017089095A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019062227A (ja) * | 2015-11-27 | 2019-04-18 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | 多層デバイスおよび多層デバイスを製造するための方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013108753A1 (de) * | 2013-08-13 | 2015-02-19 | Epcos Ag | Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung |
CN112424887B (zh) | 2018-07-18 | 2022-11-22 | 京瓷Avx元器件公司 | 变阻器钝化层及其制造方法 |
KR102139772B1 (ko) * | 2018-11-27 | 2020-07-31 | 삼성전기주식회사 | 바리스터 및 바리스터 제조 방법 |
US10969684B2 (en) * | 2019-04-03 | 2021-04-06 | General Electric Company | Protection and enhancement of thermal barrier coating by lithography |
US10948820B2 (en) | 2019-04-03 | 2021-03-16 | General Electric Company | Protection and enhancement of thermal barrier coating integrity by lithography |
DE102022114552A1 (de) | 2022-06-09 | 2023-12-14 | Tdk Electronics Ag | Verfahren zur Herstellung eines Vielschicht-Varistors |
DE102022121865A1 (de) * | 2022-08-30 | 2024-02-29 | Tdk Electronics Ag | Monolithisches Funktionskeramikelement und Verfahren zur Herstellung einer Kontaktierung für eine Funktionskeramik |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163433A (ja) * | 1997-11-27 | 1999-06-18 | Hitachi Metals Ltd | 積層型圧電セラミックス振動子および製造方法 |
JPH11297507A (ja) * | 1998-04-09 | 1999-10-29 | Matsushita Electric Ind Co Ltd | バリスタとその製造方法 |
JP2001035741A (ja) * | 1999-07-22 | 2001-02-09 | Tdk Corp | 電子部品の製造方法 |
DE10132798C1 (de) * | 2001-07-06 | 2003-01-16 | Epcos Ag | Keramikmaterial, keramisches Vielschichtbauelement und Verfahren zur Herstellung des Bauelements |
JP2004172466A (ja) * | 2002-11-21 | 2004-06-17 | Murata Mfg Co Ltd | 電子部品 |
JP2010027804A (ja) * | 2008-07-17 | 2010-02-04 | Tdk Corp | 積層チップバリスタおよびその製造方法 |
JP2010238882A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | バリスタ材料、バリスタ素体及び複合積層型電子部品 |
WO2014206650A1 (de) * | 2013-06-28 | 2014-12-31 | Epcos Ag | Verfahren zur herstellung eines vielschicht-varistorbauelements und vielschicht-varistorbauelement |
JP2015171964A (ja) * | 2014-03-11 | 2015-10-01 | 国立大学法人名古屋大学 | 圧電セラミックス |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU524277B2 (en) * | 1979-11-27 | 1982-09-09 | Matsushita Electric Industrial Co., Ltd. | Sintered oxides voltage dependent resistor |
US4495482A (en) * | 1981-08-24 | 1985-01-22 | General Electric Company | Metal oxide varistor with controllable breakdown voltage and capacitance and method of making |
CA1206742A (en) | 1982-12-24 | 1986-07-02 | Hideyuki Kanai | Varistor |
EP0189087B1 (de) | 1985-01-17 | 1988-06-22 | Siemens Aktiengesellschaft | Spannungsabhängiger elektrischer Widerstand (Varistor) |
JPS6281005A (ja) * | 1985-10-03 | 1987-04-14 | 松下電器産業株式会社 | バリスタの製造方法 |
US4959262A (en) | 1988-08-31 | 1990-09-25 | General Electric Company | Zinc oxide varistor structure |
JP2933881B2 (ja) * | 1995-09-07 | 1999-08-16 | 三菱電機株式会社 | 電圧非直線抵抗体及びその製造方法及びその電圧非直線抵抗体を塔載した避雷器 |
US5807510A (en) * | 1995-09-07 | 1998-09-15 | Mitsubishi Denki Kabushiki Kaisha | Electric resistance element exhibiting voltage nonlinearity characteristic and method of manufacturing the same |
JPH1070012A (ja) * | 1996-06-03 | 1998-03-10 | Matsushita Electric Ind Co Ltd | バリスタの製造方法 |
JP3506056B2 (ja) | 1999-08-09 | 2004-03-15 | 株式会社村田製作所 | 正の抵抗温度特性を有する積層型半導体セラミック素子、および正の抵抗温度特性を有する積層型半導体セラミック素子の製造方法 |
DE10023360A1 (de) | 2000-05-12 | 2001-11-29 | Epcos Ag | Kondensator und Verfahren zu dessen Herstellung |
DE10026258B4 (de) * | 2000-05-26 | 2004-03-25 | Epcos Ag | Keramisches Material, keramisches Bauelement mit dem keramischen Material und Verwendung des keramischen Bauelements |
