JP2018113679A5 - - Google Patents
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- JP2018113679A5 JP2018113679A5 JP2017231535A JP2017231535A JP2018113679A5 JP 2018113679 A5 JP2018113679 A5 JP 2018113679A5 JP 2017231535 A JP2017231535 A JP 2017231535A JP 2017231535 A JP2017231535 A JP 2017231535A JP 2018113679 A5 JP2018113679 A5 JP 2018113679A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- side wall
- forming
- wafer
- stopper layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims 34
- 239000000758 substrate Substances 0.000 claims 28
- 229910052751 metal Inorganic materials 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 14
- 238000007789 sealing Methods 0.000 claims 14
- 230000002093 peripheral effect Effects 0.000 claims 9
- 238000005530 etching Methods 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 7
- 229910045601 alloy Inorganic materials 0.000 claims 7
- 238000009792 diffusion process Methods 0.000 claims 4
- 239000010408 film Substances 0.000 claims 4
- 239000007791 liquid phase Substances 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 238000009966 trimming Methods 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
Applications Claiming Priority (24)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662429223P | 2016-12-02 | 2016-12-02 | |
| US201662429186P | 2016-12-02 | 2016-12-02 | |
| US201662429183P | 2016-12-02 | 2016-12-02 | |
| US201662429188P | 2016-12-02 | 2016-12-02 | |
| US201662429218P | 2016-12-02 | 2016-12-02 | |
| US201662429190P | 2016-12-02 | 2016-12-02 | |
| US201662429179P | 2016-12-02 | 2016-12-02 | |
| US201662429226P | 2016-12-02 | 2016-12-02 | |
| US62/429,223 | 2016-12-02 | ||
| US62/429,190 | 2016-12-02 | ||
| US62/429,218 | 2016-12-02 | ||
| US62/429,226 | 2016-12-02 | ||
| US62/429,188 | 2016-12-02 | ||
| US62/429,179 | 2016-12-02 | ||
| US62/429,183 | 2016-12-02 | ||
| US62/429,186 | 2016-12-02 | ||
| US201762539871P | 2017-08-01 | 2017-08-01 | |
| US201762539863P | 2017-08-01 | 2017-08-01 | |
| US201762539873P | 2017-08-01 | 2017-08-01 | |
| US201762539861P | 2017-08-01 | 2017-08-01 | |
| US62/539,871 | 2017-08-01 | ||
| US62/539,861 | 2017-08-01 | ||
| US62/539,863 | 2017-08-01 | ||
| US62/539,873 | 2017-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018113679A JP2018113679A (ja) | 2018-07-19 |
| JP2018113679A5 true JP2018113679A5 (enExample) | 2021-01-14 |
Family
ID=62240167
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017231535A Pending JP2018113679A (ja) | 2016-12-02 | 2017-12-01 | 基板間のキャビティ内に形成されてビアを含む電子デバイスを製造する方法 |
| JP2017231525A Pending JP2018113678A (ja) | 2016-12-02 | 2017-12-01 | 基板間のキャビティ内に形成されてビアを含む電子デバイス |
| JP2017231513A Pending JP2018110381A (ja) | 2016-12-02 | 2017-12-01 | 製造中の水侵入を防止する電子デバイスの製造方法 |
| JP2017231501A Active JP7009186B2 (ja) | 2016-12-02 | 2017-12-01 | キャビティに形成される電子デバイスを製造する方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017231525A Pending JP2018113678A (ja) | 2016-12-02 | 2017-12-01 | 基板間のキャビティ内に形成されてビアを含む電子デバイス |
| JP2017231513A Pending JP2018110381A (ja) | 2016-12-02 | 2017-12-01 | 製造中の水侵入を防止する電子デバイスの製造方法 |
| JP2017231501A Active JP7009186B2 (ja) | 2016-12-02 | 2017-12-01 | キャビティに形成される電子デバイスを製造する方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (5) | US10439587B2 (enExample) |
| JP (4) | JP2018113679A (enExample) |
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| US10541152B2 (en) | 2014-07-31 | 2020-01-21 | Skyworks Solutions, Inc. | Transient liquid phase material bonding and sealing structures and methods of forming same |
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| KR20180134238A (ko) * | 2017-06-08 | 2018-12-18 | (주)와이솔 | 웨이퍼레벨패키지 및 제조방법 |
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-
2017
- 2017-12-01 US US15/828,625 patent/US10439587B2/en active Active
- 2017-12-01 JP JP2017231535A patent/JP2018113679A/ja active Pending
- 2017-12-01 US US15/828,631 patent/US10763820B2/en active Active
- 2017-12-01 US US15/828,637 patent/US10965269B2/en active Active
- 2017-12-01 US US15/828,616 patent/US20180159502A1/en not_active Abandoned
- 2017-12-01 JP JP2017231525A patent/JP2018113678A/ja active Pending
- 2017-12-01 JP JP2017231513A patent/JP2018110381A/ja active Pending
- 2017-12-01 JP JP2017231501A patent/JP7009186B2/ja active Active
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2019
- 2019-09-25 US US16/582,010 patent/US11050407B2/en active Active
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