DE10110680A1 (de) * | 2001-03-06 | 2002-10-02 | Epcos Ag | Elektrisches Bauelement |
CN100514511C (zh) * | 2001-11-29 | 2009-07-15 | 株式会社东芝 | 电压非线性电阻及其制造方法 |
DE10201641A1 (de) * | 2002-01-17 | 2003-08-07 | Epcos Ag | Piezoelektrisches Bauelement und Verfahren zu dessen Herstellung |
US7167352B2 (en) | 2004-06-10 | 2007-01-23 | Tdk Corporation | Multilayer chip varistor |
JP4645594B2 (ja) * | 2004-07-06 | 2011-03-09 | 株式会社村田製作所 | 導電性ペースト及びそれを用いたセラミック電子部品 |
DE102005016590A1 (de) * | 2005-04-11 | 2006-10-26 | Epcos Ag | Elektrisches Mehrschicht-Bauelement und Verfahren zur Herstellung eines Mehrschicht-Bauelements |
DE102005028498B4 (de) * | 2005-06-20 | 2015-01-22 | Epcos Ag | Elektrisches Vielschichtbauelement |
CN100520990C (zh) * | 2005-11-10 | 2009-07-29 | 河南金冠王码信息产业股份有限公司 | 一种多层片式ZnO压敏电阻器 |
JP4710654B2 (ja) | 2006-03-02 | 2011-06-29 | Tdk株式会社 | 積層型チップバリスタの製造方法 |
JP4710560B2 (ja) | 2005-11-15 | 2011-06-29 | Tdk株式会社 | 積層型チップバリスタの製造方法 |
DE102006024231B4 (de) * | 2006-05-23 | 2010-01-28 | Epcos Ag | Keramisches Material, gesinterte Keramik, Verfahren zur Herstellung und Verwendung der Keramik |
CN100481279C (zh) * | 2006-08-08 | 2009-04-22 | 深圳顺络电子股份有限公司 | 多层片式压敏电阻及其制造方法 |
US7724124B2 (en) | 2007-02-12 | 2010-05-25 | Sfi Electronics Technology Inc. | Ceramic material used for protection against electrical overstress and low-capacitance multilayer chip varistor using the same |
DE102007020783A1 (de) * | 2007-05-03 | 2008-11-06 | Epcos Ag | Elektrisches Vielschichtbauelement |
DE102007031510A1 (de) * | 2007-07-06 | 2009-01-08 | Epcos Ag | Elektrisches Vielschichtbauelement |
TWI402864B (zh) | 2008-07-11 | 2013-07-21 | Sfi Electronics Technology Inc | 一種氧化鋅變阻器的製法 |
DE102009014542B3 (de) | 2009-02-12 | 2010-12-02 | Epcos Ag | Mehrschichtbauelement und Verfahren zur Herstellung |
CN101630553B (zh) | 2009-07-17 | 2011-10-12 | 立昌先进科技股份有限公司 | 一种氧化锌变阻器的制备方法 |
TW201221501A (en) * | 2010-11-26 | 2012-06-01 | Sfi Electronics Technology Inc | Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature |
KR101228752B1 (ko) * | 2011-11-04 | 2013-01-31 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
DE102015120640A1 (de) * | 2015-11-27 | 2017-06-01 | Epcos Ag | Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements |
-
2015
- 2015-11-27 DE DE102015120640.4A patent/DE102015120640A1/de active Pending
-
2016
- 2016-11-04 CN CN201910307494.0A patent/CN110010320A/zh active Pending
- 2016-11-04 EP EP16791392.0A patent/EP3238218B1/de active Active
- 2016-11-04 CN CN201680010158.4A patent/CN107210102B/zh active Active
- 2016-11-04 JP JP2017544357A patent/JP6708655B2/ja active Active
- 2016-11-04 KR KR1020177021298A patent/KR102038758B1/ko active IP Right Grant
- 2016-11-04 US US15/548,338 patent/US10262778B2/en active Active
- 2016-11-04 KR KR1020197031123A patent/KR102285241B1/ko active IP Right Grant
- 2016-11-04 WO PCT/EP2016/076726 patent/WO2017089095A1/de active Application Filing
-
2018
- 2018-12-14 JP JP2018234077A patent/JP6751131B2/ja active Active
-
2019
- 2019-03-15 US US16/355,307 patent/US10566115B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163433A (ja) * | 1997-11-27 | 1999-06-18 | Hitachi Metals Ltd | 積層型圧電セラミックス振動子および製造方法 |
JPH11297507A (ja) * | 1998-04-09 | 1999-10-29 | Matsushita Electric Ind Co Ltd | バリスタとその製造方法 |
JP2001035741A (ja) * | 1999-07-22 | 2001-02-09 | Tdk Corp | 電子部品の製造方法 |
DE10132798C1 (de) * | 2001-07-06 | 2003-01-16 | Epcos Ag | Keramikmaterial, keramisches Vielschichtbauelement und Verfahren zur Herstellung des Bauelements |
JP2004172466A (ja) * | 2002-11-21 | 2004-06-17 | Murata Mfg Co Ltd | 電子部品 |
JP2010027804A (ja) * | 2008-07-17 | 2010-02-04 | Tdk Corp | 積層チップバリスタおよびその製造方法 |
JP2010238882A (ja) * | 2009-03-31 | 2010-10-21 | Tdk Corp | バリスタ材料、バリスタ素体及び複合積層型電子部品 |
WO2014206650A1 (de) * | 2013-06-28 | 2014-12-31 | Epcos Ag | Verfahren zur herstellung eines vielschicht-varistorbauelements und vielschicht-varistorbauelement |
JP2015171964A (ja) * | 2014-03-11 | 2015-10-01 | 国立大学法人名古屋大学 | 圧電セラミックス |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019062227A (ja) * | 2015-11-27 | 2019-04-18 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | 多層デバイスおよび多層デバイスを製造するための方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3238218A1 (de) | 2017-11-01 |
DE102015120640A1 (de) | 2017-06-01 |
JP6751131B2 (ja) | 2020-09-02 |
KR20190122882A (ko) | 2019-10-30 |
US20170372820A1 (en) | 2017-12-28 |
US20190214168A1 (en) | 2019-07-11 |
WO2017089095A1 (de) | 2017-06-01 |
CN110010320A (zh) | 2019-07-12 |
EP3238218B1 (de) | 2019-03-13 |
CN107210102A (zh) | 2017-09-26 |
KR102038758B1 (ko) | 2019-10-30 |
KR20180078179A (ko) | 2018-07-09 |
JP6708655B2 (ja) | 2020-06-10 |
US10262778B2 (en) | 2019-04-16 |
US10566115B2 (en) | 2020-02-18 |
KR102285241B1 (ko) | 2021-08-05 |
CN107210102B (zh) | 2019-04-19 |
JP2019062227A (ja) | 2019-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6751131B2 (ja) | 多層デバイスおよび多層デバイスを製造するための方法 | |
JP6800830B2 (ja) | 積層セラミック電子部品 | |
TWI725264B (zh) | 積層陶瓷電容器及其製造方法 | |
JP2018139312A (ja) | 積層セラミックキャパシタ及びその製造方法 | |
KR102183425B1 (ko) | 적층 세라믹 전자부품 | |
KR101514607B1 (ko) | 적층 세라믹 커패시터 및 그 실장 기판 | |
TWI285381B (en) | Multilayer ceramic capacitor | |
KR102089692B1 (ko) | 적층 세라믹 전자 부품 | |
KR20170078317A (ko) | 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 제조방법 | |
US8508325B2 (en) | Chip varistor and chip varistor manufacturing method | |
US8525634B2 (en) | Chip varistor | |
KR101630034B1 (ko) | 내장형 적층 세라믹 커패시터 및 내장형 적층 세라믹 커패시터가 실장된 회로 기판 | |
US8471673B2 (en) | Varistor and method for manufacturing varistor | |
JPH11307391A (ja) | 電子部品用端子電極及び電子部品 | |
JP2004521510A (ja) | セラミックの多層デバイス及びその製造方法 | |
JP2020517116A (ja) | 多層デバイス及び多層デバイスを製造するための方法 | |
US11901100B2 (en) | Multilayer varistor and method for manufacturing a multilayer varistor | |
JP2008270391A (ja) | 積層型チップバリスタおよびその製造方法 | |
JP2019165103A (ja) | 積層バリスタ | |
KR20150134898A (ko) | 적층 세라믹 전자부품 및 이의 제조방법 | |
CN116387030A (zh) | 多层电子组件 | |
JP2006186039A (ja) | 積層型バリスタ | |
KR20150134899A (ko) | 적층 세라믹 전자부품 및 이의 제조방법 | |
KR20140128914A (ko) | 적층 세라믹 전자부품의 제조방법 | |
JP2009170836A (ja) | 積層型バリスタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170818 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170809 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20170818 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171211 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180207 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20180502 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180705 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180815 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181214 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190110 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190130 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20190222 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200317 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200521 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6708655 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |